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    • 12. 发明授权
    • Method of fabricating data tracks for use in a magnetic shift register memory device
    • 制造用于磁移位寄存器存储器件的数据轨道的方法
    • US06955926B2
    • 2005-10-18
    • US10788190
    • 2004-02-25
    • Tze-chiang ChenStuart S. P. Parkin
    • Tze-chiang ChenStuart S. P. Parkin
    • G11C11/15G11C19/02G11C19/08H01L21/00
    • G11C19/02G11C19/0841
    • A magnetic data track used in a magnetic shift register memory system may be fabricated by forming a multilayered stack of alternating dielectric and/or silicon layers. Vias of approximately 10 microns tall with a cross-section on the order of 100 nm×100 nm are etched in this multilayered stack of alternating layers. Vias may be etched form smooth or notched walls. Vias are filled by electroplating layers of alternating types of ferromagnetic or ferrimagnetic metals. The alternating ferromagnetic or ferrimagnetic layers are comprised of magnetic materials with different magnetization or magnetic exchange or magnetic anisotropies. These different magnetic characteristics allow the pinning of magnetic domain walls at the boundaries between these layers. Alternatively, vias are filled with a homogeneous ferromagnetic material. Magnetic domain walls are formed by the discontinuity in the ferromagnetic or ferromagnetic material that occurs at the notches or at the protuberances along the via walls.
    • 用于磁移位寄存器存储器系统的磁数据磁道可以通过形成交替的电介质层和/或硅层的多层叠层来制造。 在该多层交替层中蚀刻约10微米高的具有100nm×100nm量级的横截面的通孔。 通孔可能被蚀刻形成平滑或缺口的墙壁。 通孔由交替类型的铁磁或亚铁磁性金属的电镀层填充。 交替的铁磁或亚铁磁层由具有不同磁化或磁交换或磁各向异性的磁性材料组成。 这些不同的磁特性允许磁畴壁在这些层之间的边界处的钉扎。 或者,通孔用均匀的铁磁材料填充。 磁畴壁由铁氧体或铁磁材料中的不连续部分形成,这些不规则发生在沿着通孔壁的凹口或凸起处。
    • 15. 发明申请
    • METHOD OF FABRICATING DATA TRACKS FOR USE IN A MAGNETIC SHIFT REGISTER MEMORY DEVICE
    • 用于在磁移位置存储器件中使用的数据轨迹的方法
    • US20050186686A1
    • 2005-08-25
    • US10788190
    • 2004-02-25
    • Tze-chiang ChenStuart Parkin
    • Tze-chiang ChenStuart Parkin
    • G11C11/15G11C19/02G11C19/08H01L21/00
    • G11C19/02G11C19/0841
    • A magnetic data track used in a magnetic shift register memory system may be fabricated by forming a multilayered stack of alternating dielectric and/or silicon layers. Vias of approximately 10 microns tall with a cross-section on the order of 100 nm×100 nm are etched in this multilayered stack of alternating layers. Vias may be etched form smooth or notched walls. Vias are filled by electroplating layers of alternating types of ferromagnetic or ferrimagnetic metals. The alternating ferromagnetic or ferrimagnetic layers are comprised of magnetic materials with different magnetization or magnetic exchange or magnetic anisotropies. These different magnetic characteristics allow the pinning of magnetic domain walls at the boundaries between these layers. Alternatively, vias are filled with a homogeneous ferromagnetic material. Magnetic domain walls are formed by the discontinuity in the ferromagnetic or ferromagnetic material that occurs at the notches or at the protuberances along the via walls.
    • 用于磁移位寄存器存储器系统的磁数据磁道可以通过形成交替的电介质层和/或硅层的多层叠层来制造。 在该多层交替层中蚀刻约10微米高的具有100nm×100nm量级的横截面的通孔。 通孔可能被蚀刻形成平滑或缺口的墙壁。 通孔由交替类型的铁磁或亚铁磁性金属的电镀层填充。 交替的铁磁或亚铁磁层由具有不同磁化或磁交换或磁各向异性的磁性材料组成。 这些不同的磁特性允许磁畴壁在这些层之间的边界处的钉扎。 或者,通孔用均匀的铁磁材料填充。 磁畴壁由铁氧体或铁磁材料中的不连续部分形成,这些不规则发生在沿着通孔壁的凹口或凸起处。
    • 16. 发明授权
    • Method of fabricating a magnetic shift register
    • 制造磁移位寄存器的方法
    • US07598097B2
    • 2009-10-06
    • US12114636
    • 2008-05-02
    • Tze-chiang ChenStuart S. P. Parkin
    • Tze-chiang ChenStuart S. P. Parkin
    • H01L21/00
    • H01L29/82G11C11/14G11C19/02G11C19/0808G11C19/0841
    • A magnetic data track used in a magnetic shift register memory system may be fabricated by forming a multilayered stack of alternating dielectric and/or silicon layers. A trench is etched in the multi-layer stack structure. A selective etching process is used to corrugate the walls of trench. A seed layer is applied to the walls and bottom of the trench; the seed layer is covered with a magnetic layer. The trench is filled with an insulating material. A patterned layer is applied and portions of insulating material exposed by the pattern are removed, forming holes. Magnetic material and seed layer exposed in holes is selectively removed. The holes are filled with insulating material and connecting leads are attached to data tracks.
