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11. 发明专利

JP2012114311A Led module 审中-公开
标题翻译： LED模块
公开(公告)号：JP2012114311A
公开(公告)日：2012-06-14
申请号：JP2010263147
申请日：2010-11-26
申请人： Toshiba Corp , 株式会社東芝
发明人： INOUE KAZUHIRO , TONEDACHI TATSURO , IWASHITA KAZUHISA , TAKEUCHI TERUO , KOMATSU TETSUO , WATARI HAJIME
IPC分类号： H01L33/54 , H01L33/60 , H01L33/62
CPC分类号： H01L33/486 , H01L24/73 , H01L24/97 , H01L33/62 , H01L2224/32245 , H01L2224/48091 , H01L2224/48247 , H01L2224/48465 , H01L2224/73265 , H01L2224/97 , H01L2924/01322 , H01L2924/12041 , H01L2924/15787 , H01L2924/00014 , H01L2924/00012 , H01L2924/00
摘要： PROBLEM TO BE SOLVED: To provide an inexpensive LED module which has high durability.SOLUTION: According to the embodiment, an LED module comprises: a substrate; a wiring layer provided at the substrate; an LED package mounted on the wiring layer; and a reflector provided at a region of the substrate in which the LED package is not mounted. The LED package has first and second lead frames, an LED chip, and a resin body. An outer shape of the resin body forms an outer shape of the LED package.
摘要翻译：要解决的问题：提供具有高耐久性的便宜的LED模块。解决方案：根据实施例，LED模块包括：基板; 设置在基板上的布线层; 安装在布线层上的LED封装; 以及设置在其中未安装LED封装的基板的区域处的反射器。 LED封装具有第一和第二引线框架，LED芯片和树脂体。树脂体的外形形成LED封装的外形。版权所有（C）2012，JPO＆INPIT

12. 发明专利

JP2012114284A Led module and illuminating device 审中-公开
标题翻译： LED模组和照明装置
公开(公告)号：JP2012114284A
公开(公告)日：2012-06-14
申请号：JP2010262653
申请日：2010-11-25
申请人： Toshiba Corp , 株式会社東芝
发明人： WATARI HAJIME , INOUE KAZUHIRO
IPC分类号： H01L33/54 , F21S2/00 , F21Y101/02 , H01L33/62
CPC分类号： H01L33/52 , G02B6/0021 , G02B6/0028 , G02B6/0068 , G02B6/0073 , H01L24/73 , H01L24/97 , H01L33/486 , H01L2224/32013 , H01L2224/32245 , H01L2224/48091 , H01L2224/48247 , H01L2224/48257 , H01L2224/48465 , H01L2224/73265 , H01L2224/97 , H01L2924/01322 , H01L2924/12041 , H01L2924/15787 , H01L2933/0041 , H01L2924/00014 , H01L2924/00012 , H01L2924/00 , H01L2224/85
摘要： PROBLEM TO BE SOLVED: To provide an LED module and an illuminating device which have enhanced utilization efficiency of light to be emitted from an LED package.SOLUTION: In the illuminating device which includes a substrate, a wiring layer provided on the substrate, an LED package mounted on the wiring layer, a light guide plate and a resin, the light guide plate has transmissivity to light to be emitted from the LED package, and the resin is provided between the substrate and the light guide plate, covers the LED package and is adhered to the light guide plate, and has higher refractive index than that of air and has transmissivity to light to be emitted from the LED package.
摘要翻译：解决的问题：提供一种具有提高从LED封装发射的光的利用效率的LED模块和照明装置。解决方案：在包括基板的照明装置中，设置在基板上的布线层，安装在布线层上的LED封装件，导光板和树脂，导光板对要发射的光具有透射率并且在基板和导光板之间设置树脂，覆盖LED封装并粘附到导光板，并且具有比空气更高的折射率，并且具有从...发射的光的透射率 LED封装。版权所有（C）2012，JPO＆INPIT

