专利快速检索-快速检索全球专利，免费商用专利数据库-IPRDB

11. 发明授权

US09043035B2 Dynamically limiting energy consumed by cooling apparatus 有权
标题翻译：动力限制冷却装置消耗的能量
公开(公告)号：US09043035B2
公开(公告)日：2015-05-26
申请号：US13305967
申请日：2011-11-29
申请人： Timothy J. Chainer , Milnes P. David , Madhusudan K. Iyengar , Pritish R. Parida , Roger R. Schmidt , Mark D. Schultz
发明人： Timothy J. Chainer , Milnes P. David , Madhusudan K. Iyengar , Pritish R. Parida , Roger R. Schmidt , Mark D. Schultz
IPC分类号： G06F19/00 , G05D7/06 , G06F1/20 , G11B33/14 , H05K7/20 , G06F1/32
CPC分类号： G05D7/0635 , G06F1/20 , G06F1/206 , G06F1/3206 , G11B33/144 , H05K7/20281 , H05K7/20781 , H05K7/2079 , H05K7/20836 , Y02D10/16
摘要： Cooling apparatuses and methods are provided which include one or more coolant-cooled structures associated with an electronics rack, a coolant loop coupled in fluid communication with one or more passages of the coolant-cooled structure(s), one or more heat exchange units coupled to facilitate heat transfer from coolant within the coolant loop, and N controllable components associated with the coolant loop or the heat exchange unit(s), wherein N≧1. The N controllable components facilitate circulation of coolant through the coolant loop or transfer of heat from the coolant via the heat exchange unit(s). A controller is coupled to the N controllable components, and dynamically adjusts operation of the N controllable components, based on Z input parameters and one or more specified constraints, to provide a specified cooling to the coolant-cooled structure(s), while limiting energy consumed by the N controllable components, wherein Z≧1.
摘要翻译：提供了冷却装置和方法，其包括与电子机架相关联的一个或多个冷却剂冷却结构，与冷却剂冷却结构的一个或多个通道流体连通的冷却剂回路，一个或多个热交换单元以促进从冷却剂回路内的冷却剂的热传递，以及与冷却剂回路或热交换单元相关联的N个可控部件，其中N≥1。 N个可控部件促使冷却剂循环通过冷却剂回路或通过热交换单元从冷却剂传递热量。控制器耦合到N个可控组件，并且基于Z输入参数和一个或多个指定的约束来动态调整N个可控组件的操作，以向冷却剂冷却的结构提供特定的冷却，同时限制能量由N个可控部件消耗，其中Z≥1。

12. 发明申请

US20110286175A1 LIQUID COOLANT CONDUIT SECURED IN AN UNUSED SOCKET FOR MEMORY MODULE COOLING 有权
标题翻译：液体冷却液管道用于存储模块冷却的未使用的插座
公开(公告)号：US20110286175A1
公开(公告)日：2011-11-24
申请号：US12785779
申请日：2010-05-24
申请人： Madhusudan K. Iyengar , Vinod Kamath , Howard V. Mahaney, JR. , Mark E. Steinke , Aparna Vallury
发明人： Madhusudan K. Iyengar , Vinod Kamath , Howard V. Mahaney, JR. , Mark E. Steinke , Aparna Vallury
IPC分类号： G06F1/20
CPC分类号： G06F1/20 , G06F2200/201
摘要： An apparatus for cooling a memory module installed in a computer system includes a liquid coolant conduit that is connected to a conduit support structure having a form factor selectively securable within a first preconfigured memory module socket of the computer system in order to position the liquid coolant conduit above the first socket. A heat pipe provides direct thermal contact between the liquid conduit and a heat spreader assembly in direct thermal contact with a face of the memory module. The apparatus may include a second heat pipe and second heat spreader assembly for similarly cooling a second memory module. In alternative configurations, the apparatus may cool memory modules on opposing sides of the conduit or memory modules that are both on the same side of the conduit.
摘要翻译：用于冷却安装在计算机系统中的存储器模块的装置包括液体冷却剂导管，该液体冷却剂导管连接到导管支撑结构，导管支撑结构具有选择性地固定在计算机系统的第一预配置存储器模块插槽内的形状因子，以便定位液体冷却剂导管在第一个插槽之上。热管提供液体导管与散热器组件之间的直接热接触，与存储器模块的表面直接热接触。该装置可以包括用于类似地冷却第二存储器模块的第二热管和第二散热器组件。在替代配置中，设备可以冷却导管的相对侧上的存储器模块或存储器模块，这些存储器模块都在导管的同一侧。

