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1. 发明授权

US08510610B2 Method and system of compressing raw fabrication data for fault determination 有权
标题翻译：压缩原始制造数据进行故障确定的方法和系统
公开(公告)号：US08510610B2
公开(公告)日：2013-08-13
申请号：US13240305
申请日：2011-09-22
申请人： Yij Chieh Chu , Yun-Zong Tian
发明人： Yij Chieh Chu , Yun-Zong Tian
IPC分类号： G06F11/00
CPC分类号： G05B23/0254 , G06F11/0754 , G06F11/3013 , G06F11/3082
摘要： The instant disclosure relates to a raw data compression method for the fabrication process. The method includes the steps of: inputting into a signal converter a collection of raw data points representing operational parameter of a semiconductor equipment within a predetermined time period; obtaining an approximation of the raw data points with a Fourier series; computing the Fourier coefficients and the residuals between the raw data points and the corresponding predicted values predicted by the Fourier series; determining if the residuals exceed an error threshold; recording and storing the Fourier coefficients as the compressed data if none of the residuals exceeds the error threshold; and recording the raw data point as abnormal data point if the corresponding residual exceeds the error threshold before recording and storing the Fourier coefficients and the abnormal data point as the compressed data.
摘要翻译：本公开涉及用于制造过程的原始数据压缩方法。该方法包括以下步骤：在预定时间段内向信号转换器输入表示半导体设备的操作参数的原始数据点的集合; 用傅里叶级数获得原始数据点的近似值; 计算傅里叶系数和原始数据点之间的残差与由傅立叶级数预测的对应预测值; 确定残差是否超过误差阈值; 如果没有残差超过误差阈值，则将傅立叶系数作为压缩数据进行记录和存储; 并且如果在记录和存储傅立叶系数和异常数据点作为压缩数据之前相应的残差超过误差阈值，则将原始数据点记录为异常数据点。

2. 发明申请

US20110153660A1 METHOD OF SEARCHING FOR KEY SEMICONDUCTOR OPERATION WITH RANDOMIZATION FOR WAFER POSITION 审中-公开
标题翻译：搜索用于主要半导体操作的方法用于放置位置的随机化
公开(公告)号：US20110153660A1
公开(公告)日：2011-06-23
申请号：US13040633
申请日：2011-03-04
申请人： YIJ CHIEH CHU , CHUN CHI CHEN , YUN-ZONG TIAN , CHENG-HAO CHEN
发明人： YIJ CHIEH CHU , CHUN CHI CHEN , YUN-ZONG TIAN , CHENG-HAO CHEN
IPC分类号： G06F17/30
CPC分类号： G05B19/41875 , G05B2219/32221 , G05B2219/45031 , H01L22/20 , Y02P90/22
摘要： A method of searching for the key semiconductor operation with randomization for wafer position, comprising: recording the wafer position and the wafer yields of a plurality of wafer ID respectively corresponding to a plurality of semiconductor operations; establishing a matrix model which describes the matrix set for wafer yields of the plurality of wafer ID; analyzing the matrix model, further computing the matrix set for wafer yields of the wafer ID, thereby acquiring the weightings of the randomized wafer positions in such semiconductor operations; and searching for a key semiconductor operation among the plurality of semiconductor operations; herein, by using a local regression model to estimate the wafer position effect, computing the weighting of the position effect in each semiconductor operation based on the estimated position effect and the randomized wafer yield, higher weighting thereof indicates the key semiconductor operation having greater position effect in the aforementioned semiconductor process.
摘要翻译：一种用于晶片位置的随机化搜索密钥半导体操作的方法，包括：分别记录分别对应于多个半导体操作的多个晶片ID的晶片位置和晶片产量; 建立描述多个晶片ID的晶片产量的矩阵集合的矩阵模型; 分析矩阵模型，进一步计算晶片ID的晶片产量的矩阵集，从而在这种半导体操作中获得随机晶片位置的权重; 以及在所述多个半导体操作中搜索密钥半导体操作; 在本文中，通过使用局部回归模型来估计晶片位置效应，基于估计的位置效应和随机晶片产量计算每个半导体操作中的位置效应的加权，其较高的加权指示具有较大位置效应的关键半导体操作在上述半导体工艺中。

