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21. 发明专利

JP2007197790A Discoloration preventing agent composition 有权
标题翻译：防腐剂组合物
公开(公告)号：JP2007197790A
公开(公告)日：2007-08-09
申请号：JP2006018899
申请日：2006-01-27
申请人： Daiwa Fine Chemicals Co Ltd (Laboratory) , 株式会社大和化成研究所
发明人： TAKEUCHI TAKAO , YOSHIMOTO MASAKAZU , OBATA KEIGO
IPC分类号： C23F11/04 , C25D5/48
摘要： PROBLEM TO BE SOLVED: To develop and provide a discoloration prevention/treatment agent effective for a lead-free plating film instead of sodium phosphate solution treatment.
SOLUTION: The discoloration in the surface of tin or a tin alloy can be extremely effectively prevented by using a discoloration preventing agent composition obtained by incorporating one or more kinds selected from heterocyclic nitrogen-containing compounds or the salts thereof, aliphatic or aromatic amines and 6 to 24C straight chain or branched aliphatic carboxylic acids or the salts between the carboxylic acids and the amines into a solution comprising one or more kinds selected from compounds containing amino nitrogen having two or more methylene groups to which phosphonic acid groups are bonded, and whose solution pH is controlled to an acidic region of pH ≤7.
COPYRIGHT: (C)2007,JPO&INPIT
摘要翻译：解决的问题：开发并提供对无铅镀膜有效的防变色剂，代替磷酸钠溶液处理。解决方案：通过使用通过掺入选自杂环含氮化合物或其盐，脂族或芳族化合物中的一种或多种获得的防变色剂组合物，可以极其有效地防止锡或锡合金表面的变色胺和6至24C直链或支链脂族羧酸或羧酸和胺之间的盐形成包含一种或多种选自含有键合有膦酸基的具有两个或更多个亚甲基的氨基氮的化合物的溶液的溶液，并将其pH值控制在pH≤7的酸性区域。版权所有（C）2007，JPO＆INPIT

22. 发明专利

JP2006286345A Surface finishing method of hydrogen storage alloy, surface-finished hydrogen storage alloy, and nickel-hydrogen secondary battery using the same 审中-公开
标题翻译：氢储存合金表面处理方法，表面处理氢储存合金及使用其的镍氢二次电池
公开(公告)号：JP2006286345A
公开(公告)日：2006-10-19
申请号：JP2005103386
申请日：2005-03-31
申请人： Arakawa Chem Ind Co Ltd , Daiwa Fine Chemicals Co Ltd (Laboratory) , 株式会社大和化成研究所 , 荒川化学工業株式会社
发明人： KITAMURA SHINGO , OBATA KEIGO , KOBAYASHI MICHINORI , MIZUIE JIRO
IPC分类号： H01M4/38 , C23C18/16 , C23C18/34 , H01M10/30
CPC分类号： Y02E60/124
摘要： PROBLEM TO BE SOLVED: To provide a surface finishing method of a hydrogen storage alloy, a surface-finished hydrogen storage alloy, and a nickel-hydrogen secondary battery using this alloy. SOLUTION: The surface finishing method of the hydrogen storage alloy particle is characterized by improvement of the electrochemical performance, especially the initial cycle activity and high rate of discharging characteristics, as well as enhancement of the cycle life performance through formation of the durable nickel-coating film on a surface of the hydrogen storage alloy particle and control of its coating amount within the specified range. COPYRIGHT: (C)2007,JPO&INPIT
摘要翻译：要解决的问题：提供使用该合金的储氢合金的表面精加工方法，表面处理的储氢合金和镍氢二次电池。解决方案：储氢合金颗粒的表面处理方法的特征在于改善电化学性能，特别是初始循环活性和高放电特性，以及通过形成耐用性来提高循环寿命性能在该储氢合金粒子的表面上形成镍涂膜，将其涂敷量控制在规定范围内。版权所有（C）2007，JPO＆INPIT