13. 发明专利

JP2011176306A Led package 有权
标题翻译： LED封装
公开(公告)号：JP2011176306A
公开(公告)日：2011-09-08
申请号：JP2011024619
申请日：2011-02-08
申请人： Toshiba Corp , 株式会社東芝
发明人： SHIMIZU SATOSHI , TOYAKAN TATSURO , IWASHITA KAZUHISA , TAKEUCHI TERUO , OSHIO HIROAKI , KOMATSU TETSUO , WATARI HAJIME , INOUE KAZUHIRO , USHIYAMA NAOYA
IPC分类号： H01L33/62 , H01L33/54
CPC分类号： H01L33/62 , H01L24/73 , H01L24/97 , H01L25/0753 , H01L25/167 , H01L33/486 , H01L2224/26175 , H01L2224/32245 , H01L2224/48091 , H01L2224/48137 , H01L2224/48247 , H01L2224/48257 , H01L2224/48465 , H01L2224/48471 , H01L2224/49113 , H01L2224/73265 , H01L2224/97 , H01L2924/00014 , H01L2924/01004 , H01L2924/01005 , H01L2924/01006 , H01L2924/01012 , H01L2924/01013 , H01L2924/0102 , H01L2924/01023 , H01L2924/01025 , H01L2924/01029 , H01L2924/0103 , H01L2924/01033 , H01L2924/01038 , H01L2924/01045 , H01L2924/01047 , H01L2924/01056 , H01L2924/01058 , H01L2924/01059 , H01L2924/01063 , H01L2924/01065 , H01L2924/01066 , H01L2924/01068 , H01L2924/0107 , H01L2924/01075 , H01L2924/01079 , H01L2924/01082 , H01L2924/01322 , H01L2924/014 , H01L2924/12035 , H01L2924/12041 , H01L2924/181 , H01L2924/351 , H01L2933/0066 , H01L2224/85 , H01L2924/00 , H01L2924/00012 , H01L2224/48227 , H01L2224/4554
摘要： PROBLEM TO BE SOLVED: To provide an LED package having high durability and low cost. SOLUTION: The LED package includes: first and second leadframes which are separated from each other; and an LED chip which is formed above the first and second leadframes, and has one terminal connected to the first leadframe and the other terminal connected to the second leadframe. The first and second leadframes each have a base, and a plurality of hanging pins extending from the base. A part of the lower surface and the side surface of the base and the lower and side surfaces of each of the hanging pins are covered with a resin, and the rest of the lower surface of the base and a front end surface of each of the hanging pins are not covered with the resin. COPYRIGHT: (C)2011,JPO&INPIT
摘要翻译：要解决的问题：提供具有高耐久性和低成本的LED封装。解决方案：LED封装包括：彼此分离的第一和第二引线框架; 以及LED芯片，其形成在第一引线框架和第二引线框架上方，并且具有连接到第一引线框架的一个端子和连接到第二引线框架的另一个端子。第一和第二引线框架各自具有基部和从基部延伸的多个悬挂销。基部的下表面和侧表面的一部分以及每个悬挂销的下表面和侧表面被树脂覆盖，并且底部的下表面的其余部分和每个的垂直销的前端表面悬挂销未被树脂覆盖。版权所有（C）2011，JPO＆INPIT

