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21. 发明授权

US08355035B2 Digital gravure printing with a pixilated photoconductor 有权
标题翻译：带有像素化感光体的数字凹版印刷
公开(公告)号：US08355035B2
公开(公告)日：2013-01-15
申请号：US12697109
申请日：2010-01-29
申请人： Eugene M. Chow , JenPing Lu
发明人： Eugene M. Chow , JenPing Lu
IPC分类号： B41J2/385
CPC分类号： B41M1/10
摘要： A printing sub-system including same including a pixilated photoconductive member (such as a photobelt) is disclosed. Electrically isolated cells hold surface application material above the photoconductor. The surface application material is first charged. Charge on the surface application material in an individual cell may then be discharged by exposure of a region of the photoconductor proximate that cell to light from an optical addressing system. The surface application material is brought into proximity of an image receiving member such as paper, which is either charged or proximate a charge source. Charged surface application material in a cell may then be electrostatically transferred from the cell onto the image receiving member, while discharged surface application material remains in the cell. The subsystem may form a part of a complete printing system using many existing components. Among other advantages, viscous liquid surface application material may thereby be printed.
摘要翻译：公开了包括像素化感光体（例如光带）的包括其的印刷子系统。电隔离的电池在光电导体上方保持表面应用材料。首先对表面施用材料进行充电。然后可以通过将靠近该单元的光电导体的区域暴露于来自光寻址系统的光来对单个单元中的表面施加材料上的电荷进行放电。表面施加材料被带入诸如纸的图像接收构件，其被充电或靠近电荷源。然后可以将电池中的充电表面施用材料静电从细胞转移到图像接收部件上，同时放电的表面施用材料保留在电池中。子系统可以使用许多现有组件形成完整打印系统的一部分。除了其它优点之外，可以印刷粘性液体表面施加材料。

22. 发明授权

US08330485B2 Curved spring structure with downturned tip 有权
标题翻译：弯曲的弹簧结构与低头
公开(公告)号：US08330485B2
公开(公告)日：2012-12-11
申请号：US12845690
申请日：2010-07-28
申请人： Eugene M. Chow , Dirk DeBruyker
发明人： Eugene M. Chow , Dirk DeBruyker
IPC分类号： G01R31/02
CPC分类号： G01R3/00 , G01R1/06727 , G01R1/06744 , G01R1/06761
摘要： A curved spring structure includes a base (anchor) section extending parallel to a planar substrate surface, a cantilever section extending away from the substrate surface, and an optional elongated section extending from the base section along the substrate surface under the cantilevered section. The cantilever section includes a body portion integrally attached at a lower end to the anchor section and extending at an acute angle relative to the planar surface, and a curved portion integrally attached to an upper end of the body portion and including a downturned tip. A middle section of the curved portion is disposed a first distance away from the planar surface of the substrate, and the downturned tip is disposed a second distance away from the planar surface of the substrate, the first distance being greater than the second distance.
摘要翻译：弯曲的弹簧结构包括平行于平面衬底表面延伸的基部（锚）部分，远离衬底表面延伸的悬臂部分，以及从底部部分沿悬臂部分下方的衬底表面延伸的可选的细长部分。悬臂部分包括主体部分，其整体地附接到锚固部分的下端并相对于平坦表面以锐角延伸;以及弯曲部分，其整体地附接到主体部分的上端并且包括下降的尖端。弯曲部分的中间部分设置成离开基板的平面表面的第一距离，并且下端尖端设置成离开基板的平面表面第二距离，第一距离大于第二距离。

