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21. 发明授权

US09005414B2 Magnet arrangement for a target backing tube, target backing tube including the same, cylindrical target assembly and sputtering system 有权
标题翻译：用于目标背衬管的磁体布置，包括其的目标背衬管，圆柱形目标组件和溅射系统
公开(公告)号：US09005414B2
公开(公告)日：2015-04-14
申请号：US12840021
申请日：2010-07-20
申请人： Andreas Lopp , Juergen Grillmayer , Wolfgang Krock
发明人： Andreas Lopp , Juergen Grillmayer , Wolfgang Krock
IPC分类号： H01J37/34
CPC分类号： H01J37/3405 , H01J37/342 , H01J37/345 , H01J37/3452 , H01J37/3461
摘要： The disclosure relates to a magnet arrangement for a sputtering system, wherein the magnet arrangement is adapted for a rotatable target of a sputtering system and includes: a first magnet element extending along a first axis; a second magnet element being disposed around the first magnet element symmetrically to a first plane; wherein the second magnet element includes at least one magnet section intersecting the first plane; and wherein a magnetic axis of the at least one magnet section is inclined with respect to a second plane being orthogonal to the first axis. Further, the disclosure relates to a target backing tube for a rotatable target of a sputtering system, a cylindrical rotatable target for a sputtering system, and a sputtering system.
摘要翻译：本发明涉及一种用于溅射系统的磁体装置，其中磁体装置适用于溅射系统的可旋转靶，并且包括：沿着第一轴线延伸的第一磁体元件; 第二磁体元件围绕第一磁体元件对称地设置在第一平面上; 其中所述第二磁体元件包括与所述第一平面交叉的至少一个磁体部分; 并且其中所述至少一个磁体部分的磁轴相对于与所述第一轴正交的第二平面倾斜。此外，本公开涉及用于溅射系统的可旋转靶的目标背衬管，用于溅射系统的圆柱形可旋转靶和溅射系统。

22. 发明申请

US20130284590A1 SYSTEMS AND METHODS FOR FORMING A LAYER OF SPUTTERED MATERIAL 审中-公开
标题翻译：用于形成溅射材料层的系统和方法
公开(公告)号：US20130284590A1
公开(公告)日：2013-10-31
申请号：US13876826
申请日：2011-07-22
申请人： Marcus Bender , Markus Hanika , Evelyn Scheer , Fabio Pieralisi , Guido Mahnke , Ralph Lindenberg , Andreas Lopp , Konrad Schwanitz , Jian Liu
发明人： Marcus Bender , Markus Hanika , Evelyn Scheer , Fabio Pieralisi , Guido Mahnke , Ralph Lindenberg , Andreas Lopp , Konrad Schwanitz , Jian Liu
IPC分类号： C23C14/35
CPC分类号： C23C14/352 , C23C14/35 , H01J37/34 , H01J37/3473
摘要： The present disclosure describes a method of coating a substrate, the method including forming a layer of sputtered material on the substrate. Forming the layer of sputtered material may include: sputtering material from at least one rotatable target over the substrate; varying the relative position between the at least one target and the substrate. In addition, the present disclosure describes varying the distance between a target and a substrate during the sputter process. The present disclosure further describes a system for coating a substrate.
摘要翻译：本公开描述了一种涂覆基底的方法，该方法包括在基底上形成溅射材料层。形成溅射材料层可以包括：从衬底上的至少一个可旋转靶溅射材料; 改变至少一个靶和衬底之间的相对位置。另外，本公开内容描述了在溅射过程期间改变靶和衬底之间的距离。本公开进一步描述了用于涂覆基底的系统。

