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11. 发明申请

US20140216396A1 DIRECT INJECTION GASOLINE ENGINE AND METHOD OF CONTROLLING THE DIRECT INJECTION GASOLINE ENGINE 有权
标题翻译：直接注射汽油发动机及其控制直喷式汽油发动机的方法
公开(公告)号：US20140216396A1
公开(公告)日：2014-08-07
申请号：US14343381
申请日：2012-08-28
申请人： Hiroyuki Yamashita , Kazuaki Narahara , Tatsuya Tanaka , Yoshitomo Takahashi , Yusuke Nakao , Takashi Ikai , Hidefumi Fujimoto , Masatoshi Seto , Yoshio Tanita , Kazuo Ichikawa , Shingo Kai , Susumu Masuyama , Hirokazu Nakahashi , Keiji Araki
发明人： Hiroyuki Yamashita , Kazuaki Narahara , Tatsuya Tanaka , Yoshitomo Takahashi , Yusuke Nakao , Takashi Ikai , Hidefumi Fujimoto , Masatoshi Seto , Yoshio Tanita , Kazuo Ichikawa , Shingo Kai , Susumu Masuyama , Hirokazu Nakahashi , Keiji Araki
IPC分类号： F02B17/00
CPC分类号： F02B17/005 , F01L1/34 , F01L3/04 , F01L13/0015 , F01L2101/00 , F01L2101/02 , F02B11/00 , F02D41/3035 , F02D41/401 , F02D41/403 , F02D2200/025 , F02F3/12 , F02P5/153 , F02P23/04 , Y02T10/44 , Y02T10/46
摘要： A direct injection engine includes an ignition assistance section applying energy to fuel injected into a cylinder using an injector to assist auto-ignition combustion of the fuel when the engine is within an auto-ignition combustion operation range. A start time of fuel injection is set within a period from a terminal stage of a compression stroke to a compression top dead center. The energy is applied to the fuel injected into the cylinder in a period from start of the fuel injection to an initial stage of an expansion stroke such that a time of a specific crank angle when an increase rate of in-cylinder pressure, which is a ratio of a change in the in-cylinder pressure to a change in a crank angle in motoring the engine, reaches a negative maximum value overlaps a combustion period when a combustion mass percentage of the fuel ranges from 10% to 90%.
摘要翻译：直接喷射发动机包括点火辅助部分，当发动机处于自燃点燃燃烧操作范围内时，使用喷射器将能量喷射到喷射到气缸中的燃料中，以辅助燃料的自燃。在从压缩冲程的终端到压缩上止点的期间内设定燃料喷射的开始时间。在从燃料喷射开始到膨胀冲程的初始阶段的期间，将能量施加到喷射到气缸中的燃料，使得当缸内压力的增加率（即当燃料的燃烧质量百分比为10％至90％时，缸内压力变化与发动机起动时曲柄角变化的比率达到负最大值与燃烧时间重叠。

12. 发明授权

US08579108B2 Cigarette package 有权
标题翻译：香烟包装
公开(公告)号：US08579108B2
公开(公告)日：2013-11-12
申请号：US13334858
申请日：2011-12-22
申请人： Hitoshi Tanbo , Hiroyuki Yamashita
发明人： Hitoshi Tanbo , Hiroyuki Yamashita
IPC分类号： A24F15/00 , B65D85/10 , B65D85/12
CPC分类号： B65D85/1045 , B65D77/02
摘要： A cigarette package includes an inner wrapping body formed by folding an inner wrapper having a film material ply sandwiched between a paper ply and a heat seal material ply into a substantially cuboidal shape, including substantially-parallel two half-cut lines extending from a top face into an upper portion of a front face of an inner boxy body each formed of a cut penetrating through the paper ply into the film material ply, a cut line formed of a cut penetrating through an outer layer constituting an overlap on the front face of the inner box body, at an upper location. A heat-sealed part is formed to surround the cut line by heat-sealing inner and outer layers, wherein an outer side of the outer layer is bonded to an inner side of a front lid, in a section above the cut line within a region surrounded by the heat-sealed part.
摘要翻译：香烟包装体包括通过将具有夹在纸层和热密封材料层之间的薄膜材料层的内包装折叠成基本上呈立方形状而形成的内包装体，其包括基本上平行的两个半切线，其从顶面进入内胆囊体的前表面的上部，每个都由穿透纸层的切口形成为薄膜材料层，切割线形成为穿透外层的切口，内箱体，在上部位置。通过热封内层和外层来形成热封部分，该热密封部分通过热封内层和外层而围绕切割线，其中外层的外侧在一个区域内的切割线上方的部分中结合到前盖的内侧被热封部分包围。