23. 发明专利

JP2006265616A Lead-free tin ally elctroplating method and plating bath for suppressing dissolution current of anode used in the method 有权
标题翻译：无铅无铅焊接方法和镀层浴，用于抑制方法中使用的阳极溶解电流
公开(公告)号：JP2006265616A
公开(公告)日：2006-10-05
申请号：JP2005084399
申请日：2005-03-23
申请人： Daiwa Fine Chemicals Co Ltd (Laboratory) , Ishihara Chem Co Ltd , 株式会社大和化成研究所 , 石原薬品株式会社
发明人： HAGA MASAKI , NISHIKAWA TETSUJI , FUKAMI TAKUO , OBATA KEIGO , YOSHIMOTO MASAKAZU
IPC分类号： C25D3/60 , C25D7/00
CPC分类号： H01L2224/11462
摘要： PROBLEM TO BE SOLVED: To smoothly prevent the substitution deposition for noble metals in a tin (alloy) anode during electrodeposition in electroplating of the alloy of tin and metals (silver, bismuth, copper, etc.) nobler than the tin.
SOLUTION: The tin alloy elctroplating method comprises adding at least one dissolution current suppressing agent selected from the group consisting of glutamic acid-N, N-diacetic acid, methyl glycine-N, N-diacetic acid, aspartic acid and their salts to the tin electroplating bath to suppress the dissolution current of the anode and to attain the prevention of the substitution deposition of the noble metals to the anode during the electrodeposition. The dissolution current is suppressed by the addition of the suppressing agent and therefore, even if the anode current density is made lower than heretofore, the potential of the anode is shifted nobler than the natural electrode potential of the noble metal and thereby the substitution deposition to the anode of the nobler metal can be effectively prevented.
COPYRIGHT: (C)2007,JPO&INPIT
摘要翻译：要解决的问题：为了比锡更贵的锡和金属（银，铋，铜等）的合金的电镀电镀期间，在锡（合金）阳极中的贵金属的替代沉积顺利地防止。解决方案：锡合金电镀方法包括加入至少一种选自谷氨酸-N，N-二乙酸，甲基甘氨酸-N，N-二乙酸，天冬氨酸及其盐的溶出电流抑制剂到锡电镀浴以抑制阳极的溶解电流，并且在电沉积期间防止贵金属向阳极的置换沉积。通过添加抑制剂来抑制溶解电流，因此即使阳极电流密度比以前更低，阳极的电位比贵金属的天然电极电位高，从而取代沉积为可以有效地防止贵族金属的阳极。版权所有（C）2007，JPO＆INPIT

24. 发明专利

JP2006052421A Lead-free tin-bismuth based alloy electroplating bath 有权
标题翻译：无铅锡合金电镀浴
公开(公告)号：JP2006052421A
公开(公告)日：2006-02-23
申请号：JP2004232959
申请日：2004-08-10
申请人： Daiwa Fine Chemicals Co Ltd (Laboratory) , Ishihara Chem Co Ltd , 株式会社大和化成研究所 , 石原薬品株式会社
发明人： HAGA MASAKI , NISHIKAWA TETSUJI , TANAKA KAORU , INAI SHOYA , OBATA KEIGO , YOSHIMOTO MASAKAZU
IPC分类号： C25D3/60 , C25D7/00
摘要： PROBLEM TO BE SOLVED: To effectively prevent the substitute precipitation of bismuth to the surface of a tin or tin alloy anode at the time of plating treatment in a lead-free tin-bismuth based alloy electroplating bath.
SOLUTION: Regarding the lead-free tin-bismuth based alloy electroplating bath, in a tin-bismuth binary alloy electroplating bath comprising: a stannous salt; a bismuth salt; and various acids, a nonionic surfactant composed of an alkylene oxide adduct of a specified chemical structural species having a prescribed HLB (Hydrophile-Lypophile-Balance) such as distyrenated phenol polyalkoxylate having an HLB of 7.3 to 15.6 and a cis-9-octadecenylamine polyalkoxylate having an HLB of 2.8 to 16.6 or composed of the polyalkoxylate of ethylenediamine having a cloud point of 15 to 30°C is added. Since the nonionic surfactant of a specified chemical structure species having a prescribed HLB or cloud point is selectively added, the substitute precipitation of bismuth on the surface of an anode is prevented, and the consumption of bismuth in the bath is suppressed, thus the composition in the plating bath can be stabilized.
COPYRIGHT: (C)2006,JPO&NCIPI
摘要翻译：要解决的问题：为了在无铅锡 - 铋基合金电镀浴中有效地防止在电镀处理时锡或锡合金阳极的表面上的铋替代沉淀。解决方案：关于无铅锡 - 铋基合金电镀浴，在含有亚锡盐的锡 - 铋二元合金电镀浴中，铋盐和各种酸，具有规定的具有规定HLB（亲水亲油平衡）的化学结构物的烯化氧加合物如HLB为7.3至15.6的二苯乙烯化苯酚聚烷氧基化物和顺式-9-十八碳烯胺聚烷氧基化物的非离子表面活性剂 HLB为2.8〜16.6，或者由浊点为15〜30℃的乙二胺的聚烷氧基化物构成。由于选择性地添加具有规定的HLB或浊点的特定化学结构种类的非离子表面活性剂，因此可以防止铋在阳极表面上的替代沉淀，并且抑制沐浴中的铋的消耗，电镀液可以稳定。版权所有（C）2006，JPO＆NCIPI

