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21. 发明申请

US20100246127A1 HEAT DISSIPATION DEVICE AND METHOD FOR MANUFACTURING THE SAME 有权
标题翻译：散热装置及其制造方法
公开(公告)号：US20100246127A1
公开(公告)日：2010-09-30
申请号：US12500615
申请日：2009-07-10
申请人： XIN-LEI LIU , JIN-BIAO LIU , HONG-CHENG YANG , CHUN-CHI CHEN
发明人： XIN-LEI LIU , JIN-BIAO LIU , HONG-CHENG YANG , CHUN-CHI CHEN
IPC分类号： H05K7/20 , B23P11/00
CPC分类号： H01L23/427 , F28D15/0233 , F28D15/0266 , F28D15/0275 , H01L23/467 , H01L2924/0002 , Y10T29/49826 , H01L2924/00
摘要： A heat dissipation device for dissipating heat from an electronic component mounted on a printed circuit board, includes a fin unit, a centrifugal fan located adjacent to the fin unit, a heat-conducting board attached to the electronic component and a heat pipe thermally connecting the fin unit and the electronic component. An engaging portion protrudes upwardly from a top face of the heat-conducting board. The heat pipe has an evaporating section extending through the engaging portion and being fixed to the top face of the heat-conducting board, and a condensing section attached to the fin unit.
摘要翻译：一种用于从安装在印刷电路板上的电子部件散热的散热装置，包括翅片单元，邻近翅片单元的离心风扇，附着在电子部件上的导热板，以及热连接翅片单元和电子部件。接合部从导热板的顶面向上突出。热管具有延伸穿过接合部分并且固定到导热板的顶面的蒸发部分和连接到散热片单元的冷凝部分。

22. 发明申请

US20100243229A1 HEAT SINK AND METHOD OF MANUFACTURING THE SAME 有权
标题翻译：散热器及其制造方法
公开(公告)号：US20100243229A1
公开(公告)日：2010-09-30
申请号：US12506213
申请日：2009-07-20
申请人： PENG LIU , GUO CHEN , SHI-WEN ZHOU , CHUN-CHI CHEN
发明人： PENG LIU , GUO CHEN , SHI-WEN ZHOU , CHUN-CHI CHEN
IPC分类号： F28F7/00 , B21D53/02
CPC分类号： B21D53/085 , H01L2924/0002 , Y10T29/4935 , H01L2924/00
摘要： A heat sink includes a base with a plurality of recesses defined therein, a plurality of columned fins each having a head and a body extending from the head, and a cover joining with the base. Each head is received in and higher than a corresponding recess of the base. The heads are sandwiched between the cover and the base, whereby the columned fins are secured on the base. A portion of the cover contacting the head of each of the columned fins protrudes to form a deformed part. A method of manufacturing the heat sink is also disclosed.
摘要翻译：散热器包括：基部，其具有限定在其中的多个凹部;多个柱状散热片，各自具有从头部延伸的头部和主体;以及与基部接合的盖。每个头部被接收在基座的相应凹部中并且高于基座的相应凹部。头部被夹在盖和基座之间，由此将柱状翅片固定在基座上。接触每个柱状翅片的头部的盖的一部分突出以形成变形部分。还公开了一种制造散热器的方法。

23. 发明申请

US20100234978A1 METHOD FOR FINDING THE CORRELATION BETWEEN THE TOOL PM AND THE PRODUCT YIELD 有权
标题翻译：发现工具PM与产品之间的相关性的方法
公开(公告)号：US20100234978A1
公开(公告)日：2010-09-16
申请号：US12507396
申请日：2009-07-22
申请人： YI FENG LEE , Chun Chi Chen , Yun-Zong Tian , Wei Jun Chen , Tsung-Wei Lin
发明人： YI FENG LEE , Chun Chi Chen , Yun-Zong Tian , Wei Jun Chen , Tsung-Wei Lin
IPC分类号： G06F17/00
CPC分类号： G06Q10/06
摘要： A method for finding the correlation between tool PM (prevention maintenance) and the product yield of the tool is disclosed. The method uses a moving average method to magnify a curve trend that is formed by the product yield data that is captured during a predetermined days before PM and after PM. The magnified curve trend is shown by a Cumulative sum chart. The Cumulative sum chart is analyzed for informing related workers of the effect between the tool PM and the product yield, so as to accurately estimate PM timing. Thereby, via the method, the effect between the tool PM and the product yield may be determined, which serves as an important reference for workers to execute further PM.
摘要翻译：公开了一种用于找到工具PM（防止维护）与工具的产品收益之间的相关性的方法。该方法使用移动平均法来放大由PM和PM之后的预定日期捕获的产品产量数据形成的曲线趋势。放大曲线趋势由累积和图表示。分析累积总和图，通知相关工作者工具PM与产品产量之间的影响，以准确估计PM定时。因此，通过该方法，可以确定工具PM和产品产量之间的效果，其作为工人进一步执行PM的重要参考。

