专利快速检索-快速检索全球专利，免费商用专利数据库-IPRDB

1. 发明授权

US07982290B2 Contact spring application to semiconductor devices 有权
标题翻译：接触弹簧应用于半导体器件
公开(公告)号：US07982290B2
公开(公告)日：2011-07-19
申请号：US11331656
申请日：2006-01-12
申请人： Eugene M. Chow , Christopher L. Chua , Eric Peeters
发明人： Eugene M. Chow , Christopher L. Chua , Eric Peeters
IPC分类号： H01L23/495 , H01L29/40 , H01L23/48
CPC分类号： H01L24/11 , G01R1/06727 , G01R1/06761 , G01R3/00 , H01L21/568 , H01L21/6835 , H01L23/49811 , H01L24/12 , H01L24/742 , H01L24/81 , H01L2221/68368 , H01L2224/05023 , H01L2224/0508 , H01L2224/05568 , H01L2224/05573 , H01L2224/11003 , H01L2224/13099 , H01L2224/16 , H01L2224/81801 , H01L2924/01005 , H01L2924/01006 , H01L2924/01022 , H01L2924/01033 , H01L2924/01054 , H01L2924/01082 , H01L2924/14
摘要： A contact spring applicator is provided which includes an applicator substrate, a removable encapsulating layer and a plurality of contact springs embedded in the removable encapsulating layer. The contact springs are positioned such that a bond pad on each contact spring is adjacent to an upper surface of the removable encapsulating layer. The contact spring applicator may also include an applicator substrate, a release layer, a plurality of unreleased contact springs on the release layer and a bond pad at an anchor end of each contact spring. The contact spring applicators apply contact springs to an integrated circuit chip, die or package or to a probe card by aligning the bond pads with bond pad landings on the receiving device. The bond pads are adhered to the bond pad landings. The encapsulating or release layer is then removed to separate the contact springs from the contact spring applicator substrate.
摘要翻译：提供接触弹簧施加器，其包括施加器基板，可移除的封装层和嵌入在可移除封装层中的多个接触弹簧。接触弹簧被定位成使得每个接触弹簧上的接合焊盘与可移除的封装层的上表面相邻。接触弹簧施加器还可以包括施加器基板，释放层，释放层上的多个未释放的接触弹簧和每个接触弹簧的锚固端处的接合垫。接触弹簧施加器通过将接合垫与接收装置上的接合垫平台对准，将接触弹簧施加到集成电路芯片，管芯或封装或探针卡。接合焊盘粘附到接合焊盘平台上。然后去除包封或释放层以将接触弹簧与接触弹簧施加器基板分离。

2. 发明申请

US20110318880A1 CONTACT SPRING APPLICATION TO SEMICONDUCTOR DEVICES 有权
标题翻译：接触弹簧应用于半导体器件
公开(公告)号：US20110318880A1
公开(公告)日：2011-12-29
申请号：US13162473
申请日：2011-06-16
申请人： Eugene M. Chow , Christopher L. Chua , Eric Peeters
发明人： Eugene M. Chow , Christopher L. Chua , Eric Peeters
IPC分类号： H01L21/56
CPC分类号： H01L24/11 , G01R1/06727 , G01R1/06761 , G01R3/00 , H01L21/568 , H01L21/6835 , H01L23/49811 , H01L24/12 , H01L24/742 , H01L24/81 , H01L2221/68368 , H01L2224/05023 , H01L2224/0508 , H01L2224/05568 , H01L2224/05573 , H01L2224/11003 , H01L2224/13099 , H01L2224/16 , H01L2224/81801 , H01L2924/01005 , H01L2924/01006 , H01L2924/01022 , H01L2924/01033 , H01L2924/01054 , H01L2924/01082 , H01L2924/14
摘要： A contact spring applicator is provided which includes an applicator substrate, a removable encapsulating layer and a plurality of contact springs embedded in the removable encapsulating layer. The contact springs are positioned such that a bond pad on each contact spring is adjacent to an upper surface of the removable encapsulating layer. The contact spring applicator may also include an applicator substrate, a release layer, a plurality of unreleased contact springs on the release layer and a bond pad at an anchor end of each contact spring. The contact spring applicators apply contact springs to an integrated circuit chip, die or package or to a probe card by aligning the bond pads with bond pad landings on the receiving device. The bond pads are adhered to the bond pad landings. The encapsulating or release layer is then removed to separate the contact springs from the contact spring applicator substrate.
摘要翻译：提供接触弹簧施加器，其包括施加器基板，可移除的封装层和嵌入在可移除封装层中的多个接触弹簧。接触弹簧被定位成使得每个接触弹簧上的接合焊盘与可移除的封装层的上表面相邻。接触弹簧施加器还可以包括施加器基板，释放层，释放层上的多个未释放的接触弹簧和每个接触弹簧的锚固端处的接合垫。接触弹簧施加器通过将接合垫与接收装置上的接合垫平台对准，将接触弹簧施加到集成电路芯片，管芯或封装或探针卡。接合焊盘粘附到接合焊盘平台上。然后去除包封或释放层以将接触弹簧与接触弹簧施加器基板分离。