23. 发明申请

US20130171757A1 ADVANCED PLATFORM FOR PASSIVATING CRYSTALLINE SILICON SOLAR CELLS 审中-公开
标题翻译：用于封闭晶体硅太阳能电池的先进平台
公开(公告)号：US20130171757A1
公开(公告)日：2013-07-04
申请号：US13732662
申请日：2013-01-02
申请人： HARI K. PONNEKANTI , Alexander S. Polyak , James L'Heureux , Michael S. Cox , Christopher T. Lane , Edward P. Hammond, IV , Hemant P. Mungekar , Susanne Schlaefer , Wolfgang Buschbeck , Juergen Henrich , Andreas Lopp
发明人： HARI K. PONNEKANTI , Alexander S. Polyak , James L'Heureux , Michael S. Cox , Christopher T. Lane , Edward P. Hammond, IV , Hemant P. Mungekar , Susanne Schlaefer , Wolfgang Buschbeck , Juergen Henrich , Andreas Lopp
IPC分类号： H01L31/18
CPC分类号： H01L31/18 , C23C14/568 , C23C16/54 , H01L21/67115 , H01L21/67173 , H01L21/6776
摘要： The present invention generally provides a high throughput substrate processing system that is used to form one or more regions of a solar cell device. In one configuration of a processing system, one or more solar cell passivating or dielectric layers are deposited and further processed within one or more processing chambers contained within the high throughput substrate processing system. The processing chambers may be, for example, plasma enhanced chemical vapor deposition (PECVD) chambers, low pressure chemical vapor deposition (LPCVD) chambers, atomic layer deposition (ALD) chambers, physical vapor deposition (PVD) or sputtering chambers, thermal processing chambers (e.g., RTA or RTO chambers), substrate reorientation chambers (e.g., flipping chambers) and/or other similar processing chambers.
摘要翻译：本发明通常提供用于形成太阳能电池器件的一个或多个区域的高通量衬底处理系统。在处理系统的一种配置中，一个或多个太阳能电池钝化或电介质层被沉积并在包含在高通量衬底处理系统内的一个或多个处理室内进一步处理。处理室可以是例如等离子体增强化学气相沉积（PECVD）室，低压化学气相沉积（LPCVD）室，原子层沉积（ALD）室，物理气相沉积（PVD）或溅射室，热处理室（例如，RTA或RTO室），基板重新定向室（例如，翻转室）和/或其它类似的处理室。

24. 发明申请

US20100025370A1 REACTIVE GAS DISTRIBUTOR, REACTIVE GAS TREATMENT SYSTEM, AND REACTIVE GAS TREATMENT METHOD 审中-公开
标题翻译：反应性气体分布器，反应性气体处理系统和反应性气体处理方法
公开(公告)号：US20100025370A1
公开(公告)日：2010-02-04
申请号：US12185663
申请日：2008-08-04
申请人： Manuel Dieguez-Campo , Andreas Lopp , Reiner Gertmann
发明人： Manuel Dieguez-Campo , Andreas Lopp , Reiner Gertmann
IPC分类号： C23F1/00 , C23C16/513 , C23F1/08
CPC分类号： H01J37/3244 , H01J37/32449
摘要： A reactive gas distributor for a reactive gas treatment system is provided, comprising a housing, a reactive gas inlet provided at one side of the housing and fluidly connectable to a remote plasma source, and a plurality of reactive gas outlets at another side of the housing and arranged in a pattern.
摘要翻译：提供了一种用于反应性气体处理系统的反应气体分配器，包括壳体，设置在壳体的一侧并可流体连接到远程等离子体源的反应性气体入口，以及在壳体的另一侧的多个反应气体出口并以图案排列。

