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11. 发明授权

US07427338B2 Flow diffuser to be used in electro-chemical plating system 失效
标题翻译：流动扩散器用于电化学电镀系统
公开(公告)号：US07427338B2
公开(公告)日：2008-09-23
申请号：US10609862
申请日：2003-06-30
申请人： Yezdi N. Dordi , Joseph J. Stevens , H. Peter W. Hey , Donald J. K. Olgado
发明人： Yezdi N. Dordi , Joseph J. Stevens , H. Peter W. Hey , Donald J. K. Olgado
IPC分类号： C25D17/02 , C25D7/12
CPC分类号： C25D17/008 , C25D7/123 , C25D17/001 , H01L21/2885 , H05K3/241
摘要： An apparatus comprising an electrolyte cell, an anode, and a porous rigid diffuser. The electrolyte cell is configured to receive a substrate to have a metal film deposited thereon. An anode is contained within the electrolyte cell. A porous rigid diffuser is connected to the electrolyte cell and extends across the electrolyte cell. The diffuser is positioned between a location that the substrate is to be positioned when the metal film is deposited thereon and the anode.
摘要翻译：一种包括电解质电池，阳极和多孔刚性扩散器的装置。电解质电池被配置为接收衬底以在其上沉积金属膜。阳极被包含在电解质电池内。多孔刚性扩散器连接到电解质电池并延伸穿过电解质电池。当沉积金属膜并且阳极时，扩散器位于衬底要被定位的位置之间。

12. 发明授权

US06824612B2 Electroless plating system 有权
标题翻译：无电镀系统
公开(公告)号：US06824612B2
公开(公告)日：2004-11-30
申请号：US10036321
申请日：2001-12-26
申请人： Joseph J. Stevens , Dmitry Lubomirsky , Ian Pancham , Donald J. Olgado , Howard E. Grunes , Yeuk-Fai Edwin Mok , Girish Dixit
发明人： Joseph J. Stevens , Dmitry Lubomirsky , Ian Pancham , Donald J. Olgado , Howard E. Grunes , Yeuk-Fai Edwin Mok , Girish Dixit
IPC分类号： B05C502
CPC分类号： H01L21/67167 , C23C18/1632 , C23C18/1692 , H01L21/6723
摘要： A method and apparatus for plating substrates, wherein the apparatus includes a central substrate transfer enclosure having at least one substrate transfer robot positioned therein. A substrate activation chamber in communication with the central substrate transfer enclosure is provided and is accessible to the at least one substrate transfer robot. A substrate plating chamber in communication with the central substrate transfer enclosure is provided and is accessible to the at least one substrate transfer robot. A substrate spin rinse dry chamber in communication with the central substrate transfer enclosure is provided and is accessible to the at least one substrate transfer robot, and an annealing chamber in communication with the central substrate transfer enclosure is provided and is accessible to the at least one substrate transfer robot. At least one substrate pod loader in communication with the substrate transfer chamber and accessible to the at least one substrate transfer robot is also provided.
摘要翻译：一种用于电镀基板的方法和装置，其中所述装置包括具有至少一个基板传送机器人的中央基板传送外壳。提供与中心基板传送外壳连通的基板激活室，并且可由至少一个基板传送机器人访问。提供与中心基板传送外壳连通的基板电镀室，并且可由至少一个基板传送机器人访问。提供与中央基板传送外壳连通的基板旋转漂洗干燥室，并且可由至少一个基板传送机器人访问，并且提供与中央基板传送外壳连通的退火室，并且可由至少一个基板传送机器人。还提供了至少一个与基板传送室连通并且可由至少一个基板传送机器人访问的基板盒装载器。