3. 发明授权

US08244500B2 Method of adjusting wafer processing sequence 有权
标题翻译：调整晶圆加工顺序的方法
公开(公告)号：US08244500B2
公开(公告)日：2012-08-14
申请号：US12476559
申请日：2009-06-02
申请人： Yun-Zong Tian , Chun Chi Chen , Yi Feng Lee , Wei Jun Chen , Shih Chang Kao , Yij Chieh Chu , Cheng-Hao Chen
发明人： Yun-Zong Tian , Chun Chi Chen , Yi Feng Lee , Wei Jun Chen , Shih Chang Kao , Yij Chieh Chu , Cheng-Hao Chen
IPC分类号： G06F11/30 , G06F19/00
CPC分类号： G05B19/41865 , G05B2219/32015 , G05B2219/32016 , G05B2219/32019 , G05B2219/45031 , Y02P90/20
摘要： A method of adjusting wafer process sequence includes steps of collecting production parameters for a plurality of lots; selecting a plurality of key parameters from the production parameters, wherein the key parameters at least includes a processing sequence; defining a formula to obtain an epsilon value; categorizing the lots into groups according to the epsilon value and the minimum point number by using density-based spatial clustering of application with noise (DBSCAN); and adjusting the processing sequences of the lots in the groups. Thereby, the lots with the same process recipe can be continuously or simultaneously sent into a machine, thereby reducing replacement of process recipes or shortening machine idle time.
摘要翻译：调整晶片工艺顺序的方法包括收集多个批次的生产参数的步骤; 从所述生产参数中选择多个关键参数，其中所述关键参数至少包括处理序列; 定义公式以获得ε值; 通过使用基于密度的噪声空间聚类（DBSCAN），根据ε值和最小点数将批次分组成组。并调整组中批次的处理顺序。因此，具有相同处理配方的批次可以连续或同时发送到机器中，从而减少过程配方的更换或缩短机器空闲时间。

4. 发明申请

US20110257932A1 METHOD FOR DETECTING VARIANCE IN SEMICONDUCTOR PROCESSES 有权
标题翻译：用于检测半导体工艺中的变化的方法
公开(公告)号：US20110257932A1
公开(公告)日：2011-10-20
申请号：US13170229
申请日：2011-06-28
申请人： YIJ CHIEH CHU , CHUN CHI CHEN , YUN-ZONG TIAN
发明人： YIJ CHIEH CHU , CHUN CHI CHEN , YUN-ZONG TIAN
IPC分类号： G06F19/00
CPC分类号： G05B23/0221 , G05B2219/37224
摘要： A method of detecting variance by regression model has the following steps. Step 1 is preparing the FDC data and WAT data for analysis. Step 2 is figuring out what latent variable effect of WAT data by Factor Analysis Step 3 is utilizing Principal Component Analysis to reduce the number of FDC variables to a few independent principal components. Step 4 is demonstrating how the tools and FDC data affect WAT data by Analysis of covariance model, and constructing interrelationship among FDC, WAT and tools. The interrelationship can point out which parameter effect WAT significantly. By the method, when WAT abnormal situation happened, it is easier for engineers to trace where the problem is.
摘要翻译：通过回归模型检测方差的方法具有以下步骤。步骤1正在准备FDC数据和WAT数据进行分析。第2步是通过因子分析步骤3来确定WAT数据的潜在变量效应是否利用主成分分析将FDC变量的数量减少到少数独立的主成分。第4步演示了工具和FDC数据如何通过分析协方差模型影响WAT数据，并构建FDC，WAT和工具之间的相互关系。相互关系可以显着地指出哪个参数效应WAT。通过这种方法，当WAT异常情况发生时，工程师更容易追踪问题的位置。