3. 发明授权

US08318542B2 Contact spring application to semiconductor devices 有权
标题翻译：接触弹簧应用于半导体器件
公开(公告)号：US08318542B2
公开(公告)日：2012-11-27
申请号：US13162473
申请日：2011-06-16
申请人： Eugene M. Chow , Christopher L. Chua , Eric Peeters
发明人： Eugene M. Chow , Christopher L. Chua , Eric Peeters
IPC分类号： H01L21/00
CPC分类号： H01L24/11 , G01R1/06727 , G01R1/06761 , G01R3/00 , H01L21/568 , H01L21/6835 , H01L23/49811 , H01L24/12 , H01L24/742 , H01L24/81 , H01L2221/68368 , H01L2224/05023 , H01L2224/0508 , H01L2224/05568 , H01L2224/05573 , H01L2224/11003 , H01L2224/13099 , H01L2224/16 , H01L2224/81801 , H01L2924/01005 , H01L2924/01006 , H01L2924/01022 , H01L2924/01033 , H01L2924/01054 , H01L2924/01082 , H01L2924/14
摘要： A contact spring applicator is provided which includes an applicator substrate, a removable encapsulating layer and a plurality of contact springs embedded in the removable encapsulating layer. The contact springs are positioned such that a bond pad on each contact spring is adjacent to an upper surface of the removable encapsulating layer. The contact spring applicator may also include an applicator substrate, a release layer, a plurality of unreleased contact springs on the release layer and a bond pad at an anchor end of each contact spring. The contact spring applicators apply contact springs to an integrated circuit chip, die or package or to a probe card by aligning the bond pads with bond pad landings on the receiving device. The bond pads are adhered to the bond pad landings. The encapsulating or release layer is then removed to separate the contact springs from the contact spring applicator substrate.
摘要翻译：提供接触弹簧施加器，其包括施加器基板，可移除的封装层和嵌入在可移除封装层中的多个接触弹簧。接触弹簧被定位成使得每个接触弹簧上的接合焊盘与可移除的封装层的上表面相邻。接触弹簧施加器还可以包括施加器基板，释放层，释放层上的多个未释放的接触弹簧和每个接触弹簧的锚固端处的接合垫。接触弹簧施加器通过将接合垫与接收装置上的接合垫平台对准，将接触弹簧施加到集成电路芯片，管芯或封装或探针卡。接合焊盘粘附到接合焊盘平台上。然后去除包封或释放层以将接触弹簧与接触弹簧施加器基板分离。

4. 发明授权

US08561963B2 Electrostatically addressable microvalves 有权
标题翻译：静电寻址微型阀
公开(公告)号：US08561963B2
公开(公告)日：2013-10-22
申请号：US11959778
申请日：2007-12-19
申请人： Ashish Pattekar , Eugene M Chow , Eric Peeters
发明人： Ashish Pattekar , Eugene M Chow , Eric Peeters
IPC分类号： F16K31/128
CPC分类号： F16K99/0001 , B01L3/502738 , B01L2200/12 , B01L2300/0819 , B01L2300/0887 , B01L2400/0655 , F16K99/0026 , Y10T137/0318 , Y10T137/0391 , Y10T137/87249
摘要： An improved microvalve is described. The microvalve includes a corresponding actuation aperture in an actuation aperture layer. A control fluid flows through the actuation aperture. The flow of the control fluid is controlled by an electric field typically applied via a charge distribution near an actuation aperture layer. In one embodiment, the electric field may adjust the opening and closing of the actuation aperture thereby controlling the flow of the control fluid. In a second embodiment, the control fluid is an electrorheological fluid where the electric field controls the viscosity of the ER fluid thereby controlling fluid flow through the actuation aperture. In both embodiments the flow of the control fluid controls stretching of a flexible membrane formed along the wall of a conduit through which a fluid to be controlled flows. The stretching of the flexible membrane controlling the flow of the main fluid to be controlled.
摘要翻译：描述了改进的微型阀。微型阀包括致动孔层中相应的致动孔。控制流体流过致动孔。控制流体的流动由通常通过致动孔层附近的电荷分布施加的电场来控制。在一个实施例中，电场可以调节致动孔的打开和关闭，从而控制控制流体的流动。在第二实施例中，控制流体是电流变流体，其中电场控制ER流体的粘度，从而控制通过致动孔的流体流动。在两个实施例中，控制流体的流动控制沿导管的壁形成的柔性膜的拉伸，待控制的流体通过该壁流动。柔性膜的拉伸控制要控制的主流体的流动。