14. 发明专利

JP2009077238A Antenna device 有权
标题翻译：天线设备
公开(公告)号：JP2009077238A
公开(公告)日：2009-04-09
申请号：JP2007245337
申请日：2007-09-21
申请人： Toshiba Corp , 株式会社東芝
发明人： HIGAKI MAKOTO , INOUE KAZUHIRO , TSUTSUMI YUKAKO
IPC分类号： H01Q13/08 , H01Q9/16 , H01Q15/14
CPC分类号： H01Q9/28 , H01Q19/005
摘要： PROBLEM TO BE SOLVED: To achieve both of lower posture and broader band of impedance.
SOLUTION: This antenna device is provided with: a plate-like conductor element having a finite ground plate 1, a first conductor plate arranged so as to face a finite ground plate 2, and a second conductor plate for short-circuiting one end of the first conductor plate to the finite ground plates; and an antenna having one or more antenna elements, and a feed point which is located near the other end of the first conductor plate, and supplies power to one or more antenna elements. The plate-like conductor element propagates electromagnetic wave which is radiated from the antenna and enters a space between the first conductor plate and the finite ground plate from the other end side of the first conductor plate by reflection between the first conductor plate and the finite ground plate, reflects the propagated electromagnetic wave on the second conductor plate, and outputs the reflected electromagnetic wave from the space on the other end side of the first conductor plate to provide desired phase delay to the electromagnetic wave which enters the space.
COPYRIGHT: (C)2009,JPO&INPIT
摘要翻译：要解决的问题：实现较低姿态和更宽的阻抗带。解决方案：该天线装置设置有：具有有限接地板1的板状导体元件，布置成面对有限接地板2的第一导体板和用于短路一个的第二导体板将第一导体板的端部连接到有限的接地板; 以及具有一个或多个天线元件的天线和位于第一导体板的另一端附近的馈电点，并且向一个或多个天线元件供电。板状导体元件传播从天线辐射的电磁波，通过第一导体板和有限地面之间的反射，从第一导体板的另一端侧进入第一导体板和有限接地板之间的空间在第二导体板上反射传播的电磁波，并且从第一导体板的另一端侧的空间输出反射的电磁波，以向进入空间的电磁波提供期望的相位延迟。版权所有（C）2009，JPO＆INPIT

15. 发明专利

JP2015032928A 生体通信装置审中-公开
标题翻译：生物通信设备
公开(公告)号：JP2015032928A
公开(公告)日：2015-02-16
申请号：JP2013160022
申请日：2013-08-01
申请人：株式会社東芝 , Toshiba Corp
发明人： KATAOKA KAZUKI , INOUE KAZUHIRO , OISHI TAKAFUMI
IPC分类号： H04B13/00
CPC分类号： H04B13/005
摘要：【課題】生体を介して通信する通信機器間のクロストークを低減する。【解決手段】一つの実施形態によれば、生体通信装置は、第1通信器と第2通信器が設けられる。第1通信器は、第1通信部と第1導電体を有する。第2通信器は、第2導電体、第2信号線、第3導電体、第1基準電位線、第4導電体、第3信号線、第5導電体、第2基準電位線、及び第1検出部が設けられる。第2通信器は、第1差分出力を入力し、信号を送受信する。生体通信装置は、第1生体の表面が第1導電体、第2導電体、及び第4導電体と接触或いは近接したときに、第1通信器と第2通信器の間で通信が実行される。【選択図】図1
摘要翻译：要解决的问题：减少通过生物体通信的通信设备之间的串扰。解决方案：根据一个实施例，生物通信设备包括第一通信设备和第二通信设备。第一通信设备包括第一通信单元和第一导体。第二通信装置包括第二导体，第二信号线，第三导体，第一参考电位线，第四导体，第三信号线，第五导体，第二参考电位线和第一检测单元。第二通信设备输入第一差分输出，并发送和接收信号。当第一生物体的前表面接触或靠近第一导体，第二导体和第四导体时，生物通信装置执行第一通信装置和第二通信装置之间的通信。