    • 用于磁移位寄存器存储器系统的磁数据磁道可以通过形成交替的电介质层和/或硅层的多层叠层来制造。 在多层堆叠结构中蚀刻沟槽。 使用选择性蚀刻工艺来使沟槽的壁波纹化。 种子层施加到沟槽的壁和底部; 种子层被磁性层覆盖。 沟槽填充绝缘材料。 施加图案层,去除由图案露出的部分绝缘材料,形成孔。 选择性地除去暴露在孔中的磁性材料和种子层。 孔中填充绝缘材料,连接引线连接到数据轨道。
    • 18. 发明授权
    • Method of fabricating a magnetic shift register
    • 制造磁移位寄存器的方法
    • US07416905B2
    • 2008-08-26
    • US11252384
    • 2005-10-17
    • Tze-chiang ChenStuart S. P. Parkin
    • Tze-chiang ChenStuart S. P. Parkin
    • H01L21/00
    • H01L29/82G11C11/14G11C19/02G11C19/0808G11C19/0841
    • A magnetic data track used in a magnetic shift register memory system may be fabricated by forming a multilayered stack of alternating dielectric and/or silicon layers. A trench is etched in the multi-layer stack structure. A selective etching process is used to corrugate the walls of trench. A seed layer is applied to the walls and bottom of the trench; the seed layer is covered with a magnetic layer. The trench is filled with an insulating material. A patterned layer is applied and portions of insulating material exposed by the pattern are removed, forming holes. Magnetic material and seed layer exposed in holes is selectively removed. The holes are filled with insulating material and connecting leads are attached to data tracks.
    • 用于磁移位寄存器存储器系统的磁数据磁道可以通过形成交替的电介质层和/或硅层的多层叠层来制造。 在多层堆叠结构中蚀刻沟槽。 使用选择性蚀刻工艺来使沟槽的壁波纹化。 种子层施加到沟槽的壁和底部; 种子层被磁性层覆盖。 沟槽填充绝缘材料。 施加图案层,去除由图案露出的部分绝缘材料,形成孔。 选择性地除去暴露在孔中的磁性材料和种子层。 孔中填充绝缘材料,连接引线连接到数据轨道。
    • 19. 发明申请
    • METHOD OF FABRICATING A MAGNETIC SHIFT REGISTER
    • 制造磁性移位寄存器的方法
    • US20080241369A1
    • 2008-10-02
    • US12114636
    • 2008-05-02
    • Tze-chiang ChenStuart S.P. Parkin
    • Tze-chiang ChenStuart S.P. Parkin
    • B05D5/12
    • H01L29/82G11C11/14G11C19/02G11C19/0808G11C19/0841
    • A magnetic data track used in a magnetic shift register memory system may be fabricated by forming a multilayered stack of alternating dielectric and/or silicon layers. A trench is etched in the multi-layer stack structure. A selective etching process is used to corrugate the walls of trench. A seed layer is applied to the walls and bottom of the trench; the seed layer is covered with a magnetic layer. The trench is filled with an insulating material. A patterned layer is applied and portions of insulating material exposed by the pattern are removed, forming holes. Magnetic material and seed layer exposed in holes is selectively removed. The holes are filled with insulating material and connecting leads are attached to data tracks.
    • 用于磁移位寄存器存储器系统的磁数据磁道可以通过形成交替的电介质层和/或硅层的多层叠层来制造。 在多层堆叠结构中蚀刻沟槽。 使用选择性蚀刻工艺来使沟槽的壁波纹化。 种子层施加到沟槽的壁和底部; 种子层被磁性层覆盖。 沟槽填充绝缘材料。 施加图案层,去除由图案露出的部分绝缘材料,形成孔。 选择性地除去暴露在孔中的磁性材料和种子层。 孔中填充绝缘材料,连接引线连接到数据轨道。
    • 20. 发明授权
    • Method of fabricating a shiftable magnetic shift register
    • 制造可移动磁移位寄存器的方法
    • US07108797B2
    • 2006-09-19
    • US10787738
    • 2004-02-25
    • Tze-chiang ChenStuart S. P. Parkin
    • Tze-chiang ChenStuart S. P. Parkin
    • G11B5/127B44C1/22H01L21/00
    • G11C11/14G11C19/02G11C19/0808G11C19/0841H01F10/14H01F10/265H01F41/26Y10T29/49021Y10T29/49043Y10T29/49052
    • A magnetic data track used in a magnetic shift register memory system may be fabricated by forming a multilayered stack of alternating dielectric and/or silicon layers. Vias of approximately 10 microns tall with a cross-section on the order of 100 nm×100 nm are etched in this multilayered stack of alternating layers. Vias may be etched form smooth or notched walls. Vias are filled by electroplating layers of alternating types of ferromagnetic or ferrimagnetic metals. The alternating ferromagnetic or ferrimagnetic layers are comprised of magnetic materials with different magnetization or magnetic exchange or magnetic anisotropies. These different magnetic characteristics allow the pinning of magnetic domain walls at the boundaries between these layers. Alternatively, vias are filled with a homogeneous ferromagnetic material. Magnetic domain walls are formed by the discontinuity in the ferromagnetic or ferromagnetic material that occurs at the notches or at the protuberances along the via walls.
    • 用于磁移位寄存器存储器系统的磁数据磁道可以通过形成交替的电介质层和/或硅层的多层叠层来制造。 在该多层交替层中蚀刻约10微米高的具有100nm×100nm量级的横截面的通孔。 通孔可能被蚀刻形成平滑或缺口的墙壁。 通孔由交替类型的铁磁或亚铁磁性金属的电镀层填充。 交替的铁磁或亚铁磁层由具有不同磁化或磁交换或磁各向异性的磁性材料组成。 这些不同的磁特性允许磁畴壁在这些层之间的边界处的钉扎。 或者,通孔用均匀的铁磁材料填充。 磁畴壁由铁氧体或铁磁材料中的不连续部分形成,这些不规则发生在沿着通孔壁的凹口或凸起处。