24. 发明申请

US20100205127A1 METHOD FOR PLANNING A SEMICONDUCTOR MANUFACTURING PROCESS BASED ON USERS' DEMANDS 有权
标题翻译：基于用户需求制定半导体制造工艺的方法
公开(公告)号：US20100205127A1
公开(公告)日：2010-08-12
申请号：US12471711
申请日：2009-05-26
申请人： WEI JUN CHEN , CHUN CHI CHEN , YUN-ZONG TIAN , YI FENG LEE , TSUNG-WEI LIN
发明人： WEI JUN CHEN , CHUN CHI CHEN , YUN-ZONG TIAN , YI FENG LEE , TSUNG-WEI LIN
IPC分类号： G06N3/12 , G06N7/02 , G06F19/00
CPC分类号： G06N3/126 , G06N7/02
摘要： A method for planning a semiconductor manufacturing process based on users' demands includes the steps of: establishing a genetic algorithm model and inputting data; establishing a fuzzy system and setting one output parameter representing percent difference of each cost function in neighbor generations; setting to have a modulation parameter corresponding to each input parameter for adjusting fuzzy sets of the output parameter; executing genetic algorithm actions; executing fuzzy inference actions; eliminating chromosomes that produce output parameter smaller than a defined lower limit, and the remaining chromosomes that produces the largest output parameter is defined as the optimum chromosome, wherein the genetic algorithm actions stops being executed upon the optimum chromosome; then determining whether or not a defined number of generations has been reached, if yes, executing the optimum chromosome of the last generation; if no, continuing executing the genetic algorithm actions, thereby finding the optimum semiconductor manufacturing process for users.
摘要翻译：一种基于用户需求的半导体制造过程规划方法，包括以下步骤：建立遗传算法模型并输入数据; 建立一个模糊系统，并设置一个输出参数，代表相邻代的每个成本函数的百分比差; 设置为具有对应于每个输入参数的调制参数，用于调整输出参数的模糊集合; 执行遗传算法动作; 执行模糊推理动作; 消除产生小于规定下限的输出参数的染色体，将产生最大输出参数的剩余染色体定义为最佳染色体，其中遗传算法动作停止在最佳染色体上执行; 然后确定是否已经达到定义数量的世代，如果是，则执行最后一代的最佳染色体; 如果否，继续执行遗传算法动作，从而为用户找到最佳的半导体制造过程。

25. 发明申请

US20100116467A1 HEAT DISSIPATION DEVICE 审中-公开
标题翻译：散热装置
公开(公告)号：US20100116467A1
公开(公告)日：2010-05-13
申请号：US12269051
申请日：2008-11-12
申请人： WU LI , YI-QIANG WU , CHUN-CHI CHEN
发明人： WU LI , YI-QIANG WU , CHUN-CHI CHEN
IPC分类号： F28D15/00
CPC分类号： F28D15/0275 , F28F1/32 , H01L23/3672 , H01L23/427 , H01L23/467 , H01L2924/0002 , H01L2924/00
摘要： A heat dissipation device includes a plurality of fins stacked together, a plurality of heat pipes extending through the fins, and solder filled in gaps between the fins and the heat pipes. Each fin includes a plate defining a plurality of holes therein for extension of the heat pipes therethrough, respectively. A collar extends from a periphery of each of the holes. The collar includes a columned portion attached to an outer surface of each of the heat pipes, and a taper portion interconnecting the plate and the columned portion. The solder fills in a gap between the columned portion and a corresponding heat pipe and a space between the taper portion and the corresponding heat pipe. The collar has a height slightly smaller than a distance between two adjacent fins.
摘要翻译：散热装置包括堆叠在一起的多个翅片，延伸穿过翅片的多个热管，以及填充在翅片和热管之间的间隙中的焊料。每个翅片包括限定多个孔的板，分别用于使热管延伸通过其中。套环从每个孔的周边延伸。套环包括附接到每个热管的外表面的柱状部分和将板和柱状部分互连的锥形部分。焊料填充在柱状部分和对应的热管之间的间隙以及锥形部分和相应的热管之间的空间。套环的高度略小于两个相邻鳍片之间的距离。