5. 发明申请

US20110093226A1 FAULT DETECTION AND CLASSIFICATION METHOD FOR WAFER ACCEPTANCE TEST PARAMETERS 审中-公开
标题翻译：用于波形接收测试参数的故障检测和分类方法
公开(公告)号：US20110093226A1
公开(公告)日：2011-04-21
申请号：US12978879
申请日：2010-12-27
申请人： YIJ CHIEH-CHU , CHUN CHI CHEN , YUN-ZONG TIAN , CHENG-HAO CHEN
发明人： YIJ CHIEH-CHU , CHUN CHI CHEN , YUN-ZONG TIAN , CHENG-HAO CHEN
IPC分类号： G06F17/18 , G06F19/00
CPC分类号： G05B19/41875 , G05B2219/45031 , H01L21/67271 , H01L21/67276 , H01L22/14 , H01L22/20 , Y02P90/22
摘要： A fault detection and classification (FDC) method for wafer acceptance test (WAT) parameters includes the following steps. A plurality of fault detection and classification parameters is collected. A plurality of wafer acceptance test parameters that are corresponded by the fault detection and classification parameters is collected. The fault detection and classification parameters are grouped. A contingency table of the wafer acceptance test parameters corresponding to the fault detection and classification parameters is built. A probability model of the contingency table is built. Finally, a safety range of the probability model is determined.
摘要翻译：用于晶片验收测试（WAT）参数的故障检测和分类（FDC）方法包括以下步骤。收集多个故障检测和分类参数。收集由故障检测和分类参数对应的多个晶片验收测试参数。故障检测和分类参数分组。构建了与故障检测和分类参数对应的晶圆验收测试参数的应变表。构建应急表的概率模型。最后，确定概率模型的安全范围。

6. 发明申请

US20100049355A1 METHOD FOR DETERMINING TOOL'S PRODUCTION QUALITY 审中-公开
标题翻译：确定工具生产质量的方法
公开(公告)号：US20100049355A1
公开(公告)日：2010-02-25
申请号：US12276805
申请日：2008-11-24
申请人： YIJ CHIEH CHU , CHUN CHI CHEN , YUN-ZONG TIAN , CHENG-HAO CHEN
发明人： YIJ CHIEH CHU , CHUN CHI CHEN , YUN-ZONG TIAN , CHENG-HAO CHEN
IPC分类号： G06F19/00
CPC分类号： G05B23/0281 , G05B19/41875 , G05B2219/1112 , G05B2219/32179 , G05B2223/02 , Y02P90/22
摘要： A method for determining manufacturing tool production quality includes providing a table with manufacturing process data. The table is analyzed and a contingency table is established. The contingency table comprises several manufacturing tools, manufacturing processes, and the number of occurrences of bad lots. Split the contingency table up into a plurality of sub-tables. Use Cochran-Mantel-Haenszel test for determining the number of bad lots produced by the manufacturing tools and getting a plurality of statistics. Translate the statistics into a plurality of P-values. Sort the P-values for examining data automatically. Draw a line chart for detecting substandard manufacturing tools. As a result, users can diagnose the quality of the manufacturing tools.
摘要翻译：用于确定制造工具生产质量的方法包括提供具有制造过程数据的工作台。分析表格并建立应变表。应变表包括几个制造工具，制造过程和不良批次的发生次数。将应急表分解成多个子表。使用Cochran-Mantel-Haenszel测试来确定制造工具生产的不良批次数量并获得多个统计数据。将统计数据翻译成多个P值。对P值进行排序以自动检查数据。绘制一条用于检测不合标准制造工具的折线图。因此，用户可以诊断制造工具的质量。