23. 发明授权

US08241509B2 Capillary-channel probes for liquid pickup, transportation and dispense using stressy metal 有权
标题翻译：用于采用压力金属的液体拾取，运输和分配的毛细管通道探头
公开(公告)号：US08241509B2
公开(公告)日：2012-08-14
申请号：US12428397
申请日：2009-04-22
申请人： Thomas Hantschel , David K. Fork , Eugene M. Chow , Dirk De Bruyker , Michel A. Rosa
发明人： Thomas Hantschel , David K. Fork , Eugene M. Chow , Dirk De Bruyker , Michel A. Rosa
IPC分类号： C40B50/18
CPC分类号： G01N35/1074 , B01J2219/00387 , B01L3/0244 , B01L3/0255 , B01L3/502715 , B01L2300/0819 , B01L2400/025 , B01L2400/0406 , B41J2/14314 , B41J2/16 , B41J2/1628 , B41J2/1629 , B41J2/1631 , B41J2/1632 , B41J2/1639 , B41J2/1643 , C40B60/14 , G01N35/1009 , G01N2035/00237 , G01N2035/1037 , G03F7/0002 , Y10T436/2575
摘要： Fluidic conduits, which can be used in microarraying systems, dip pen nanolithography systems, fluidic circuits, and microfluidic systems, are disclosed that use channel spring probes that include at least one capillary channel. Formed from spring beams (e.g., stressy metal beams) that curve away from the substrate when released, channels can either be integrated into the spring beams or formed on the spring beams. Capillary forces produced by the narrow channels allow liquid to be gathered, held, and dispensed by the channel spring probes. Because the channel spring beams can be produced using conventional semiconductor processes, significant design flexibility and cost efficiencies can be achieved.
摘要翻译：公开了可用于微阵列系统，浸笔纳米光刻系统，流体回路和微流体系统的流体导管，其使用包括至少一个毛细通道的通道弹簧探针。由释放时从基板弯曲的弹簧梁（例如，应力金属梁）形成，通道可以集成到弹簧梁中或形成在弹簧梁上。由窄通道产生的毛细管力允许液体被通道弹簧探针收集，保持和分配。由于可以使用传统的半导体工艺制造通道弹簧梁，所以可以实现显着的设计灵活性和成本效率。

24. 发明申请

US20120040283A1 IMAGING MEMBERS FOR INK-BASED DIGITAL PRINTING COMPRISING STRUCTURED ORGANIC FILMS 有权
标题翻译：用于包含结构有机膜的基于墨水的数字打印的成像成员
公开(公告)号：US20120040283A1
公开(公告)日：2012-02-16
申请号：US12854962
申请日：2010-08-12
申请人： Matthew A. Heuft , Eugene M. Chow , Adrien P. Côté , Nan-Xing Hu
发明人： Matthew A. Heuft , Eugene M. Chow , Adrien P. Côté , Nan-Xing Hu
IPC分类号： G03G15/00
CPC分类号： G03G15/10 , G03G5/0589 , G03G5/0592 , G03G5/0596 , G03G5/071 , G03G5/075 , G03G5/076 , G03G5/14786 , G03G5/14791 , G03G5/14795 , G03G15/75
摘要： An imaging member for ink-based digital printing having an outermost layer including a structured organic film (SOF) having a plurality of segments and a plurality of linkers arranged as a covalent organic framework, wherein the structured organic film may be multi-segment thick.
摘要翻译：一种用于油墨数字印刷的成像构件，其具有包括具有多个段的结构化有机膜（SOF）的最外层和布置为共价有机骨架的多个接头，其中所述结构化有机膜可以是多段厚度。