26. 发明申请

US20100116462A1 HEAT DISSIPATION SYSTEM 审中-公开
标题翻译：散热系统
公开(公告)号：US20100116462A1
公开(公告)日：2010-05-13
申请号：US12432739
申请日：2009-04-29
申请人： MENG FU , JIE-CHENG DENG , CHUN-CHI CHEN
发明人： MENG FU , JIE-CHENG DENG , CHUN-CHI CHEN
IPC分类号： F28F7/00
CPC分类号： H01L23/467 , F28F3/02 , H01L23/4006 , H01L2924/0002 , H01L2924/00
摘要： A heat dissipation system comprises a printed circuit board and at least a heat dissipation device mounted on the printed circuit board for dissipating heat generated by an electronic member mounted on the printed circuit board. The at least a heat dissipation device comprises a base, a plurality of fins extending upwardly from the base and an air guiding member located at a corner of the base. These fins are spaced from each other to define a plurality of heat exchange passages. Non-fins are disposed at a side of the base to define a cooling air passage. The cooling air passage is parallel to the heat exchange passages of the fins. The air guiding member is located in the cooling air passage for controlling open and close of the cooling air passage.
摘要翻译：散热系统包括印刷电路板和至少一个安装在印刷电路板上的用于散发由安装在印刷电路板上的电子部件产生的热量的散热装置。所述至少一个散热装置包括底座，从底座向上延伸的多个翅片以及位于底座角落处的空气引导构件。这些翅片彼此间隔开以限定多个热交换通道。非翅片设置在基座的一侧以限定冷却空气通道。冷却空气通道平行于翅片的热交换通道。空气引导构件位于冷却空气通道中，用于控制冷却空气通道的打开和关闭。

27. 发明申请

US20100096107A1 HEAT DISSIPATION DEVICE 失效
标题翻译：散热装置
公开(公告)号：US20100096107A1
公开(公告)日：2010-04-22
申请号：US12391170
申请日：2009-02-23
申请人： ZHI-SHENG LIAN , GEN-PING DENG , CHUN-CHI CHEN
发明人： ZHI-SHENG LIAN , GEN-PING DENG , CHUN-CHI CHEN
IPC分类号： F28F7/00
CPC分类号： F28D15/0233 , F28D15/0275 , H01L23/3672 , H01L23/427 , H01L23/467 , H01L2924/0002 , H01L2924/00
摘要： A heat dissipation device for removing heat from an electronic device and electronic components, includes a base plate in contact with the electronic device, a first fin set and a second fin set mounted on the base plate. The first fin set includes a plurality of first fins perpendicularly arranged on the base plate. The second fin set includes a plurality of second fins attached to a lateral side of the first fin set and perpendicular to both the first fins and the base plate. A fan is mounted on tops of the first fin set and the second fin set to cover both of them. Air generated by the fan flows through the first and second fin sets to cool the electronic components mounted on orthogonally neighboring sides of the heat dissipation device.
摘要翻译：一种用于从电子设备和电子部件移除热量的散热装置，包括与电子设备接触的基板，安装在基板上的第一散热片组和第二散热片组。第一翅片组包括垂直布置在基板上的多个第一翅片。第二翅片组包括附接到第一翅片组的横向侧并垂直于第一翅片和底板的多个第二翅片。风扇安装在第一散热片组的顶部上，第二散热片设置成覆盖它们。由风扇产生的空气流过第一和第二翅片组，以冷却安装在散热装置正交相邻侧面上的电子部件。