13. 发明授权

US07969736B1 System for cooling memory modules 有权
标题翻译：用于冷却内存模块的系统
公开(公告)号：US07969736B1
公开(公告)日：2011-06-28
申请号：US12701640
申请日：2010-02-08
申请人： Madhusudan K. Iyengar , Vinod Kamath , Howard V. Mahaney, Jr. , Jason A. Matteson , Mark E. Steinke
发明人： Madhusudan K. Iyengar , Vinod Kamath , Howard V. Mahaney, Jr. , Jason A. Matteson , Mark E. Steinke
IPC分类号： H05K7/20
CPC分类号： H01L23/36 , H01L23/4338 , H01L2924/0002 , H01L2924/00
摘要： DIMMs are cooled by positioning a thermally conductive base between adjacent DIMMs. The thermally conductive base, such as a heat pipe or metal rod, receives heat from the DIMMs through thermally conductive elements that are selectively biased outward against the installed DIMMs. The base transfers the heat to a liquid conduit extending along the end of the DIMMs, where a circulating liquid carries away the heat. The thermally conductive elements provide an adjustable span to accommodate variations in distance between the DIMM surfaces. Embodiments of the invention may be installed without extending above the height of the DIMM.
摘要翻译：通过在相邻DIMM之间定位导热底座来冷却DIMM。诸如热管或金属杆的导热基座通过导热元件从DIMM接收热量，导热元件被选择性地偏压抵靠所安装的DIMM。底座将热量传送到沿着DIMM端部延伸的液体导管，其中循环液体带走热量。导热元件提供可调整的跨度以适应DIMM表面之间的距离的变化。可以安装本发明的实施例而不延伸到DIMM的高度之上。

14. 发明申请

US20130000736A1 ADJUSTABLE AND DIRECTIONAL FLOW PERFORATED TILES 审中-公开
标题翻译：可调和方向流动执行平台
公开(公告)号：US20130000736A1
公开(公告)日：2013-01-03
申请号：US13172765
申请日：2011-06-29
申请人： Patrick A. Coico , David P. Graybill , Allan R. Hoeft , Madhusudan K. Iyengar , Roger R. Schmidt , Gerard V. Weber, JR.
发明人： Patrick A. Coico , David P. Graybill , Allan R. Hoeft , Madhusudan K. Iyengar , Roger R. Schmidt , Gerard V. Weber, JR.
IPC分类号： F17D3/00
CPC分类号： H05K7/20836 , F17D3/00 , H05K7/20 , H05K7/20181 , H05K7/20745 , Y10T137/0324 , Y10T137/6851
摘要： An air flow control assembly, system, and method for controlling air flow to a server rack. An example air flow control assembly includes a retractable barrier configured to block the air flow, at least partially, from passing through a perforated floor tile to the server rack. The air flow control assembly also includes a barrier mount configured to secure the retractable barrier proximate the perforated floor tile.
摘要翻译：用于控制到服务器机架的空气流的气流控制组件，系统和方法。示例性空气流量控制组件包括可缩回屏障，所述可伸缩屏障被配置为阻挡空气流，至少部分地阻止穿过穿孔的地板砖到服务器机架。空气流量控制组件还包括被配置为将可伸缩的屏障固定在穿孔地板砖附近的阻挡安装座。