13. 发明申请

US20120199661A1 VEHICLE AIR CONDITIONER 有权
标题翻译：车用空调
公开(公告)号：US20120199661A1
公开(公告)日：2012-08-09
申请号：US13503121
申请日：2011-03-09
申请人： Junichiro Hara , Tomohiko Shibata , Hiroyuki Yamashita
发明人： Junichiro Hara , Tomohiko Shibata , Hiroyuki Yamashita
IPC分类号： F25B41/06
CPC分类号： B60H1/00528 , B60H1/00514 , B60H1/00521 , B60H1/00542 , B60H1/0055
摘要： Provided is a vehicle air conditioner which includes a simple water-proofing structure that is capable of preventing flooding of a vehicle cabin from mating surfaces, etc. of expansion-valve covers and top and bottom divided cases of an air conditioning unit (HVAC unit) without employing a water-proofing cover, or the like. In a vehicle air conditioner in which expansion-valve covers that are vertically divided into two parts are provided at an outer surface side of top and bottom divided cases of an air conditioning unit disposed in the vehicle cabin so as to bridge mating surfaces of the cases; an expansion valve can be disposed inside the expansion-valve covers; and, in addition, the interior of the expansion-valve covers communicates with an engine compartment via an opening provided in an toe board.
摘要翻译：本发明提供一种车辆用空调装置，其具有简单的防水结构，其能够防止车厢的溢流与膨胀阀盖的配合面等，以及空调单元（HVAC单元）的顶部和底部分开的壳体，而不使用防水盖等。在设置在车厢内的空调单元的顶部和底部分开的壳体的外表面侧设置有垂直分割成两部分的膨胀阀盖的车辆空调装置，用于桥接壳体的配合面 ; 膨胀阀可以设置在膨胀阀盖的内部; 此外，膨胀阀盖的内部经由设置在趾板上的开口与发动机室连通。

14. 发明申请

US20120111746A1 CIGARETTE PACKAGE 有权
标题翻译：香烟包装
公开(公告)号：US20120111746A1
公开(公告)日：2012-05-10
申请号：US13334858
申请日：2011-12-22
申请人： Hitoshi Tanbo , Hiroyuki Yamashita
发明人： Hitoshi Tanbo , Hiroyuki Yamashita
IPC分类号： B65D85/10 , B65D43/16 , A24F15/12
CPC分类号： B65D85/1045 , B65D77/02
摘要： A cigarette package includes an inner wrapping body formed by folding an inner wrapper having a film material ply sandwiched between a paper ply and a heat seal material ply into a substantially cuboidal shape, including substantially-parallel two half-cut lines extending from a top face into an upper portion of a front face of an inner boxy body each formed of a cut penetrating through the paper ply into the film material ply, a cut line formed of a cut penetrating through an outer layer constituting an overlap on the front face of the inner box body, at an upper location. A heat-sealed part is formed to surround the cut line by heat-sealing inner and outer layers, wherein an outer side of the outer layer is bonded to an inner side of a front lid, in a section above the cut line within a region surrounded by the heat-sealed part.
摘要翻译：香烟包装体包括通过将具有夹在纸层和热密封材料层之间的薄膜材料层的内包装折叠成基本上呈立方形状而形成的内包装体，其包括基本上平行的两个半切线，其从顶面进入内胆囊体的前表面的上部，每个都由穿透纸层的切口形成为薄膜材料层，切割线形成为穿透外层的切口，内箱体，在上部位置。通过热封内层和外层来形成热封部分，该热密封部分通过热封内层和外层而围绕切割线，其中外层的外侧在一个区域内的切割线上方的部分中结合到前盖的内侧被热封部分包围。