25. 发明专利

JP2005290505A Lead-tin alloy solder plating liquid 有权
标题翻译：铅锡合金焊接液
公开(公告)号：JP2005290505A
公开(公告)日：2005-10-20
申请号：JP2004109541
申请日：2004-04-02
申请人： Daiwa Fine Chemicals Co Ltd (Laboratory) , Ishihara Chem Co Ltd , Mitsubishi Materials Corp , 三菱マテリアル株式会社 , 株式会社大和化成研究所 , 石原薬品株式会社
发明人： MASUDA AKIHIRO , OBINATA MASAYOSHI , YOSHIMOTO MASAKAZU , NAKAMURA YURI , TSUJI SEIKI , NISHIKAWA TETSUJI
IPC分类号： C25D3/60 , C25D3/56 , C25D7/12 , H01L21/60
摘要： PROBLEM TO BE SOLVED: To provide a lead-tin alloy solder plating liquid capable of forming lead-tin alloy solder plating films or lead-tin alloy solder bump electrodes each having a high current density, a smooth surface, and also having reduced variation in height. SOLUTION: The lead-tin alloy solder plating liquid is composed of: at least one kind selected from acids and the salts thereof; a soluble tin compound(s); a soluble lead compound(s); a nonionic surfactant(s); a formalin condensate of naphthalene sulfonic acid or the salt thereof; and water. The formalin condensate of naphthalene sulfonic acid or the salt thereof is comprised by 0.02 to 1.50 mass% to lead ions. COPYRIGHT: (C)2006,JPO&NCIPI
摘要翻译：要解决的问题：提供能够形成铅锡合金焊料电镀膜或铅锡合金焊料凸块电极的铅锡合金焊料电镀液，每个电极具有高电流密度，光滑表面，并且还具有降低高度变化。铅锡合金焊料电镀液由以下组成：选自酸及其盐中的至少一种; 一种可溶性锡化合物; 可溶性铅化合物; 非离子表面活性剂; 萘磺酸的福尔马林缩合物或其盐; 和水。萘磺酸或其盐的福尔马林缩合物的含铅量为0.02〜1.50质量％。版权所有（C）2006，JPO＆NCIPI

26. 发明专利

JP2005002368A Tin plating bath for preventing whisker 审中-公开
标题翻译： TIN镀层防锈罩
公开(公告)号：JP2005002368A
公开(公告)日：2005-01-06
申请号：JP2003164211
申请日：2003-06-09
申请人： Daiwa Fine Chemicals Co Ltd (Laboratory) , Ishihara Chem Co Ltd , 株式会社大和化成研究所 , 石原薬品株式会社
发明人： TSUJI SEIKI , SAKURAI MEGUMI , UCHIDA MAMORU , OBATA KEIGO , YOSHIMOTO MASAKAZU
IPC分类号： C25D3/30 , C25D7/12
摘要： PROBLEM TO BE SOLVED: To effectively prevent tin whiskers by controlling the composition of a plating bath without performing heating treatment or the like. SOLUTION: The tin plating bath comprises soluble stannous salt, and whisker inhibition metal selected from the group consisting of vanadium, nickel and bismuth. Also, the content of the whisker inhibition metal is 100 to 2,000 ppm to the plating bath. Since the whisker inhibition metal is contained in a trace concentration or higher, tin whiskers in a plating film can effectively be prevented. Further, cobalt, indium, zinc or the like can be used as whisker inhibition metal, and tin whiskers can be prevented by the content of ≥20 or 10 ppm (the upper limit is 2,000 ppm, respectively) of the metal. COPYRIGHT: (C)2005,JPO&NCIPI
摘要翻译：待解决的问题：通过在不进行加热处理等的情况下控制镀浴的组成来有效地防止锡晶须。锡溶液包含可溶性亚锡盐和选自钒，镍和铋的晶须抑制金属。此外，晶须抑制金属的含量相对于电镀浴为100〜2000ppm。由于晶须抑制金属含有微量浓度以上，因此能够有效地防止镀膜中的锡须。此外，可以使用钴，铟，锌等作为晶须抑制金属，并且可以通过金属的≥20或10ppm（分别为上限为2000ppm）的含量来防止锡晶须。版权所有（C）2005，JPO＆NCIPI