15. 发明授权

US07837352B2 Light source for illuminating an electronics rack to facilitate servicing thereof 有权
标题翻译：用于照亮电子机架以便于维修的光源
公开(公告)号：US07837352B2
公开(公告)日：2010-11-23
申请号：US11954272
申请日：2007-12-12
申请人： David P. Graybill , Madhusudan K. Iyengar , Jeffrey A. Newcomer , Roger R. Schmidt , Prabjit Singh , Gerard V. Weber
发明人： David P. Graybill , Madhusudan K. Iyengar , Jeffrey A. Newcomer , Roger R. Schmidt , Prabjit Singh , Gerard V. Weber
IPC分类号： F21S4/00
CPC分类号： H05K7/1488 , F21K9/00 , F21S4/20 , F21V21/30
摘要： An apparatus is provided for facilitating servicing of an electronics rack. The apparatus includes a light source, which includes a plurality of light-emitting diodes. The plurality of light-emitting diodes are secured to the electronics rack or a floor tile disposed adjacent to the electronics rack, and are configured to illuminate at least a lower portion of the electronics rack at either the air inlet or air outlet side of the rack. A power supply is also provided for selectively supplying power to the plurality of light-emitting diodes. In one implementation, the light source includes an elongate light bar, which is configured to mount to either the inlet door or outlet door of the electronics rack, and the plurality of light-emitting diodes are secured to an elongate housing structure which pivotally couples to a base plate for adjustment of a direction of illumination by the light-emitting diodes.
摘要翻译：提供了一种便于维护电子机架的装置。该装置包括一个包括多个发光二极管的光源。多个发光二极管被固定到电子机架或邻近电子机架设置的地板瓦片，并且被构造成在机架的空气入口或空气出口侧的至少一部分照明电子机架。还提供用于选择性地向多个发光二极管供电的电源。在一个实施方案中，光源包括细长的光条，其被配置为安装到电子机架的入口门或出口门，并且多个发光二极管被固定到细长的壳体结构，其被枢转地耦合到用于调节发光二极管的照明方向的基板。

16. 发明授权

US08919143B2 Air-cooling wall with slidable heat exchangers 有权
标题翻译：具有滑动式热交换器的空气冷却壁
公开(公告)号：US08919143B2
公开(公告)日：2014-12-30
申请号：US13115390
申请日：2011-05-25
申请人： Eric A. Eckberg , David P. Graybill , Madhusudan K. Iyengar , Howard V. Mahaney, Jr. , Roger R. Schmidt , Kenneth R. Schneebeli
发明人： Eric A. Eckberg , David P. Graybill , Madhusudan K. Iyengar , Howard V. Mahaney, Jr. , Roger R. Schmidt , Kenneth R. Schneebeli
IPC分类号： F28D11/00 , F25D23/12 , H05K7/20
CPC分类号： H05K7/2079
摘要： An air-cooling apparatus is provided which includes an air-cooling wall cooling airflow passing through an electronics rack(s) of a data center. The air-cooling wall is disposed separate from and in spaced relation to the air inlet or air outlet side(s) of the electronics rack(s), and includes a wall panel support structure disposed separate from the electronics rack(s), which supports one or more slidable wall panels. The slidable wall panel(s) includes an air-to-liquid heat exchanger slidably supported and disposed in spaced relation to the air outlet or air inlet side of the electronics rack(s). The heat exchanger extracts heat from air passing across the heat exchanger and is slidable within the support structure in a direction transverse to the direction of airflow through the rack(s). Slidable support of the heat exchanger by the support structure facilitates access to the air outlet or air inlet sides of the electronics rack(s).
摘要翻译：提供了一种空气冷却装置，其包括通过数据中心的电子机架的冷却空气的冷却壁。空气冷却壁与电子机架的空气入口侧或空气出口侧分开设置并且与空气出口侧分开设置，并且包括与电子机架分离设置的壁板支撑结构，支撑一个或多个可滑动的墙板。可滑动壁板包括可滑动地支撑并设置成与电子机架的空气出口或空气入口侧间隔开的空气 - 液体热交换器。热交换器从穿过热交换器的空气中提取热量，并且可以在支撑结构内沿横向于穿过机架的气流方向的方向滑动。通过支撑结构的热交换器的可滑动支撑件便于进入电子机架的空气出口或空气入口侧。

