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    • 1. 发明申请
    • METHOD FOR PLANNING A SEMICONDUCTOR MANUFACTURING PROCESS BASED ON USERS' DEMANDS
    • 基于用户需求制定半导体制造工艺的方法
    • US20100205127A1
    • 2010-08-12
    • US12471711
    • 2009-05-26
    • WEI JUN CHENCHUN CHI CHENYUN-ZONG TIANYI FENG LEETSUNG-WEI LIN
    • WEI JUN CHENCHUN CHI CHENYUN-ZONG TIANYI FENG LEETSUNG-WEI LIN
    • G06N3/12G06N7/02G06F19/00
    • G06N3/126G06N7/02
    • A method for planning a semiconductor manufacturing process based on users' demands includes the steps of: establishing a genetic algorithm model and inputting data; establishing a fuzzy system and setting one output parameter representing percent difference of each cost function in neighbor generations; setting to have a modulation parameter corresponding to each input parameter for adjusting fuzzy sets of the output parameter; executing genetic algorithm actions; executing fuzzy inference actions; eliminating chromosomes that produce output parameter smaller than a defined lower limit, and the remaining chromosomes that produces the largest output parameter is defined as the optimum chromosome, wherein the genetic algorithm actions stops being executed upon the optimum chromosome; then determining whether or not a defined number of generations has been reached, if yes, executing the optimum chromosome of the last generation; if no, continuing executing the genetic algorithm actions, thereby finding the optimum semiconductor manufacturing process for users.
    • 一种基于用户需求的半导体制造过程规划方法,包括以下步骤:建立遗传算法模型并输入数据; 建立一个模糊系统,并设置一个输出参数,代表相邻代的每个成本函数的百分比差; 设置为具有对应于每个输入参数的调制参数,用于调整输出参数的模糊集合; 执行遗传算法动作; 执行模糊推理动作; 消除产生小于规定下限的输出参数的染色体,将产生最大输出参数的剩余染色体定义为最佳染色体,其中遗传算法动作停止在最佳染色体上执行; 然后确定是否已经达到定义数量的世代,如果是,则执行最后一代的最佳染色体; 如果否,继续执行遗传算法动作,从而为用户找到最佳的半导体制造过程。
    • 4. 发明申请
    • METHOD FOR PREDICTING AND WARNING OF WAFER ACCEPTANCE TEST VALUE
    • WAFER接受测试值的预测和警告方法
    • US20110112999A1
    • 2011-05-12
    • US12703999
    • 2010-02-11
    • YI-FENG LEESHIH CHANG KAOYUN-ZONG TIANWEI JUN CHEN
    • YI-FENG LEESHIH CHANG KAOYUN-ZONG TIANWEI JUN CHEN
    • G06N3/10G06F15/18
    • H01L22/20
    • A method for predicting and warning of WAT value includes the steps as follows. A key process is selected and a WAT value after finishing the key process is used as a predictive goal. A predicting model is built. One batch or plural batches of predictive wafers are prepared, and a Fault Detection and Classification data (FDC data) and a metrology data from the predictive wafers of the key process are collected. The FDC data and the metrology data collected from the predictive wafers are inputted into the predicting model for processing a normal predicting procedure, and a predictive WAT value by the predicting model is outputted. The present invention can accurately predict the WAT value, effectively monitor some specific defective wafers and continuously perform the improvement for the specific defective wafer.
    • WAT值的预测和预警方法包括以下步骤。 选择关键过程,完成关键过程后的WAT值作为预测目标。 建立了预测模型。 准备一批或多批预测晶片,并且收集来自关键过程的预测晶片的故障检测和分类数据(FDC数据)和度量数据。 从预测晶片收集的FDC数据和计量数据被输入到用于处理正常预测过程的预测模型中,并且输出由预测模型的预测WAT值。 本发明可以准确地预测WAT值,有效地监视一些特定的缺陷晶片,并且连续地对特定缺陷晶片进行改进。