7. 发明申请

US20120331357A1 METHOD AND SYSTEM OF COMPRESSING RAW FABRICATION DATA FOR FAULT DETERMINATION 有权
标题翻译：压缩原始制造数据进行故障确定的方法和系统
公开(公告)号：US20120331357A1
公开(公告)日：2012-12-27
申请号：US13240305
申请日：2011-09-22
申请人： YIJ CHIEH CHU , YUN-ZONG TIAN
发明人： YIJ CHIEH CHU , YUN-ZONG TIAN
IPC分类号： G06F11/00
CPC分类号： G05B23/0254 , G06F11/0754 , G06F11/3013 , G06F11/3082
摘要： The instant disclosure relates to a raw data compression method for the fabrication process. The method includes the steps of: inputting into a signal converter a collection of raw data points representing operational parameter of a semiconductor equipment within a predetermined time period; obtaining an approximation of the raw data points with a Fourier series; computing the Fourier coefficients and the residuals between the raw data points and the corresponding predicted values predicted by the Fourier series; determining if the residuals exceed an error threshold; recording and storing the Fourier coefficients as the compressed data if none of the residuals exceeds the error threshold; and recording the raw data point as abnormal data point if the corresponding residual exceeds the error threshold before recording and storing the Fourier coefficients and the abnormal data point as the compressed data.
摘要翻译：本公开涉及用于制造过程的原始数据压缩方法。该方法包括以下步骤：在预定时间段内向信号转换器输入表示半导体设备的操作参数的原始数据点的集合; 用傅里叶级数获得原始数据点的近似值; 计算傅里叶系数和原始数据点之间的残差与由傅立叶级数预测的对应预测值; 确定残差是否超过误差阈值; 如果没有残差超过误差阈值，则将傅立叶系数作为压缩数据进行记录和存储; 并且如果在记录和存储傅立叶系数和异常数据点作为压缩数据之前相应的残差超过误差阈值，则将原始数据点记录为异常数据点。

8. 发明申请

US20120330591A1 FAULT DETECTION METHOD OF SEMICONDUCTOR MANUFACTURING PROCESSES AND SYSTEM ARCHITECTURE THEREOF 有权
标题翻译：半导体制造工艺的故障检测方法及其系统架构
公开(公告)号：US20120330591A1
公开(公告)日：2012-12-27
申请号：US13240348
申请日：2011-09-22
申请人： YIJ CHIEH CHU , YUN-ZONG TIAN
发明人： YIJ CHIEH CHU , YUN-ZONG TIAN
IPC分类号： G06F19/00
CPC分类号： G06F19/00 , G05B19/4184 , G06T7/001 , G06T2207/30148 , H01L22/12 , H01L22/14 , H01L22/20 , Y02P90/14
摘要： A fault detection method of semiconductor manufacturing processes is disclosed. The method includes the steps of providing a storage device, collecting a fault detection and classification(FDC) parameter by the storage device, setting up a measurement site for measuring an online measurement parameter, collecting a wafer acceptance test(WAT) in correspondence to the FDC parameter, establishing a first relationship equation between the FDC parameter and the online measurement parameter, establishing a second relationship equation of the online measurement parameter and the WAT by using the first relationship equation, establishing a third relationship equation between the FDC parameter and the WAT, establishing a waning region of the manufacturing processes by using the first, second, and third relationship equations, and determining the situation of generating wafer defects according to the warning region. The present invention discloses a system architecture for the method.
摘要翻译：公开了一种半导体制造工艺的故障检测方法。该方法包括以下步骤：提供存储装置，通过存储装置收集故障检测和分类（FDC）参数，设置用于测量在线测量参数的测量位置，收集对应于该测量参数的晶片验收测试（WAT） FDC参数，建立FDC参数和在线测量参数之间的第一关系式，建立第一关系式在线测量参数和WAT的第二关系式，建立FDC参数与WAT之间的第三关系式通过使用第一，第二和第三关系式建立制造过程的下降区域，并根据警告区域确定产生晶片缺陷的情况。本发明公开了一种用于该方法的系统架构。