5. 发明申请

US20120285550A1 Novel Electrostatically Addressable Microvalves 有权
标题翻译：新型静电寻址微型阀
公开(公告)号：US20120285550A1
公开(公告)日：2012-11-15
申请号：US13557157
申请日：2012-07-24
申请人： Ashish Pattekar , Eugene M. Chow , Eric Peeters
发明人： Ashish Pattekar , Eugene M. Chow , Eric Peeters
IPC分类号： F17D1/16
CPC分类号： F16K99/0001 , B01L3/502738 , B01L2200/12 , B01L2300/0819 , B01L2300/0887 , B01L2400/0655 , F16K99/0026 , Y10T137/0318 , Y10T137/0391 , Y10T137/87249
摘要： A method of controlling a main fluid in a conduit using a microvalve is described. The microvalve includes a corresponding actuation aperture in an actuation aperture layer. A control fluid flows through the actuation aperture in response to an electric field applied via a charge distribution near an actuation aperture layer. In one embodiment, the electric field may adjust the opening and closing of the actuation aperture thereby controlling the flow of the control fluid. In a second embodiment, the control fluid is an electrorheological fluid where the electric field controls the viscosity of the ER fluid, thereby controlling fluid flow through the actuation aperture. In both embodiments the flow of the control fluid controls stretching of a flexible membrane into and out of the conduit, thereby controlling the flow of the main fluid by opening or closing the conduit.
摘要翻译：描述了使用微型阀控制导管中的主流体的方法。微型阀包括致动孔层中相应的致动孔。响应于通过致动孔层附近的电荷分布施加的电场，控制流体流过致动孔。在一个实施例中，电场可以调节致动孔的打开和关闭，从而控制控制流体的流动。在第二实施例中，控制流体是电流变流体，其中电场控制ER流体的粘度，由此控制通过致动孔的流体流动。在两个实施例中，控制流体的流动控制柔性膜进出导管的伸展，从而通过打开或关闭导管来控制主流体的流动。