16. 发明专利

JP2011176277A Led package 审中-公开
标题翻译： LED封装
公开(公告)号：JP2011176277A
公开(公告)日：2011-09-08
申请号：JP2010230920
申请日：2010-10-13
申请人： Toshiba Corp , 株式会社東芝
发明人： SHIMIZU SATOSHI , TOYAKAN TATSURO , IWASHITA KAZUHISA , TAKEUCHI TERUO , OSHIO HIROAKI , KOMATSU TETSUO , WATARI HAJIME , INOUE KAZUHIRO , USHIYAMA NAOYA
IPC分类号： H01L33/62 , H01L33/54
CPC分类号： H01L33/62 , H01L24/73 , H01L24/97 , H01L25/0753 , H01L25/167 , H01L33/486 , H01L2224/26175 , H01L2224/32245 , H01L2224/48091 , H01L2224/48137 , H01L2224/48247 , H01L2224/48257 , H01L2224/48465 , H01L2224/48471 , H01L2224/49113 , H01L2224/73265 , H01L2224/97 , H01L2924/00014 , H01L2924/01004 , H01L2924/01005 , H01L2924/01006 , H01L2924/01012 , H01L2924/01013 , H01L2924/0102 , H01L2924/01023 , H01L2924/01025 , H01L2924/01029 , H01L2924/0103 , H01L2924/01033 , H01L2924/01038 , H01L2924/01045 , H01L2924/01047 , H01L2924/01056 , H01L2924/01058 , H01L2924/01059 , H01L2924/01063 , H01L2924/01065 , H01L2924/01066 , H01L2924/01068 , H01L2924/0107 , H01L2924/01075 , H01L2924/01079 , H01L2924/01082 , H01L2924/01322 , H01L2924/014 , H01L2924/12035 , H01L2924/12041 , H01L2924/181 , H01L2924/351 , H01L2933/0066 , H01L2224/85 , H01L2924/00 , H01L2924/00012 , H01L2224/48227 , H01L2224/4554
摘要： PROBLEM TO BE SOLVED: To provide an LED package having high durability and low cost. SOLUTION: The LED package includes: first and second leadframes which are separated from each other, a plurality of LED chips which are mounted on the first leadframe, and a resin material which covers the LED chips and covers part of respective first and second leadframes. At least either the first or second leadframe has a base having an edge covered with the resin material and a part on the lower surface exposed on the lower surface of the resin material; and hanging pins extending from the base, having a lower surface covered with the resin material and a front edge exposed on the side surface of the resin material. The one LED chip is disposed at a position nearer to the second leadframe than the other one LED chip. The outer shape of the resin material forms the outer shape of the LED package. COPYRIGHT: (C)2011,JPO&INPIT
摘要翻译：要解决的问题：提供具有高耐久性和低成本的LED封装。解决方案：LED封装包括：彼此分离的第一和第二引线框架，安装在第一引线框架上的多个LED芯片和覆盖LED芯片并覆盖其第一和第二引线框架的部分的树脂材料第二个引线框架。第一引线框架或第二引线框架中的至少一个具有被树脂材料覆盖的边缘的基部和暴露在树脂材料的下表面上的下表面上的一部分; 以及从基部延伸的具有下表面被树脂材料覆盖的悬挂销和暴露在树脂材料的侧表面上的前边缘。一个LED芯片设置在比另一个LED芯片更靠近第二引线框架的位置。树脂材料的外形形成LED封装的外形。版权所有（C）2011，JPO＆INPIT