15. 发明申请

US20110304848A1 EXAMINING APPARATUS AND EXAMINING METHOD 有权
标题翻译：检验设备和检验方法
公开(公告)号：US20110304848A1
公开(公告)日：2011-12-15
申请号：US13202717
申请日：2009-11-19
申请人： Kazumasa Tanaka , Hiroyuki Yamashita
发明人： Kazumasa Tanaka , Hiroyuki Yamashita
IPC分类号： G01N21/88
CPC分类号： G01N21/00 , G01N21/9501 , G01N21/95607
摘要： When examination at a scan speed equal to or higher than the line rate of the sensor such as a TDI sensor is carried out, the line rate of the TDI sensor is asynchronous with the scan speed, and the image is blurred. Therefore, a TDI sensor cannot be used at a scan speed equal to or higher than the line rate of the TDI sensor. This problem has not been considered. To solve the problem, high-speed examination irrespective of the line rate of the TDI sensor is enabled. To control the line rate of the TDI sensor and stage scan speed asynchronously and to solve the problem of the image addition variation due to the charge accumulation of the TDI sensor, the object to be examined is irradiated with thin-line illumination, and only a given pixel line of the TDI sensor is made to receive light scattered by the object to be examined. The aspect ratio of the detection pixel size can be controlled by the speed ratio between the line rate of the TDI sensor and the stage scan speed.
摘要翻译：当扫描速度等于或高于诸如TDI传感器的传感器的线路速率进行检查时，TDI传感器的线路速率与扫描速度异步，图像模糊。因此，TDI传感器不能以等于或高于TDI传感器的线路速率的扫描速度使用。这个问题还没有被考虑。为了解决这个问题，无论TDI传感器的线路速率如何，都可以进行高速检查。为了异步地控制TDI传感器的线路速率和级扫描速度，并且为了解决由于TDI传感器的电荷累积引起的图像增加变化的问题，用细线照明照射被检查对象，只有使TDI传感器的给定像素线接收被被检体散射的光。检测像素尺寸的宽高比可以通过TDI传感器的线路速率与平台扫描速度之间的速度比来控制。

16. 发明授权

US07999932B2 Inspection apparatus and inspection method 有权
标题翻译：检验仪器和检验方法
公开(公告)号：US07999932B2
公开(公告)日：2011-08-16
申请号：US12771842
申请日：2010-04-30
申请人： Hiroyuki Yamashita , Yukihisa Mohara , Eiji Imai
发明人： Hiroyuki Yamashita , Yukihisa Mohara , Eiji Imai
IPC分类号： G01N21/00 , G01B11/02
CPC分类号： H01L21/67288 , G01N21/94 , G01N21/9501 , G01N21/9503 , G01N21/95607 , G01N2021/95615
摘要： An inspection apparatus includes a wafer stage for carrying a wafer, an illumination module which irradiates an inspection beam on the wafer carried on the wafer stage, a detection module which detects scattering rays or reflection rays from the wafer on the wafer stage and outputs an image signal, a coordinates control module which stores information about the arrangement of individual inspection areas on the wafer, and an imperfect area recognition module which recognizes, on the basis of the inspection area arrangement information stored in the coordinates control module, an imperfect inspection area interfering with a wafer edge.
摘要翻译：检查装置包括用于承载晶片的晶片台，在晶片载物台上承载的晶片上照射检查光束的照明模块，检测来自晶片台上的晶片的散射光线或反射光线的检测模块，并输出图像信号，存储关于晶片上的各个检查区域的布置的信息的坐标控制模块，以及不完备区域识别模块，其基于存储在坐标控制模块中的检查区域布置信息识别出不完美的检查区域干扰具有晶片边缘。

17. 发明授权

US07953567B2 Defect inspection apparatus and defect inspection method 有权
标题翻译：缺陷检查装置和缺陷检查方法
公开(公告)号：US07953567B2
公开(公告)日：2011-05-31
申请号：US12683455
申请日：2010-01-07
申请人： Kei Shimura , Minori Noguchi , Masaaki Ito , Kenji Aiko , Shuichi Chikamatsu , Shigeo Otsuki , Shigeru Abe , Masayuki Ochi , Takuaki Sekiguchi , Hiroyuki Yamashita
发明人： Kei Shimura , Minori Noguchi , Masaaki Ito , Kenji Aiko , Shuichi Chikamatsu , Shigeo Otsuki , Shigeru Abe , Masayuki Ochi , Takuaki Sekiguchi , Hiroyuki Yamashita
IPC分类号： G06F19/00 , G01N21/00
CPC分类号： G01N21/9501 , G01N21/94 , G01N21/95607 , G01N21/95623 , G06K9/2036 , G06K2209/19 , G06T7/0006 , G06T2207/30148
摘要： A defect inspection apparatus includes: stages each mounting an inspecting object on which a circuit pattern having a group of parallel lines is formed, and each running perpendicular or parallel to the group of lines; an illumination optical system which illuminating a surface of the inspecting object with a slit beam being slit light so that a longitudinal direction of the slit beam is substantially perpendicular to the running directions of the stages, and which has a first inclined angle formed by the direction of the group of lines and a projection line, of an optical axis of the slit beam, to the inspecting object; a spatial filter that shields or transmits reflected and scattered light of the inspecting object according to a difference in distribution of orientation; and a detection optical system that detects the reflected and scattered light transmitted through the spatial filter by image sensors. Moreover, the illumination optical system illuminates the inspecting object with another slit beam from a direction opposite to an incident direction of the slit beam on a plane.
摘要翻译：缺陷检查装置包括：各自安装检查对象的阶段，在其上形成具有一组平行线的电路图案，并且每个行与该组线垂直或平行; 照明光学系统，其利用狭缝光照射被检查物体的表面，使得狭缝光束的纵向方向基本上垂直于台阶的行进方向，并且具有由方向形成的第一倾斜角并且将所述狭缝光束的光轴的投影线和所述检查对象的投影线，空间滤波器，根据取向分布的差异来屏蔽或发射检测对象的反射和散射光; 以及检测光学系统，其通过图像传感器检测透过空间滤波器的反射和散射光。此外，照明光学系统在与平面上的狭缝光束的入射方向相反的方向上用另一个狭缝光照射检查对象。