6. 发明授权

US07284324B2 Method of making photolithographically-patterned out-of-plane coil structures 有权
标题翻译：制造光刻图案的平面外线圈结构的方法
公开(公告)号：US07284324B2
公开(公告)日：2007-10-23
申请号：US11197675
申请日：2005-08-04
申请人： Christopher L. Chua , Francesco Lemmi , Koenraad F. Van Schuylenbergh , Jeng Ping Lu , David K. Fork , Eric Peeters , Decai Sun , Donald L. Smith , Linda T. Romano
发明人： Christopher L. Chua , Francesco Lemmi , Koenraad F. Van Schuylenbergh , Jeng Ping Lu , David K. Fork , Eric Peeters , Decai Sun , Donald L. Smith , Linda T. Romano
IPC分类号： H01R43/16
CPC分类号： H01L24/13 , G01R1/06727 , G01R3/00 , H01F17/0033 , H01F17/02 , H01F41/041 , H01L21/76838 , H01L21/7688 , H01L23/498 , H01L23/49811 , H01L23/5227 , H01L24/11 , H01L24/16 , H01L24/48 , H01L28/10 , H01L2224/05568 , H01L2224/05573 , H01L2224/05624 , H01L2224/13099 , H01L2224/4847 , H01L2224/8592 , H01L2924/0001 , H01L2924/00014 , H01L2924/00015 , H01L2924/01005 , H01L2924/01006 , H01L2924/01013 , H01L2924/01018 , H01L2924/01019 , H01L2924/01022 , H01L2924/01023 , H01L2924/01024 , H01L2924/01027 , H01L2924/01033 , H01L2924/01039 , H01L2924/0104 , H01L2924/01042 , H01L2924/01047 , H01L2924/01057 , H01L2924/01058 , H01L2924/01061 , H01L2924/01068 , H01L2924/01072 , H01L2924/01074 , H01L2924/01075 , H01L2924/01078 , H01L2924/01079 , H01L2924/01082 , H01L2924/01084 , H01L2924/014 , H01L2924/10253 , H01L2924/10329 , H01L2924/12034 , H01L2924/14 , H01L2924/181 , H01L2924/19041 , H01L2924/19042 , H01L2924/19043 , H01L2924/30105 , H01L2924/30107 , H01L2924/3011 , Y10T29/4902 , Y10T29/49071 , Y10T29/49147 , Y10T29/49204 , Y10T29/49208 , Y10T29/4921 , Y10T29/49218 , H01L2924/00 , H01L2224/05599 , H01L2224/85399 , H01L2224/45099 , H01L2224/45015 , H01L2924/207
摘要： An out-of-plane micro-structure which can be used for on-chip integration of high-Q inductors and transformers places the magnetic field direction parallel to the substrate plane without requiring high aspect ratio processing. The photolithographically patterned coil structure includes an elastic member having an intrinsic stress profile. The intrinsic stress profile biases a free portion away from the substrate forming a loop winding. An anchor portion remains fixed to the substrate. The free portion end becomes a second anchor portion which may be connected to the substrate via soldering or plating. A series of individual coil structures can be joined via their anchor portions to form inductors and transformers.
摘要翻译：可以用于高Q电感和变压器的片上集成的平面外微结构使得磁场方向平行于衬底平面而不需要高纵横比处理。光刻图案的线圈结构包括具有固有应力分布的弹性构件。固有的应力分布使形成环绕的基板远离基板偏移。锚固部分保持固定到基底上。自由部分端部成为可以通过焊接或电镀而连接到基板的第二锚固部分。一系列单独的线圈结构可以通过它们的锚定部分接合以形成电感器和变压器。

7. 发明授权

US6054335A Fabrication of scanning III-V compound light emitters integrated with Si-based actuators 有权
标题翻译：与Si基致动器集成的扫描III-V复合发光体的制造
公开(公告)号：US6054335A
公开(公告)日：2000-04-25
申请号：US209866
申请日：1998-12-11
申请人： Decai Sun , Ross D. Bringans , Christopher L. Chua , Philip D. Floyd , Eric Peeters , Joel A. Kubby , Alex T. Tran
发明人： Decai Sun , Ross D. Bringans , Christopher L. Chua , Philip D. Floyd , Eric Peeters , Joel A. Kubby , Alex T. Tran
IPC分类号： B81B3/00 , B81B7/02 , H01L27/15 , H01S5/00 , H01S5/02 , H01S5/022 , H01S5/026 , H01S5/042 , H01S5/183 , H01S5/42 , H01L21/00
CPC分类号： H01S5/18308 , H01S5/02288 , H01L27/15 , H01S5/021 , H01S5/02252 , H01S5/4087 , H01S5/423 , H01S5/426
摘要： A III-V compound light emitter is integrated with Si-based actuators. The Proposed devices take advantage of the superior optical properties of III-V compounds and the superior mechanical properties of Si, as well as mature fabrication technologies of Si-Micro-Electro-Mechanical Systems (MEMS). The emitter can be a light emitting diode (LED), a vertical cavity surface emitting laser (VCSEL) or an edge emitting laser. Electro or magnetic based actuation from Si-based actuators provides linear or angular movement of the light emitter.
摘要翻译： III-V复合光发射器与Si基致动器集成。提出的器件利用了III-V化合物的优异光学性能和Si的优异机械性能，以及Si-Micro-Electro-Mechanical Systems（MEMS）的成熟制造技术。发射极可以是发光二极管（LED），垂直腔表面发射激光器（VCSEL）或边缘发射激光器。基于Si的致动器的基于电或磁的致动器提供光发射器的线性或角度运动。