27. 发明专利

JP2004244711A METHOD OF PRODUCING TIN ALLOY LOW IN α RAY 有权
公开(公告)号：JP2004244711A
公开(公告)日：2004-09-02
申请号：JP2003038661
申请日：2003-02-17
申请人： Daiwa Fine Chemicals Co Ltd (Laboratory) , Harima Chem Inc , ハリマ化成株式会社 , 株式会社大和化成研究所
发明人： IKEDA KAZUTERU , KUMAMOTO SATOSHI , IRIE HISAO , OBATA KEIGO , TAKEUCHI TAKAO
IPC分类号： B23K35/26 , B23K35/40 , C22B3/46 , C22B25/08 , C22C13/00 , H05K3/34
CPC分类号： Y02P10/234
摘要： PROBLEM TO BE SOLVED: To provide a method of simply and inexpensively producing a tin alloy reduced in the amount of α rays and suitable to a soldering material for electronic components or the like. SOLUTION: In the method of producing a low α ray tin alloy, a composition containing tin powder including lead as impurities and the salt or complex of metal having an ionization tendency lower than that of lead such as silver and copper is heated, so that a low α ray tin alloy is precipitated. When the tin alloy obtained thereby is applied to a soldering material, errors of memory in a semiconductor or the like are suppressed, and the reliability of an electronic component can be improved. COPYRIGHT: (C)2004,JPO&NCIPI

28. 发明专利

JP2004161632A Antibacterial, bactericidal or antifungal silver colloid composition and product utilizing the composition 有权
标题翻译：抗生素，杀菌剂或抗真菌胶体组合物和使用组合物的产品
公开(公告)号：JP2004161632A
公开(公告)日：2004-06-10
申请号：JP2002326659
申请日：2002-11-11
申请人： Daiwa Fine Chemicals Co Ltd (Laboratory) , 株式会社大和化成研究所
发明人： OKUHAMA YOSHIAKI , OBATA KEIGO , YOSHIMOTO MASAKAZU , KIN TOUKEN
IPC分类号： A41B9/00 , A01N25/04 , A01N37/02 , A01N37/44 , A01N41/04 , A01N59/16 , A01N59/26 , A41B17/00 , A61F13/15 , A61F13/472 , A61F13/49 , A61K8/00 , A61K8/02 , A61K8/19 , A61K8/23 , A61K8/24 , A61K8/36 , A61K8/365 , A61K8/368 , A61K8/46 , A61L9/00 , A61L9/01 , A61L9/18 , A61Q5/00 , A61Q11/00 , A61Q15/00 , A61Q17/04 , A61Q19/00 , A61Q19/10 , B01D11/04 , B01J13/00 , C08K3/08 , C08K3/10 , C08K3/32 , C08K5/09 , C08L101/00 , A61K7/00 , A61K7/06 , A61K7/16 , A61K7/32 , A61K7/42 , A61K7/48 , A61K7/50
摘要： PROBLEM TO BE SOLVED: To provide an antibacterial, bactericidal or antifungal composition containing silver colloid.
SOLUTION: This composition contains at least the following ingredients (A), (B) and (C) as essential ingredients. (A) Silver colloid. (B) A metal ion having an electric potential capable of reducing silver ion to metal silver in a solution. (C) A counter ion or (or) a complexing agent for dissolving the metal ion in an aqueous solution.
COPYRIGHT: (C)2004,JPO
摘要翻译：要解决的问题：提供含有银胶体的抗菌，杀菌或抗真菌组合物。解决方案：该组合物至少包含以下成分（A），（B）和（C）作为必需成分。（A）银胶体。（B）在溶液中具有能够将银离子还原成金属银的电位的金属离子。（C）将金属离子溶解在水溶液中的抗衡离子或（或）络合剂。版权所有（C）2004，JPO