25. 发明申请

US20110318880A1 CONTACT SPRING APPLICATION TO SEMICONDUCTOR DEVICES 有权
标题翻译：接触弹簧应用于半导体器件
公开(公告)号：US20110318880A1
公开(公告)日：2011-12-29
申请号：US13162473
申请日：2011-06-16
申请人： Eugene M. Chow , Christopher L. Chua , Eric Peeters
发明人： Eugene M. Chow , Christopher L. Chua , Eric Peeters
IPC分类号： H01L21/56
CPC分类号： H01L24/11 , G01R1/06727 , G01R1/06761 , G01R3/00 , H01L21/568 , H01L21/6835 , H01L23/49811 , H01L24/12 , H01L24/742 , H01L24/81 , H01L2221/68368 , H01L2224/05023 , H01L2224/0508 , H01L2224/05568 , H01L2224/05573 , H01L2224/11003 , H01L2224/13099 , H01L2224/16 , H01L2224/81801 , H01L2924/01005 , H01L2924/01006 , H01L2924/01022 , H01L2924/01033 , H01L2924/01054 , H01L2924/01082 , H01L2924/14
摘要： A contact spring applicator is provided which includes an applicator substrate, a removable encapsulating layer and a plurality of contact springs embedded in the removable encapsulating layer. The contact springs are positioned such that a bond pad on each contact spring is adjacent to an upper surface of the removable encapsulating layer. The contact spring applicator may also include an applicator substrate, a release layer, a plurality of unreleased contact springs on the release layer and a bond pad at an anchor end of each contact spring. The contact spring applicators apply contact springs to an integrated circuit chip, die or package or to a probe card by aligning the bond pads with bond pad landings on the receiving device. The bond pads are adhered to the bond pad landings. The encapsulating or release layer is then removed to separate the contact springs from the contact spring applicator substrate.
摘要翻译：提供接触弹簧施加器，其包括施加器基板，可移除的封装层和嵌入在可移除封装层中的多个接触弹簧。接触弹簧被定位成使得每个接触弹簧上的接合焊盘与可移除的封装层的上表面相邻。接触弹簧施加器还可以包括施加器基板，释放层，释放层上的多个未释放的接触弹簧和每个接触弹簧的锚固端处的接合垫。接触弹簧施加器通过将接合垫与接收装置上的接合垫平台对准，将接触弹簧施加到集成电路芯片，管芯或封装或探针卡。接合焊盘粘附到接合焊盘平台上。然后去除包封或释放层以将接触弹簧与接触弹簧施加器基板分离。

26. 发明授权

US08040364B2 Latent resistive image layer for high speed thermal printing applications 有权
标题翻译：用于高速热敏打印应用的潜在电阻图像层
公开(公告)号：US08040364B2
公开(公告)日：2011-10-18
申请号：US12502949
申请日：2009-07-14
申请人： Timothy D. Stowe , Eugene M. Chow , Ashish V. Pattekar , Eric Peeters
发明人： Timothy D. Stowe , Eugene M. Chow , Ashish V. Pattekar , Eric Peeters
IPC分类号： B41J2/385
CPC分类号： B41J2/0057
摘要： An imaging system including an image receiving structure including a tunable-resistivity material; and an energy source to emit an energy beam at the image receiving structure to pattern-wise program the tunable-resistivity material. A resistivity can be pattern-wise changed. Marking material can be pattern-wise adhered in response to the pattern-wise changed resistivity.
摘要翻译：一种成像系统，包括包括可调谐电阻率材料的图像接收结构; 以及在所述图像接收结构处发射能量束以对所述可调谐电阻率材料进行图案化编程的能量源。电阻率可以以图案方式改变。响应于图案形式的电阻率，标记材料可以以图案方式粘附。

27. 发明申请

US20110227200A1 ALIGNMENT STRUCTURES FOR INTEGRATED-CIRCUIT PACKAGING 有权
标题翻译：集成电路封装的对准结构
公开(公告)号：US20110227200A1
公开(公告)日：2011-09-22
申请号：US12725754
申请日：2010-03-17
申请人： Eugene M. Chow , Philipp H. Schmaelzle
发明人： Eugene M. Chow , Philipp H. Schmaelzle
IPC分类号： H01L23/544 , H01L21/50
CPC分类号： H01L23/544 , H01L24/13 , H01L24/16 , H01L24/81 , H01L25/0657 , H01L25/50 , H01L2223/54426 , H01L2223/54473 , H01L2224/11013 , H01L2224/11015 , H01L2224/11848 , H01L2224/1301 , H01L2224/13021 , H01L2224/13023 , H01L2224/13078 , H01L2224/1319 , H01L2224/14179 , H01L2224/1601 , H01L2224/16145 , H01L2224/16147 , H01L2224/8112 , H01L2224/81191 , H01L2224/81193 , H01L2224/81897 , H01L2224/81948 , H01L2225/06513 , H01L2225/06531 , H01L2225/06565 , H01L2225/06593 , H01L2924/01006 , H01L2924/01033 , H01L2924/01075 , H01L2924/014 , H01L2924/10253 , H01L2924/14 , H01L2924/15787 , H01L2924/15788 , H01L2924/00
摘要： A multi-chip module (MCM) that includes alignment features is described. This MCM includes at least two substrates having facing surfaces with positive features disposed on them. Note that a given positive feature on either of the surfaces protrudes above the surface. Furthermore, the two substrates are mechanically coupled by these positive features. In particular, a given one of the positive features on one of the surfaces mates with a given subset of the positive features on the other of the surfaces. Additionally, the given subset of the positive features includes two or more of the positive features.
摘要翻译：描述了包括对准特征的多芯片模块（MCM）。该MCM包括具有设置在其上的具有正特征的面对表面的至少两个基板。请注意，任一表面上的给定正面特征突出在表面上方。此外，两个基板通过这些正特征机械耦合。特别地，其中一个表面上的给定的一个正特征与另一个表面上的正特征的给定子集配合。此外，正特征的给定子集包括两个或多个正特征。