25. 发明申请

US20080190765A1 Sputtering Magnetron 审中-公开
标题翻译：溅射磁控管
公开(公告)号：US20080190765A1
公开(公告)日：2008-08-14
申请号：US11914935
申请日：2005-06-04
申请人： Andreas Lopp , Manfred Ruske
发明人： Andreas Lopp , Manfred Ruske
IPC分类号： C23C14/35
CPC分类号： H01J37/3408
摘要： The invention relates to a magnetron with a planar target and a planar magnet system. The planar magnet system comprises a bar-shaped first magnet pole with enlarged ends and a frame-shaped second magnet pole, wherein a relative movement between the magnet poles and the target is such that every point of the magnet system moving with the target being stationary moves on a circular path. If the magnet system is stationary, each point of the target moves on such a circular path. During the relative movement with respect to one another the magnet system and the target are in parallel planes. The diameter of the circular path corresponds to the mean distance between two parallel arms of a plasma tube, which during the sputter operation develops between the first and the second magnet pole. Thereby that the magnets in the curve region of the plasma tube are disposed such that the pole lines form at this site a circle arc or a circular area, holes in the target are avoided.
摘要翻译：本发明涉及一种具有平面靶材和平面磁体系统的磁控管。平面磁体系统包括具有扩大端部的棒状第一磁极和框状的第二磁极，其中磁极和靶之间的相对移动使得磁体系统中的每个点随着目标静止而移动在圆形路径上移动。如果磁体系统是静止的，则目标的每个点在这样的圆形路径上移动。在相对于彼此的相对运动期间，磁体系统和目标处于平行平面。圆形路径的直径对应于等离子体管的两个平行臂之间的平均距离，其在溅射操作期间在第一和第二磁极之间产生。由此，等离子体管的曲线区域中的磁体被布置成使得极点在该位置处形成圆弧或圆形区域，从而避免了靶中的孔。

26. 发明申请

US20060219550A1 Magnet arrangement for a planar magnetron 失效
公开(公告)号：US20060219550A1
公开(公告)日：2006-10-05
申请号：US11385042
申请日：2006-03-20
申请人： Thomas Deppisch , Andreas Lopp
发明人： Thomas Deppisch , Andreas Lopp
IPC分类号： C23C14/00
CPC分类号： H01J37/3408
摘要： A magnetic arrangement for a planar magnetron, in which an initial magnetic pole encompasses a second magnetic pole. This magnetic arrangement is moved linear in longitudinal direction to a target by a specific value and then moved back in opposite direction by the same value. In one version, an additional perpendicular motion is effected. The magnet arrangement is designed so that north and south pole interlock and waviform racetracks are generated. This enables constant sputtering from the entire target surface.

27. 发明申请

US20050252768A1 Coater with a large-area assembly of rotatable magnetrons 有权
标题翻译：涂层机具有可旋转磁控管的大面积组件
公开(公告)号：US20050252768A1
公开(公告)日：2005-11-17
申请号：US11121563
申请日：2005-05-04
申请人： Stefan Bangert , Frank Fuchs , Ralph Lindenberg , Andreas Lopp , Uwe Schussler , Tobias Stolley
发明人： Stefan Bangert , Frank Fuchs , Ralph Lindenberg , Andreas Lopp , Uwe Schussler , Tobias Stolley
IPC分类号： C23C14/34 , C23C14/35 , C23C14/56 , H01J37/34 , C23C14/32
CPC分类号： H01J37/3455 , C23C14/352 , C23C14/56 , H01J37/3405 , H01J2237/3325
摘要： This invention relates to a coater for the coating, in particular, of large-area substrates by means of cathode sputtering, the coater having a coating chamber and, provided therein, a cathode assembly (2) where the material to be sputtered is located on a target (4) with a curved surface, the material to be sputtered being located, in particular, on the lateral surface of a cylinder, there being in a single coating chamber for a coherent coating zone at least three, preferably more, cathode assemblies (2) with rotatable, curved targets (4) positioned one beside the other.
摘要翻译：本发明涉及一种用于通过阴极溅射涂覆，特别是大面积基板的涂布机，涂布机具有涂覆室，并且在其中设置阴极组件（2），其中待溅射的材料位于具有弯曲表面的靶（4），待溅射的材料特别地位于圆柱体的侧表面上，在单个涂覆室中用于粘附涂层区域，至少三个，优选更多的阴极组件（2）具有位于另一个旁边的可旋转的弯曲目标（4）。

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