17. 发明专利

JP2011176264A Led package 有权
标题翻译： LED封装
公开(公告)号：JP2011176264A
公开(公告)日：2011-09-08
申请号：JP2010143663
申请日：2010-06-24
申请人： Toshiba Corp , 株式会社東芝
发明人： EKOSHI HIDENORI , OSHIO HIROAKI , TAMURA KAZUHIRO , TAKEUCHI TERUO , MATSUMOTO IWAO , INOUE KAZUHIRO , SHIMIZU SATOSHI
IPC分类号： H01L33/62
CPC分类号： H01L33/48 , H01L24/73 , H01L24/97 , H01L2224/32013 , H01L2224/32245 , H01L2224/48091 , H01L2224/48247 , H01L2224/48257 , H01L2224/48465 , H01L2224/49113 , H01L2224/73265 , H01L2224/97 , H01L2924/12035 , H01L2924/12041 , H01L2924/351 , H01L2924/00014 , H01L2924/00 , H01L2924/00012
摘要： PROBLEM TO BE SOLVED: To provide an LED package high in durability and reduced in cost. SOLUTION: The LED package includes (2×n) (n is an integer of 2 or more) lead frames, n LED chips, and a resin body. The (2×n) lead frames are arranged on the same plane and separated from one another. The n LED chips are provided above the lead frames. One terminal of each LED chip is connected to each of n lead frames out of the (2×n) lead frames, and the another terminal of each LED chip is connected to each of the lead frames other than the n lead frames out of the (2×n) lead frames. The resin body covers the whole upper face, a part of a lower face and a part of an end face of each of the (2×n) lead frames, covers the n LED chips, and exposes the rest of the lower face and the rest of the end face. COPYRIGHT: (C)2011,JPO&INPIT
摘要翻译：要解决的问题：提供高耐用性和降低成本的LED封装。解决方案：LED封装包括（2×n）（n为2以上的整数）引线框，n个LED芯片和树脂体。（2×n）引线框架布置在同一平面上并相互分离。 n个LED芯片设置在引线框架的上方。每个LED芯片的一个端子连接到（2×n）个引线框架中的n个引线框架中的每一个，并且每个LED芯片的另一端子连接到除了n个引线框架之外的每个引线框架（2×n）引线框架。树脂体覆盖（2×n）个引线框架的整个上表面，下表面的一部分和端面的一部分，覆盖n个LED芯片，并暴露下表面的其余部分其余的端面。版权所有（C）2011，JPO＆INPIT

18. 发明专利

JP2011165833A Led module 审中-公开
标题翻译： LED模块
公开(公告)号：JP2011165833A
公开(公告)日：2011-08-25
申请号：JP2010026005
申请日：2010-02-08
申请人： Toshiba Corp , 株式会社東芝
发明人： INOUE KAZUHIRO , TOYAKAN TATSURO , IWASHITA KAZUHISA , TAKEUCHI TERUO , OSHIO HIROAKI , KOMATSU TETSUO , USHIYAMA NAOYA
IPC分类号： H01L33/48
CPC分类号： H01L24/97 , F21K9/00 , H01L25/0753 , H01L33/62 , H01L2224/32245 , H01L2224/48091 , H01L2224/48247 , H01L2224/48257 , H01L2224/48465 , H01L2224/49113 , H01L2224/73265 , H01L2224/97 , H01L2924/12035 , H01L2924/12041 , H01L2924/12042 , H01L2924/15787 , H01L2924/181 , H01L2933/0033 , H01L2933/005 , H01L2924/00014 , H01L2924/00 , H01L2924/00012
摘要： PROBLEM TO BE SOLVED: To provide an LED module which has high durability and is reduced in cost. SOLUTION: The LED module 1 is provided with: a board; an interconnection 22 formed on an upper surface of the board; and an LED package 14 mounted on the board. The LED package 14 is provided with: lead frames 101 and 103 disposed on the same plane to be apart from each other, and connected to portions of the interconnection 22 insulated from each other; an LED chip 104 provided above the lead frames, having one terminal connected to the lead frame 101, and having another terminal connected to the lead frame 103; and a transparent resin body 107 covering the entire upper surface, a part of a lower surface, and a part of an edge face of each of the lead frames 101 and 103, embedding the LED chip 104, and exposing the remaining part of the lower surface and the remaining part of the edge face of each of the lead frames 101 and 103. COPYRIGHT: (C)2011,JPO&INPIT
摘要翻译：要解决的问题：提供一种具有高耐久性并降低成本的LED模块。
解决方案：LED模块1设置有：板; 形成在所述板的上表面上的互连22; 以及安装在板上的LED封装14。 LED封装14具有：设置在同一平面上的引线框架101和103彼此分开，并且连接到彼此绝缘的互连部分22; 设置在引线框架上方的LED芯片104，其具有连接到引线框架101的一个端子，并且具有连接到引线框架103的另一个端子; 以及覆盖每个引线框架101和103的每个引线框架101和103的整个上表面，下表面的一部分和边缘面的一部分的透明树脂体107，嵌入LED芯片104，并且暴露下部的其余部分表面和每个引线框架101和103的边缘面的剩余部分。版权所有（C）2011，JPO＆INPIT