8. 发明授权

US08646471B2 Electrostatically addressable microvalves 有权
标题翻译：静电寻址微型阀
公开(公告)号：US08646471B2
公开(公告)日：2014-02-11
申请号：US13557157
申请日：2012-07-24
申请人： Ashish Pattekar , Eugene M. Chow , Eric Peeters
发明人： Ashish Pattekar , Eugene M. Chow , Eric Peeters
IPC分类号： F16K11/20 , F16K31/126
CPC分类号： F16K99/0001 , B01L3/502738 , B01L2200/12 , B01L2300/0819 , B01L2300/0887 , B01L2400/0655 , F16K99/0026 , Y10T137/0318 , Y10T137/0391 , Y10T137/87249
摘要： A method of controlling a main fluid in a conduit using a microvalve is described. The microvalve includes a corresponding actuation aperture in an actuation aperture layer. A control fluid flows through the actuation aperture in response to an electric field applied via a charge distribution near an actuation aperture layer. In one embodiment, the electric field may adjust the opening and closing of the actuation aperture thereby controlling the flow of the control fluid. In a second embodiment, the control fluid is an electrorheological fluid where the electric field controls the viscosity of the ER fluid, thereby controlling fluid flow through the actuation aperture. In both embodiments the flow of the control fluid controls stretching of a flexible membrane into and out of the conduit, thereby controlling the flow of the main fluid by opening or closing the conduit.
摘要翻译：描述了使用微型阀控制导管中的主流体的方法。微型阀包括致动孔层中相应的致动孔。响应于通过致动孔层附近的电荷分布施加的电场，控制流体流过致动孔。在一个实施例中，电场可以调节致动孔的打开和关闭，从而控制控制流体的流动。在第二实施例中，控制流体是电流变流体，其中电场控制ER流体的粘度，由此控制通过致动孔的流体流动。在两个实施例中，控制流体的流动控制柔性膜进出导管的伸展，从而通过打开或关闭导管来控制主流体的流动。

9. 发明申请

US20110012980A1 LATENT RESISTIVE IMAGE LAYER FOR HIGH SPEED THERMAL PRINTING APPLICATIONS 有权
标题翻译：用于高速热打印应用的专利影像层
公开(公告)号：US20110012980A1
公开(公告)日：2011-01-20
申请号：US12502949
申请日：2009-07-14
申请人： Timothy D. Stowe , Eugene M. Chow , Ashish V. Pattekar , Eric Peeters
发明人： Timothy D. Stowe , Eugene M. Chow , Ashish V. Pattekar , Eric Peeters
IPC分类号： G01D15/10 , B41J2/315
CPC分类号： B41J2/0057
摘要： An imaging system including an image receiving structure including a tunable-resistivity material; and an energy source to emit an energy beam at the image receiving structure to pattern-wise program the tunable-resistivity material. A resistivity can be pattern-wise changed. Marking material can be pattern-wise adhered in response to the pattern-wise changed resistivity.
摘要翻译：一种成像系统，包括包括可调谐电阻率材料的图像接收结构; 以及在所述图像接收结构处发射能量束以对所述可调谐电阻率材料进行图案化编程的能量源。电阻率可以以图案方式改变。响应于图案形式的电阻率，标记材料可以以图案方式粘附。

10. 发明授权

US06549691B1 Optical cross switching system 有权
标题翻译：光交叉开关系统
公开(公告)号：US06549691B1
公开(公告)日：2003-04-15
申请号：US09708814
申请日：2000-11-08
申请人： Robert A. Street , Eric Peeters , Michel A. Rosa , Jeng Ping Lu , Christopher L. Chua
发明人： Robert A. Street , Eric Peeters , Michel A. Rosa , Jeng Ping Lu , Christopher L. Chua
IPC分类号： G02B626
CPC分类号： G02B6/3586 , G02B6/3512 , G02B6/3556 , G02B6/3588 , G02B6/359 , H04Q11/0005 , H04Q2011/0026 , H04Q2011/0039 , H04Q2011/0058
摘要： An optical cross switch including an improved system to align optical components is described. The system utilizes a highly transmissive sensor positioned in the optical path of an optical signal to determine the precise position of the optical signal. A feedback loop uses output from the highly transmissive sensor to readjust elements that maintains the optical signal in a desired position. The current system is particularly suitable for use in an optical cross switch.
摘要翻译：描述了包括改进的对准光学部件的系统的光交叉开关。该系统利用位于光信号的光路中的高度透射的传感器来确定光信号的精确位置。反馈回路使用高度透射传感器的输出来重新调整将光信号保持在期望位置的元件。目前的系统特别适用于光交叉开关。

你已经成功收藏专利！

检索式保存成功!

IPRDB

热门服务

关于我们

友情链接

联系方式