29. 发明专利

JP2012172190A Sealing agent solution, and sealing method using the same 有权
标题翻译：密封剂溶液和使用其的密封方法
公开(公告)号：JP2012172190A
公开(公告)日：2012-09-10
申请号：JP2011034739
申请日：2011-02-21
申请人： Daiwa Fine Chemicals Co Ltd (Laboratory) , 株式会社大和化成研究所
发明人： SOGAWA AKIHIRO , NISHIMOTO YOSHIHIRO , YOSHIMOTO MASAKAZU
IPC分类号： C23C26/00
摘要： PROBLEM TO BE SOLVED: To provide a water-based sealing agent solution which does not contain organic solvents causing environmental pollution, is capable of carrying out a treatment without energization so as to respond to the treatment of a recent device with a small size and a high density, and is capable of carrying out the sealing treatment selectively and quantitatively to parts to be treated; and to provide a sealing method using the same.SOLUTION: The sealing agent solution for plating materials of noble metals or noble metal alloys includes: a nitrogen-containing five-membered cyclic compound having a mercapto group and not containing a benzene ring, as a first component; a linear alkane thiol having a carbon number of 10 or more and 20 or less, as a second component; and a nonionic surfactant, as a third component.
摘要翻译：要解决的问题：为了提供不含有引起环境污染的有机溶剂的水性密封剂溶液，能够在不通电的情况下进行处理，以便对具有小的尺寸和高密度，并且能够对待处理的部件选择性和定量地进行密封处理; 并提供使用该密封方法的密封方法。解决方案：贵金属或贵金属合金电镀材料的密封剂溶液包括：具有巯基并且不含苯环的含氮五元环化合物作为第一组分; 碳数为10以上且20以下的直链烷烃硫醇作为第二成分; 和非离子表面活性剂，作为第三组分。版权所有（C）2012，JPO＆INPIT

30. 发明专利

JP2010265491A Bath for tin or tin-alloy plating, and barrel-plating process using the plating bath 有权
标题翻译：用于镀锡或锡合金镀层的浴槽，以及使用镀锌浴的棒材工艺
公开(公告)号：JP2010265491A
公开(公告)日：2010-11-25
申请号：JP2009115600
申请日：2009-05-12
申请人： Daiwa Fine Chemicals Co Ltd (Laboratory) , Ishihara Chem Co Ltd , 株式会社大和化成研究所 , 石原薬品株式会社
发明人： NISHIKAWA TETSUJI , TSUJI SEIKI , SASAYAMA HIROAKI , YOSHIMOTO MASAKAZU
IPC分类号： C25D3/32 , C25D3/56
摘要： PROBLEM TO BE SOLVED: To provide a plating bath which can enhance the uniformity and the like of a plated film in a wide range of current density, impart an adequate appearance and soldering characteristics to the plated film, and prevent the aggregation among electroconductive media and among articles to be plated, in a barrel-plating process. SOLUTION: A bath for tin or tin-alloy plating includes: (A) a soluble salt formed of either a stannous salt or a mixture of the stannous salt and a salt of a metal selected from the group consisting of silver, copper, bismuth, indium, zinc, antimony, nickel and lead; (B) an acid or a salt thereof; and (C) a dibenzazole disulfide sulfonate compound specifically such as dibenzothiazolyl disulphide disodium disulfonate. Because of including the compound (C), the plating bath can enhance the uniformity and smoothness of the film in the wide range of the current density, impart the superior appearance and soldering characteristics to the film, and prevent the aggregation among the electroconductive media, when having applied to a barrel-plating process. COPYRIGHT: (C)2011,JPO&INPIT
摘要翻译：要解决的问题：为了提供能够在宽的电流密度范围内提高电镀膜的均匀性等的镀液，赋予镀膜足够的外观和焊接特性，并且防止电镀膜之间的聚集导电介质和要镀覆的物品之间的电镀工艺。解决方案：用于锡或锡合金镀层的浴包括：（A）由亚锡盐或亚锡盐和选自银，铜的金属盐的混合物形成的可溶性盐，铋，铟，锌，锑，镍和铅; （B）酸或其盐; 和（C）二苯并唑二硫化物磺酸盐化合物，特别是二苯并噻唑基二硫化二磺酸二钠二钠。由于含有化合物（C），电镀液可以在电流密度的宽范围内提高膜的均匀性和平滑性，赋予膜优异的外观和焊接特性，并且防止导电介质之间的聚集，当应用于滚镀工艺时。版权所有（C）2011，JPO＆INPIT

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