28. 发明申请

US20100034309A1 MULTIPLE INPUT MULTIPLE OUTPUT ANTENNA SYSTEM, SIGNAL TRANSMISSION METHOD, SIGNAL TRANSMISSION APPARATUS, AND COMPUTER PROGRAM PRODUCT FOR THE MULTIPLE INPUT MULTIPLE OUTPUT ANTENNA SYSTEM 有权
标题翻译：多输入多输出天线系统，信号传输方法，信号传输装置和多输入多输出天线系统的计算机程序产品
公开(公告)号：US20100034309A1
公开(公告)日：2010-02-11
申请号：US12349248
申请日：2009-01-06
申请人： Hsuan-Jung Su , Wei-Shun Liao , Chia-Yi Huang , Chun-Chi Chen , Kun-Hung Lee
发明人： Hsuan-Jung Su , Wei-Shun Liao , Chia-Yi Huang , Chun-Chi Chen , Kun-Hung Lee
IPC分类号： H04B7/02
CPC分类号： H04B7/0413
摘要： A multiple input multiple output (MIMO) antenna system, a signal transmission method, a signal transmission apparatus and a computer program product for the MIMO antenna system are provided. The signal transmission method comprises the following steps of transmitting a signal with a first signal transmission mode and a first transmission power via a signal transmission channel; receiving a signal to noise ratio (SNR) of the signal; receiving an interference value of the signal transmission channel; obtaining a power weight value according to the interference value; determining a system threshold of the signal transmission channel to the SNR of the signal; determining a second signal transmission mode of the signal transmission channel based on the system threshold; and determining a second transmission power of the signal transmission channel according to the power weight value.
摘要翻译：提供了一种用于MIMO天线系统的多输入多输出（MIMO）天线系统，信号传输方法，信号传输装置和计算机程序产品。信号传输方法包括以下步骤：经由信号传输通道发送具有第一信号传输模式和第一传输功率的信号; 接收信号的信噪比（SNR）; 接收信号传输信道的干扰值; 根据干扰值获得功率权重值; 确定所述信号传输信道的系统阈值与所述信号的SNR; 基于系统阈值确定信号传输信道的第二信号传输模式; 以及根据所述功率权重值确定所述信号传输信道的第二传输功率。

29. 发明申请

US20100025012A1 HEAT SINK ASSEMBLY 失效
标题翻译：散热装置
公开(公告)号：US20100025012A1
公开(公告)日：2010-02-04
申请号：US12185125
申请日：2008-08-04
申请人： YI-QIANG WU , CHUN-CHI CHEN
发明人： YI-QIANG WU , CHUN-CHI CHEN
IPC分类号： F28F7/00
CPC分类号： H01L23/467 , F28D15/0266 , F28D15/0275 , F28F1/32 , H01L23/3672 , H01L23/4006 , H01L23/427 , H01L2924/0002 , H01L2924/00
摘要： A heat sink assembly includes a base, a fin group located at a top of the base, a heat pipe connecting the base with the fin group, a fan mounted on a side of the fin group and a supporting bracket mounted on the base and supporting the fan. The supporting bracket includes a mounting portion secured on the base and a pair of supporting arms extending from the mounting portion and fixed to the fan. Four screws extend through the fan to threadedly engage with the fin group. Lower two of the screws also extend through the supporting arms of the supporting bracket whereby the supporting bracket also connects with the fan.
摘要翻译：一种散热器组件，包括基座，位于基座顶部的翅片组，将基座与翅片组连接的热管，安装在翅片组侧面的风扇和安装在基座上的支撑支架风扇。支撑托架包括固定在基座上的安装部分和从安装部分延伸并固定到风扇的一对支撑臂。四个螺丝穿过风扇，与翅片组螺纹接合。下部两个螺钉也延伸穿过支撑托架的支撑臂，由此支撑托架也与风扇连接。

30. 发明申请

US20100010763A1 METHOD FOR DETECTING VARIANCE IN SEMICONDUCTOR PROCESSES 审中-公开
标题翻译：用于检测半导体工艺中的变化的方法
公开(公告)号：US20100010763A1
公开(公告)日：2010-01-14
申请号：US12202631
申请日：2008-09-02
申请人： YIJ CHIEH CHU , CHUN CHI CHEN , YUN-ZONG TIAN , YI FENG LEE
发明人： YIJ CHIEH CHU , CHUN CHI CHEN , YUN-ZONG TIAN , YI FENG LEE
IPC分类号： G06F19/00
CPC分类号： G05B23/024 , G05B23/0294 , G05B2219/37224
摘要： A method of detecting variance by regression model is disclosed. Said method comprising: preparing the FDC and WAT data for analysis, figuring out what latent variable effect WAT by Factor Analysis, utilizing Principal Component Analysis to reduce the number of FDC variables to a few independent principal components, demonstrating how the tool and FDC affect WAT by Analysis of covariance model, and constructing interrelationship among FDC, WAT and tools. The interrelationship can point out which parameter effect WAT significantly. By the method, when WAT abnormal situation happened, it is easier for engineers to trace where the problem is.
摘要翻译：公开了一种通过回归模型检测方差的方法。所述方法包括：准备用于分析的FDC和WAT数据，通过因子分析确定潜在变量效应WAT，利用主成分分析将FDC变量数量减少到少数独立主成分，证明工具和FDC如何影响WAT 通过协方差模型分析，构建FDC，WAT和工具之间的相互关系。相互关系可以显着地指出哪个参数效应WAT。通过这种方法，当WAT异常情况发生时，工程师更容易追踪问题的位置。

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