28. 发明申请

US20110067590A1 ANILOX METERING SYSTEM FOR ELECTROGRAPHIC PRINTING 有权
公开(公告)号：US20110067590A1
公开(公告)日：2011-03-24
申请号：US12566568
申请日：2009-09-24
申请人： Eugene M. Chow , Jing Zhou , Gerald A. Domoto , Grace T. Brewington
发明人： Eugene M. Chow , Jing Zhou , Gerald A. Domoto , Grace T. Brewington
IPC分类号： B41K1/38
CPC分类号： G03G15/104
摘要： An embodiment is a method and apparatus to meter ink for electrographic printing. An ink loading mechanism having an anilox roller fills ink from an ink supply into cells in the anilox roller having a plurality of valleys and lands that form the cells. The ink loading mechanism causes the valleys to be full or nearly full with the ink. The anilox roller rotates in a first direction. A blanket roller rotationally engaged with the anilox roller pulls the ink out of the cells and causes the valleys to be partially filled. The blanket roller rotates in a second direction. A first cleaning blade cleans tops of the lands of the cells.Another embodiment is a method and apparatus to meter ink for electrographic printing. An ink loading mechanism having an anilox roller fills ink from an ink supply into cells in the anilox roller having a plurality of valleys and lands forming the cells. The ink loading mechanism causes the valleys to be full or nearly full with the ink. The anilox roller rotates in a first direction. A soft blade positioned slightly below surface of the lands removes ink from the cells and causes the valleys the partially filled as the anilox roller rotates. A hard blade positioned at the surface of the lands to clean residue of ink on the surface of the lands as the anilox roller rotates.

29. 发明授权

US07861405B2 System for forming a micro-assembler 有权
标题翻译：用于形成微型汇编器的系统
公开(公告)号：US07861405B2
公开(公告)日：2011-01-04
申请号：US12041375
申请日：2008-03-03
申请人： Eugene M. Chow , Jeng Ping Lu , Meng H. Lean , David K. Biegelsen
发明人： Eugene M. Chow , Jeng Ping Lu , Meng H. Lean , David K. Biegelsen
IPC分类号： B23P19/00
CPC分类号： B81C99/002 , H01L24/95 , H01L2224/95085 , H01L2224/95145 , H01L2924/14 , H01L2924/1461 , Y10T29/4913 , Y10T29/5313 , Y10T29/53174 , Y10T29/53178 , H01L2924/00
摘要： A xerographic micro-assembler system, method and apparatus that includes a sorting unit that is adapted to receive a plurality of micro-objects. The micro-objects can also be sorted and oriented on the sorting unit and then transferred to a substrate. The system, method and apparatus can also include a device for detecting errors in at least one of the micro-objects on the sorting unit and a protection means for preventing an improper micro-object from being transferred to the substrate. The system, method and apparatus can also include an organized micro-object feeder assembly that can transfer at least one of a plurality of micro-objects to the sorting unit or directly to the substrate.
摘要翻译：一种静电复印微组装系统，方法和装置，其包括适于接收多个微物体的分类单元。微物体也可以在分选单元上分类和定向，然后转移到基底。系统，方法和装置还可以包括用于检测分类单元中的至少一个微物体中的错误的装置和用于防止不适当的微物体被转移到基板的保护装置。系统，方法和装置还可以包括有组织的微物体馈送器组件，其可以将多个微物体中的至少一个传送到分类单元或直接传送到衬底。

