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    • 21. 发明申请
    • Power savings in serial link transmitters
    • 串行链路发射机节电
    • US20050105507A1
    • 2005-05-19
    • US10697514
    • 2003-10-30
    • Steven ClementsCarrie CoxHayden Cranford
    • Steven ClementsCarrie CoxHayden Cranford
    • H03K17/16H03K19/00H04L25/02H04B1/26
    • H04L25/028H03K17/163H03K17/164
    • Aspects of saving power in a serial link transmitter are described. The aspects include providing a parallel arrangement of segments, each segment comprising prebuffer and output stage circuitry of the serial link transmitter and each segment enabled independently to achieve multiple power levels and multiple levels of pre-emphasis while maintaining a substantially constant propagation delay in a signal path of the serial link transmitter. Further aspects include providing a bypass path in the prebuffer stage circuitry to implement a controllable idle state in the segments and tail current and resistive load elements in the prebuffer circuitry as sectioned portions for slew rate control capability. Also included is provision of a control element with pre-emphasis delay circuitry in the transmitter signal path to allow inversion of a last delayed bit of the pre-emphasis delay circuitry to achieve a polarity change of a pre-emphasis weight.
    • 描述了在串行链路发射机中节省功率的方面。 这些方面包括提供段的并行布置,每个段包括串行链路发射机的预缓冲器和输出级电路,并且每个段独立地使能实现多个功率电平和多级预加重,同时保持信号中基本恒定的传播延迟 串行链路发射机的路径。 另外的方面包括在预缓冲器级电路中提供旁路路径,以实现段中的可控空闲状态,并将预缓冲器电路中的尾电流和电阻负载元件作为转换速率控制能力的切片部分。 还包括在发射机信号路径中提供具有预加重延迟电路的控制元件,以允许预加重延迟电路的最后延迟位的反转,以实现预加重权重的极性改变。
    • 23. 发明申请
    • STRUCTURE AND METHOD FOR PROVIDING PRECISION PASSIVE ELEMENTS
    • 提供精密无源元件的结构和方法
    • US20080018378A1
    • 2008-01-24
    • US11865432
    • 2007-10-01
    • Douglas CoolbaughHayden CranfordTerence HookAnthony Stamper
    • Douglas CoolbaughHayden CranfordTerence HookAnthony Stamper
    • H03H7/00
    • H01L27/0802H01L23/5256H01L2924/0002H01L2924/00
    • A circuit having a precision passive circuit element, such as a resistor or a capacitor, with a target value of an electrical parameter is fabricated on a substrate with a plurality of independent parallel-connected passive circuit elements. The plurality of passive circuit elements are designed to have a plurality of values of the electrical parameter which are spaced or offset at or around the target value of the electrical parameter, such as three circuit elements with one having a value at the target value, one having a value above the target value, and one having a value below the target value. Each passive circuit element also has a fuse in series therewith. A reference calibration structure is also fabricated, which can be a passive circuit element having the target value of the electrical parameter, in a reference area of the substrate under the same conditions and at the same time as fabrication of the plurality of passive circuit elements. The actual component value of the reference calibration structure is then measured, and based upon the measurement a single precision passive element of the plurality of parallel passive circuit elements is selected by blowing the fuses of, and thus deselecting, the other independent parallel connected passive circuit elements.
    • 在具有多个独立并联无源电路元件的基板上制造具有目标值为电参数的精密无源电路元件(例如电阻器或电容器)的电路。 多个无源电路元件被设计为具有电参数的多个值,其在电参数的目标值处或周围被间隔或偏移,例如具有值在目标值的三个电路元件,一个 具有高于目标值的值,并且具有低于目标值的值。 每个无源电路元件还具有与其串联的保险丝。 还可以在相同条件下的基板的参考区域中以及在制造多个无源电路元件的同时,制造参考校准结构,其可以是具有电参数的目标值的无源电路元件。 然后测量参考校准结构的实际分量值,并且基于测量,多个并联无源电路元件中的单精度无源元件通过吹入另一个独立并联无源电路的熔丝并因此取消选择来选择 元素。
    • 26. 发明申请
    • ON-CHIP ELECTROMIGRATION MONITORING SYSTEM
    • 片上电气监测系统
    • US20070164768A1
    • 2007-07-19
    • US11306985
    • 2006-01-18
    • Louis HsuHayden CranfordOleg GluschenkovJames MasonMichael SornaChih-Chao Yang
    • Louis HsuHayden CranfordOleg GluschenkovJames MasonMichael SornaChih-Chao Yang
    • G01R31/26
    • G01R31/2858G01R31/2884G01R31/318533
    • A packaged semiconductor chip is provided which includes a semiconductor chip and a package element. The semiconductor chip includes a plurality of semiconductor devices and a plurality of conductive features disposed at an exterior face of the semiconductor chip. The package element has a plurality of external features conductively connected to the plurality of conductive features of the semiconductor chip. The semiconductor chip includes a monitored element including a conductive interconnect that conductively interconnects a first node of the semiconductor chip to a second node of the semiconductor chip. A detection circuit in the semiconductor chip is operable to compare a variable voltage drop across the monitored element with a reference voltage drop across a reference element on the chip at a plurality of different times during a lifetime of the packaged semiconductor chip so as to detect when the resistance of the monitored element is over threshold.
    • 提供一种封装的半导体芯片,其包括半导体芯片和封装元件。 半导体芯片包括多个半导体器件和设置在半导体芯片的外表面处的多个导电特征。 封装元件具有导电连接到半导体芯片的多个导电特征的多个外部特征。 半导体芯片包括被监视的元件,该元件包括将半导体芯片的第一节点与半导体芯片的第二节点导电互连的导电互连。 半导体芯片中的检测电路可操作以在封装的半导体芯片的寿命期间的多个不同时间,将所监视的元件上的可变电压降与芯片上的参考元件上的参考电压降进行比较,以便检测何时 被监测元件的电阻超过阈值。