17. 发明申请

US20110056675A1 APPARATUS AND METHOD FOR ADJUSTING COOLANT FLOW RESISTANCE THROUGH LIQUID-COOLED ELECTRONICS RACK(S) 审中-公开
标题翻译：通过液体冷却电子架（S）调节冷却剂流动阻力的装置和方法
公开(公告)号：US20110056675A1
公开(公告)日：2011-03-10
申请号：US12556040
申请日：2009-09-09
申请人： Wayne A. Barringer , David P. Graybill , Madhusudan K. Iyengar , Roger R. Schmidt , James J. Steffes , Gerard V. Weber, JR.
发明人： Wayne A. Barringer , David P. Graybill , Madhusudan K. Iyengar , Roger R. Schmidt , James J. Steffes , Gerard V. Weber, JR.
IPC分类号： G05D23/00 , F28F13/00
CPC分类号： H05K7/20709 , H05K7/20272 , H05K7/20281 , H05K7/20736 , H05K7/20763 , H05K7/2079
摘要： Apparatuses and methods are presented for adjusting coolant flow resistance through one or more liquid-cooled electronics racks. Flow restrictors are employed in association with multiple heat exchange tube sections of a heat exchange assembly, or in association with a plurality of coolant supply lines or coolant return lines feeding multiple heat exchange assemblies. Flow restrictors associated with respective heat exchange tube sections (or respective heat exchange assemblies) are disposed at the coolant channel inlet or coolant channel outlet of the tube sections (or of the heat exchange assemblies). These flow restrictors tailor coolant flow resistance through the heat exchange tube sections or through the heat exchange assemblies to enhance overall heat transfer within the tube sections or across heat exchange assemblies by tailoring coolant flow. In one embodiment, the flow restrictors tailor a coolant flow distribution differential across multiple heat exchange tube sections or across multiple heat exchange assemblies.
摘要翻译：提出了通过一个或多个液冷电子机架来调节冷却剂流动阻力的装置和方法。流量限制器与热交换组件的多个热交换管部分相关联地使用，或者与供给多个热交换组件的多个冷却剂供应管线或冷却剂返回管路相关联地使用。与相应的热交换管部分（或相应的热交换组件）相关联的流量限制器设置在管部分（或热交换组件）的冷却剂通道入口或冷却剂通道出口处。这些流量限制器通过热交换管部分或通过热交换组件来调节冷却剂流动阻力，以通过调整冷却剂流量来增强管部分内部或通过热交换组件的整体热传递。在一个实施例中，流量限制器定制跨越多个热交换管部分或跨多个热交换组件的冷却剂流量分配差。

18. 发明授权

US09480186B2 Apparatus and method for facilitating air cooling of an electronics rack 有权
标题翻译：用于促进电子机架的空气冷却的装置和方法
公开(公告)号：US09480186B2
公开(公告)日：2016-10-25
申请号：US11958528
申请日：2007-12-18
申请人： Steven J. Ahladas , David P. Graybill , Madhusudan K. Iyengar , Roger R. Schmidt , Prabjit Singh , Gerard V. Weber, Jr.
发明人： Steven J. Ahladas , David P. Graybill , Madhusudan K. Iyengar , Roger R. Schmidt , Prabjit Singh , Gerard V. Weber, Jr.
IPC分类号： H05K5/00 , H05K7/20
CPC分类号： H05K7/20745 , H05K7/20736
摘要： Apparatus and method are provided for facilitating air cooling of an electronics rack. The apparatus includes a tile assembly, temperature sensor and controller. The tile assembly is disposed adjacent to the electronics rack, and includes a perforated tile and one or more controllable air-moving devices associated with the perforated tile for moving air through the perforated tile. The temperature sensor is positioned for sensing air temperature adjacent and external to, or within, the electronics rack, and the controller is coupled to the tile assembly and the temperature sensor for controlling operation of the air-moving device. Airflow through the tile assembly is adjusted based on air temperature sensed, thereby facilitating air cooling of the electronics rack. In one embodiment, the tile assembly is a floor tile assembly with an air-to-liquid heat exchanger disposed between the perforated tile and the air-moving device for cooling air passing through the floor tile assembly.
摘要翻译：提供了用于促进电子机架的空气冷却的装置和方法。该装置包括瓦片组件，温度传感器和控制器。瓦片组件邻近电子机架布置，并且包括穿孔瓦片和与穿孔瓦片相关联的一个或多个可控空气移动装置，用于使空气移动穿过穿孔瓦片。温度传感器被定位成用于感测电子机架附近或外部的空气温度，并且控制器耦合到瓦片组件和温度传感器，以控制空气移动装置的操作。基于感测的空气温度调节通过瓦片组件的气流，从而有助于电子机架的空气冷却。在一个实施例中，瓦片组件是地板砖组件，其中空气 - 液体热交换器设置在穿孔瓦片和空气移动装置之间，用于冷却通过地板瓦片组件的空气。