13. 发明授权

US06613214B2 Electric contact element for electrochemical deposition system and method 有权
标题翻译：电接触元件电化学沉积系统及方法
公开(公告)号：US06613214B2
公开(公告)日：2003-09-02
申请号：US09730968
申请日：2000-12-05
申请人： Yezdi N. Dordi , Joseph J. Stevens
发明人： Yezdi N. Dordi , Joseph J. Stevens
IPC分类号： C25D502
CPC分类号： C25D17/001 , C25D7/123 , C25D17/12 , H01L21/2885 , H05K3/241
摘要： An apparatus and associated method for deposition of metal ions contained in an electrolyte solution to form a metal film primarily on a seed layer formed on at least a first side of a substrate. The substrate has a second side that is opposed the first side and an edge joining the first side and the second side. The apparatus comprises a substrate holder system and an electric contact element. The electric contact element physically contacts one of the second side or the edge of the substrate. In one aspect, the substrate is rotated about its vertical axis when the seed layer of substrate is immersed in the electrolyte solution during the metal film deposition. In another aspect, the substrate is not rotated about its vertical axis when the seed layer on the substrate is immersed in the electrolyte solution during the metal film deposition. In different embodiments, the electric contact element contacts the seed layer on the second side of the substrate, a diffusion barrier layer on the second side of the substrate, or the seed layer on the edge of the substrate.
摘要翻译：一种用于沉积包含在电解质溶液中的金属离子的装置和相关方法，以主要形成在形成在基底的至少第一侧上的种子层上形成金属膜。衬底具有与第一侧相对的第二侧和连接第一侧和第二侧的边缘。该装置包括基板保持器系统和电接触元件。电接触元件物理地接触基板的第二面或边缘中的一个。在一个方面，当在金属膜沉积期间将衬底的晶种层浸入电解质溶液中时，衬底围绕其垂直轴线旋转。在另一方面，当在金属膜沉积期间当衬底上的晶种层浸入电解质溶液中时，衬底不绕其垂直轴旋转。在不同的实施例中，电接触元件接触衬底的第二侧上的种子层，在衬底的第二侧上的扩散阻挡层或衬底的边缘上的种子层。

14. 发明授权

US06612014B1 Dual post centrifugal wafer clip for spin rinse dry unit 失效
标题翻译：双柱离心晶片夹，用于旋转冲洗干燥单元
公开(公告)号：US06612014B1
公开(公告)日：2003-09-02
申请号：US09616308
申请日：2000-07-12
申请人： Bernardo Donoso , Joseph J. Stevens , Donald J. Olgado , Alexander Sou-Kang Ko
发明人： Bernardo Donoso , Joseph J. Stevens , Donald J. Olgado , Alexander Sou-Kang Ko
IPC分类号： B23Q700
CPC分类号： H01L21/68728 , H01L21/67034 , Y10T29/49998
摘要： An apparatus and associated method for securing a wafer to a SRD spider, the SRD spider has a plurality of spider arms. The apparatus includes a plurality of spaced surfaces disposed on a distal end of one of the spider arms, each of the surfaces being spaced perpendicularly from the longitudinal axis of the spider arm. In one aspect, the two surfaces are positioned to limit production of a wedging force between that spaced surface and the wafer. In one embodiment, a post at least partially defines each one of the plurality of spaced surfaces.
摘要翻译：一种用于将晶片固定到SRD蜘蛛的装置和相关方法，SRD蜘蛛具有多个蜘蛛臂。该装置包括设置在一个蜘蛛臂的远端上的多个间隔表面，每个表面与该蜘蛛臂的纵向轴线垂直地间隔开。在一个方面，两个表面被定位成限制在该间隔表面和晶片之间的楔入力的产生。在一个实施例中，柱至少部分地限定多个间隔开的表面中的每一个。