30. 发明申请

US20100295165A1 STRESS-ENGINEERED INTERCONNECT PACKAGES WITH ACTIVATOR-ASSISTED MOLDS 有权
标题翻译：具有激活器辅助功能的应力工程互连包
公开(公告)号：US20100295165A1
公开(公告)日：2010-11-25
申请号：US12471188
申请日：2009-05-22
申请人： Christopher L. Chua , Bowen Cheng , Eugene M. Chow , Dirk De Bruyker
发明人： Christopher L. Chua , Bowen Cheng , Eugene M. Chow , Dirk De Bruyker
IPC分类号： H01L23/48 , H01L21/50
CPC分类号： H01L21/50 , H01L24/13 , H01L24/16 , H01L24/29 , H01L24/32 , H01L24/73 , H01L24/81 , H01L24/83 , H01L24/92 , H01L2224/0401 , H01L2224/05568 , H01L2224/05599 , H01L2224/1111 , H01L2224/11334 , H01L2224/13005 , H01L2224/13016 , H01L2224/13027 , H01L2224/16105 , H01L2224/16145 , H01L2224/16225 , H01L2224/16227 , H01L2224/2919 , H01L2224/32145 , H01L2224/32225 , H01L2224/73104 , H01L2224/81903 , H01L2224/83193 , H01L2224/83855 , H01L2224/83859 , H01L2224/83874 , H01L2224/83885 , H01L2224/9211 , H01L2924/00013 , H01L2924/00014 , H01L2924/0002 , H01L2924/01006 , H01L2924/01018 , H01L2924/01024 , H01L2924/01033 , H01L2924/01042 , H01L2924/01045 , H01L2924/0132 , H01L2924/09701 , H01L2924/10329 , H01L2924/12042 , H01L2924/14 , H01L2924/181 , H01L2924/351 , H05K3/321 , H05K3/4015 , H05K2201/0311 , H01L2224/81 , H01L2224/83 , H01L2224/13099 , H01L2224/05099 , H01L2924/01015 , H01L2924/01049 , H01L2924/01031 , H01L2224/13599 , H01L2224/29099 , H01L2224/29599 , H01L2224/05552 , H01L2924/00
摘要： A package has a pad chip having contact pads, a spring chip having micro-springs in contact with the contact pads to form interconnects, the area in which the micro-springs contact the contact pads forming an interconnect area, a chemical activator in the interconnect area, and an adhesive responsive to the chemical activator in the interconnect area. A package has a pad chip having contact pads, a spring chip having micro-springs in contact with the contact pads to form interconnects, a chemical activator on one of either the pad chip or the spring chip, and an adhesive responsive to the chemical activator on the other of either the pad chip or the spring chip. A method includes providing a pad chip having contact pads, providing a spring chip having micro-springs, applying a chemical activator to one of either the pad chip or the spring chip, applying an adhesive responsive to the chemical activator on the other of the pad chip or the spring chip, aligning the pad chip to the spring chip such that the micro-springs will contact the contact pads, and pressing the pad chip and the spring chip together such that the chemical activator at least partially cures the adhesive.
摘要翻译：封装具有具有接触焊盘的焊盘芯片，具有与接触焊盘接触以形成互连的微弹簧的弹簧芯片，微弹簧接触形成互连区域的接触焊盘的区域，互连中的化学活化剂区域，以及响应于互连区域中的化学活化剂的粘合剂。封装具有焊盘芯片，其具有接触焊盘，弹簧芯片，其具有与接触焊盘接触以形成互连的微弹簧，在焊盘芯片或弹簧芯片之一上的化学活化剂以及响应于化学活化剂的粘合剂另一方面是垫片芯片或弹簧芯片。一种方法包括提供具有接触焊盘的焊盘芯片，提供具有微弹簧的弹簧芯片，将化学活化剂施加到衬垫芯片或弹簧芯片中的一个上，在衬垫的另一个上施加响应于化学活化剂的粘合剂芯片或弹簧芯片，将焊盘芯片对准弹簧芯片，使得微弹簧将接触接触焊盘，并将焊盘芯片和弹簧芯片压在一起，使得化学活化器至少部分地固化粘合剂。

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