19. 发明授权

US09045995B2 Electronics rack with liquid-coolant-driven, electricity-generating system 有权
标题翻译：电子机架采用液冷驱动，发电系统
公开(公告)号：US09045995B2
公开(公告)日：2015-06-02
申请号：US13103233
申请日：2011-05-09
申请人： David P. Graybill , Allan R. Hoeft , Madhusudan K. Iyengar , Donald W. Porter , Enrico A. Romano , Roger R. Schmidt , Gerard V. Weber, Jr.
发明人： David P. Graybill , Allan R. Hoeft , Madhusudan K. Iyengar , Donald W. Porter , Enrico A. Romano , Roger R. Schmidt , Gerard V. Weber, Jr.
IPC分类号： F01D15/10 , F02C6/00 , H02K7/18 , H02P9/04 , F02B63/04 , F03G7/08 , F03B13/00 , F03B13/10 , F01D15/08
CPC分类号： F01D15/10 , F01D15/08 , F03B13/00
摘要： An electronics rack with a cooling apparatus and a liquid-coolant-driven, electricity-generating system. The generating system includes a housing coupled in fluid communication with a fluid transport pipe of the cooling apparatus, an impeller disposed within the housing and positioned to turn with flow of fluid across the impeller, one or more magnetic structures disposed to turn with turning of the impeller, and an electrical circuit. Electricity is generated for the electrical circuit with turning of the one or more magnetic structures, and is supplied to an electrical load disposed within or associated with the electronics rack.
摘要翻译：具有冷却装置和液体冷却剂驱动的发电系统的电子机架。所述发电系统包括与所述冷却装置的流体输送管道流体连通的壳体，设置在所述壳体内并且被定位成随着流过所述叶轮的流体而转动的叶轮，一个或多个磁性结构，叶轮和电路。通过一个或多个磁性结构的转动为电路产生电，并且被提供给设置在电子机架中或与电子机架相关联的电负载。

20. 发明授权

US08077462B2 Stress relieved hose routing to liquid-cooled electronics rack door 失效
标题翻译：减轻软管布置到液冷电子机柜门
公开(公告)号：US08077462B2
公开(公告)日：2011-12-13
申请号：US12552479
申请日：2009-09-02
申请人： Wayne A. Barringer , David P. Graybill , Madhusudan K. Iyengar , Roger R. Schmidt , James J. Steffes , Gerard V. Weber, Jr.
发明人： Wayne A. Barringer , David P. Graybill , Madhusudan K. Iyengar , Roger R. Schmidt , James J. Steffes , Gerard V. Weber, Jr.
IPC分类号： H05K7/20
CPC分类号： H05K7/20781 , H05K7/2079 , H05K7/20818 , Y10T29/4935
摘要： A cooling apparatus and method are provided which include an air-to-liquid heat exchanger and system coolant inlet and outlet plenums mounted to an electronics rack door along an edge of the door remote from the edge hingedly mounted to the rack. The plenums are in fluid communication with the heat exchanger and respectively include an inlet and outlet. Coolant supply and return hoses are disposed above the electronics rack and couple the inlet plenum to a coolant supply header and the outlet plenum to a coolant return header. The hoses are sufficiently long and flexible to open or close the door. A stress relief structure is attached to the top of the door and clamps the supply and return hoses in fixed relation to relieve stress on connect couplings at the ends of the hoses to the plenum inlet and outlet during opening or closing of the door.
摘要翻译：提供了一种冷却装置和方法，其包括空气 - 液体热交换器和系统冷却剂入口和出口集气室，其沿着门的边缘安装到电子机架门，远离铰接安装到机架的边缘。增压室与热交换器流体连通，分别包括入口和出口。冷却剂供应和返回软管设置在电子机架上方，并将进气室连接到冷却剂供应集管，并将出口压力室连接到冷却剂返回集管。软管足够长且灵活以打开或关闭门。应力消除结构连接到门的顶部，并且固定地夹紧供应和返回软管，以在门的打开或关闭期间将软管端部处的连接联接器上的压力释放到通风口入口和出口。

你已经成功收藏专利！

检索式保存成功!

IPRDB

热门服务

关于我们

友情链接

联系方式