9. 发明授权

US08265903B2 Method for assessing data worth for analyzing yield rate 有权
标题翻译：评估数据价值分析收益率的方法
公开(公告)号：US08265903B2
公开(公告)日：2012-09-11
申请号：US12458302
申请日：2009-07-08
申请人： Yij Chieh Chu , Chun Chi Chen , Yun-Zong Tian , Shih Chang Kao , Cheng-Hao Chen
发明人： Yij Chieh Chu , Chun Chi Chen , Yun-Zong Tian , Shih Chang Kao , Cheng-Hao Chen
IPC分类号： G06F17/16
CPC分类号： G05B23/0221
摘要： A method for assessing data worth for analyzing yield rate includes: getting measured data with data points that corresponds to control variables of semiconductor manufacturing; transforming the data points into a distance matrix with matrix distances corresponding to differences of the data points under the control variables; expressing sample differences recorded in the distance matrix by two-dimension vectors and calculating similarity degrees of the two-dimension vectors and the distance matrix so as to take loss information as a conversion error value; calculating discriminant ability of the transformed two-dimension data and expressing the discriminant ability by an error rate of discriminant; and taking the conversion error value and the error rate of discriminant as penalty terms and calculating a quality score corresponding to the measured data. Thereby, before analyzing the yield rate of semiconductor manufacturing, analysts can determine whether data includes information affecting the yield rate based on the quality score.
摘要翻译：评估价值分析产出率的数据的方法包括：用与半导体制造控制变量对应的数据点获取测量数据; 将数据点转换成距离矩阵，矩阵距离对应于控制变量下数据点的差; 通过二维向量表示记录在距离矩阵中的样本差异，并计算二维向量和距离矩阵的相似度，以便将损失信息作为转换误差值; 计算变换后的二维数据的判别能力，并用判别式的误差率表示判别能力; 并将判别式的转换误差值和误差率作为惩罚项，并计算与测量数据相对应的质量得分。因此，在分析半导体制造的成品率之前，分析人员可以根据质量得分确定数据是否包括影响产量率的信息。

10. 发明申请

US20110137595A1 YIELD LOSS PREDICTION METHOD AND ASSOCIATED COMPUTER READABLE MEDIUM 审中-公开
标题翻译：损伤预测方法及相关计算机可读介质
公开(公告)号：US20110137595A1
公开(公告)日：2011-06-09
申请号：US12725451
申请日：2010-03-16
申请人： Yij-Chieh Chu , Yun-Zong Tian , Shih-Chang Kao , Wei-Jun Chen , Cheng-Hao Chen
发明人： Yij-Chieh Chu , Yun-Zong Tian , Shih-Chang Kao , Wei-Jun Chen , Cheng-Hao Chen
IPC分类号： G06F19/00
CPC分类号： G05B19/41875 , G05B2219/32194 , Y02P90/22 , Y02P90/86
摘要： A yield loss prediction method includes: performing a plurality of types of defect inspections upon a plurality of batches of wafers which begin to be processed during different periods to generate defect inspection data, respectively; for a specific batch of wafers different from the plurality of batches of wafers, calculating defect prediction data of at least one type of defect inspection according to the defect inspection data of at least the type of defect inspections; and predicting a yield loss of the specific batch of wafers according to at least the defect prediction data.
摘要翻译：屈服损失预测方法包括：对在多个批次的晶片进行多种类型的缺陷检查，所述多个批次的晶片分别在不同的周期内开始被处理以产生缺陷检查数据; 对于与所述多批晶片不同的特定批次的晶片，根据至少所述缺陷检查类型的缺陷检查数据计算至少一种类型的缺陷检查的缺陷预测数据; 并根据至少缺陷预测数据预测特定批次的晶片的屈服损失。

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