15. 发明授权

US06585876B2 Flow diffuser to be used in electro-chemical plating system and method 失效
标题翻译：流动扩散器用于电化学电镀系统和方法
公开(公告)号：US06585876B2
公开(公告)日：2003-07-01
申请号：US09731326
申请日：2000-12-05
申请人： Yezdi N. Dordi , Joseph J. Stevens , H. Peter W. Hey , Donald J. K. Olgado
发明人： Yezdi N. Dordi , Joseph J. Stevens , H. Peter W. Hey , Donald J. K. Olgado
IPC分类号： C25D520
CPC分类号： C25D17/008 , C25D7/123 , C25D17/001 , H01L21/2885 , H05K3/241
摘要： An apparatus comprising an electrolyte cell, an anode, and a porous rigid diffuser. The electrolyte cell is configured to receive a substrate to have a metal film deposited thereon. An anode is contained within the electrolyte cell. A porous rigid diffuser is connected to the electrolyte cell and extends across the electrolyte cell. The diffuser is positioned between a location that the substrate is to be positioned when the metal film is deposited thereon and the anode.
摘要翻译：一种包括电解质电池，阳极和多孔刚性扩散器的装置。电解质电池被配置为接收衬底以在其上沉积金属膜。阳极被包含在电解质电池内。多孔刚性扩散器连接到电解质电池并延伸穿过电解质电池。当沉积金属膜并且阳极时，扩散器位于衬底要被定位的位置之间。

16. 发明授权

US06517130B1 Self positioning vacuum chuck 失效
标题翻译：自动定位真空吸盘
公开(公告)号：US06517130B1
公开(公告)日：2003-02-11
申请号：US09524977
申请日：2000-03-14
申请人： Bernardo Donoso , Joseph J. Stevens , Donald J. Olgado , Mark Denome
发明人： Bernardo Donoso , Joseph J. Stevens , Donald J. Olgado , Mark Denome
IPC分类号： B66C102
CPC分类号： H01L21/68707 , B25J15/0616 , H01L21/6838 , Y10S414/141
摘要： In one aspect, a vacuum chuck supports a substrate on an end effector, the vacuum chuck comprising a position reference structure and a suction cup. The position reference structure is mounted to the surface and comprises a reference surface. The suction cup is located proximate the reference surface and comprising a suction mount. In another aspect, a method of chucking a substrate to a vacuum chuck is provided. The vacuum chuck comprises a suction cup and a position reference structure. The method comprises attaching the suction cup to the substrate to form a seal therebetween. The suction cup is deformed such that the substrate contacts the position reference structure. The substrate is then leveled on the position reference structure.
摘要翻译：在一个方面，真空吸盘支撑末端执行器上的基板，真空卡盘包括位置参考结构和吸盘。位置参考结构安装到表面并且包括参考表面。吸盘位于参考表面附近并且包括抽吸座。另一方面，提供了将基板夹持到真空吸盘的方法。真空吸盘包括吸盘和位置参考结构。该方法包括将吸盘连接到基底以在其间形成密封。吸盘变形使得基板接触位置参考结构。然后将基板平整在位置参考结构上。

17. 发明授权

US06432282B1 Method and apparatus for supplying electricity uniformly to a workpiece 有权
公开(公告)号：US06432282B1
公开(公告)日：2002-08-13
申请号：US09518182
申请日：2000-03-02
申请人： Shamouil Shamouilian , Anada H. Kumar , Donald J. Olgado , Joseph J. Stevens , Ricardo Leon , Jon Clinton
发明人： Shamouil Shamouilian , Anada H. Kumar , Donald J. Olgado , Joseph J. Stevens , Ricardo Leon , Jon Clinton
IPC分类号： B23H704
CPC分类号： H01L21/2885 , C25D7/123 , C25D17/001 , C25D21/12
摘要： The present invention relates to a device that supplies electricity to a substrate. In one embodiment, the device includes multiple contacts, a current sensor, and a current regulator. The current sensor is attached to each of the plurality of contacts to sense their electric current. A current regulator controls current applied to each of the multiple contacts in response to the current sensor. In another embodiment, a compliant ridge is formed about the periphery of each contact to seal the contact from undesired chemicals.

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