19. 发明专利

JP2010114560A Reader, and management system 审中-公开
标题翻译：读者和管理系统
公开(公告)号：JP2010114560A
公开(公告)日：2010-05-20
申请号：JP2008284108
申请日：2008-11-05
申请人： Toshiba Corp , 株式会社東芝
发明人： YAMADA AKIKO , SHOGI HIROKI , OBAYASHI SHUICHI , INOUE KAZUHIRO , HIGAKI MAKOTO
IPC分类号： H04B5/02 , G06K17/00 , H04B7/08
CPC分类号： G06K7/10336 , G06K7/10178 , G06K19/07771 , H01Q1/007 , H01Q1/2216 , H01Q15/008
摘要： PROBLEM TO BE SOLVED: To provide a reader which is capable of communicating with a tag even when the tag is in the vicinity of a metal wall inside a metal housing.
SOLUTION: The reader performs wireless communication with a tag 130 inside a metal housing 100 including a plurality of metal walls 101 to 106 and includes: an antenna 122 which transmits and receives electromagnetic waves; a communication control device 121 that writes and/or reads information to/from the tag via the antenna; and reflecting plates 111 and 112 which reflect electromagnetic waves and have reflection phases different from that of the metal wall.
COPYRIGHT: (C)2010,JPO&INPIT

20. 发明专利

JP2009188185A Optical semiconductor device 审中-公开
标题翻译：光学半导体器件
公开(公告)号：JP2009188185A
公开(公告)日：2009-08-20
申请号：JP2008026535
申请日：2008-02-06
申请人： Toshiba Corp , 株式会社東芝
发明人： OKAZAKI HARUHIKO , INOUE KAZUHIRO
IPC分类号： H01L31/12 , H01L33/48 , H01L33/54 , H01L33/56 , H01L33/60 , H01L33/62
摘要： PROBLEM TO BE SOLVED: To provide an optical semiconductor device having a first resin molded layer and a second resin molded layer and having a high optical output. SOLUTION: The optical semiconductor device has a semiconductor light-emitting element 11, the first resin molded layers 12 coating the periphery of the semiconductor light-emitting element 11 and having light transparency to the emission wavelength of the semiconductor light-emitting element 11 and the second resin molded layer 13 coating the outside of the first resin molded layer 12 and having the light transparency to the emission wavelength of the semiconductor light-emitting element 11. The refractive index of the first resin molded layer 12 is larger than that of the second resin molded layer 13, and the shape of the first resin molded layer 12 and that of the second resin molded layer 13 differ from each other. The first resin molded layer 12 has such a shape that light projected from the semiconductor light-emitting element 11 to the first resin molded layer 11 is hardly reflected totally on a boundary surface between the first resin molded layer 11 and the second resin molded layer 12. The second resin molded layer 13 has such a shape that the light projected from the first resin molded layer 11 to the second resin molded layer 12 is converged in the emission top-face direction of the semiconductor light-emitting element 11. COPYRIGHT: (C)2009,JPO&INPIT
摘要翻译：要解决的问题：提供一种具有第一树脂模制层和第二树脂模塑层并具有高光输出的光学半导体器件。解决方案：光半导体器件具有半导体发光元件11，第一树脂成型层12涂覆半导体发光元件11的周围，并且对于半导体发光元件的发射波长具有透光性 11，第二树脂成型层13涂覆在第一树脂成型层12的外侧，对于半导体发光元件11的发光波长具有透光性。第一树脂成型层12的折射率大于的第二树脂模制层13的形状和第二树脂模制层13的形状彼此不同。第一树脂模制层12具有从半导体发光元件11向第一树脂模制层11突出的光几乎完全不反射在第一树脂模制层11和第二树脂模制层12之间的边界面上的形状第二树脂成型层13具有从第一树脂成型层11向第二树脂成型层12突出的光会聚在半导体发光元件11的排出顶面方向的形状。版权所有（C）2009，JPO＆INPIT

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