18. 发明申请

US20110109901A1 FOREIGN MATTER INSPECTION APPARATUS 有权
标题翻译：外部检验装置
公开(公告)号：US20110109901A1
公开(公告)日：2011-05-12
申请号：US13009366
申请日：2011-01-19
申请人： Eiji IMAI , Masami Ooyama , Hideyuki Okamoto , Hiroyuki Yamashita
发明人： Eiji IMAI , Masami Ooyama , Hideyuki Okamoto , Hiroyuki Yamashita
IPC分类号： G01N21/94
CPC分类号： G01N21/9501 , G01N21/94 , G01N21/95607
摘要： Selection with alignment marks of an optimal template, its identification and similarity judgment are conducted by a calculation function of a correlation value provided to a foreign matter inspection apparatus. In other words, the foreign matter inspection apparatus includes unit for registering feature points of alignment marks formed on a surface of an inspected object, unit for collecting image data of the alignment marks formed on the surface of the inspected object and a data processor for extracting a feature point from the image data and calculating a correlation value of both feature points, and registers the image data of the alignment mark on the basis of a threshold value of the correlation value.
摘要翻译：通过提供给异物检查装置的相关值的计算函数进行最佳模板的对准标记的选择，其识别和相似性判断。换句话说，异物检查装置包括用于登记形成在检查对象的表面上的对准标记的特征点的单元，用于收集形成在被检查对象的表面上的对准标记的图像数据的单元和用于提取的数据处理器来自图像数据的特征点并计算两个特征点的相关值，并且基于相关值的阈值来登记对准标记的图像数据。

19. 发明授权

US07874758B2 Binding device 有权
标题翻译：装订装置
公开(公告)号：US07874758B2
公开(公告)日：2011-01-25
申请号：US11577692
申请日：2005-01-11
申请人： Kanji Tanaka , Hiroshi Arai , Hiroyuki Yamashita
发明人： Kanji Tanaka , Hiroshi Arai , Hiroyuki Yamashita
IPC分类号： B42F9/00
CPC分类号： B42F9/001 , Y10T24/204 , Y10T24/206
摘要： A binding device having a binding member that operates at a binding position of objects to be bound has a structure with which the bound objects do not readily come off. The binding device includes a board having a bearing plate. A spring member and an operation lever are attached to a shaft inserted in the bearing plate and a turned-up part. Protruding pieces of a binding member are inserted in through holes of turned-up parts formed in the board. One end of the spring member is secured to the operation lever, and the other end is fitted in a through hole of a turned portion at the distal end of the binding member. By closing the operation lever, the binding member rotates around a line connecting the protruding pieces at both ends, thereby pressing down sheets of paper placed on the board with a pressing portion. At this time, the other end of the spring member presses the turned portion, thereby biasing the pressing portion.
摘要翻译：具有在要绑定的物体的绑定位置操作的装订构件的装订装置具有结合物体不容易脱离的结构。装订装置包括具有支承板的板。弹簧构件和操作杆附接到插入到支承板中的轴和翻转部分上。装订构件的突出片插入形成在板上的翻边部分的通孔中。弹簧构件的一端固定在操作杆上，另一端装配在装订构件的远端处的转动部分的通孔中。通过关闭操作杆，装订构件围绕连接两端的突出片的线旋转，由此用按压部分压下放置在板上的纸张。此时，弹簧构件的另一端按压转动部分，从而偏压按压部分。

20. 发明授权

US07829992B2 Semiconductor device and method for manufacturing semiconductor device 有权
标题翻译：半导体装置及半导体装置的制造方法
公开(公告)号：US07829992B2
公开(公告)日：2010-11-09
申请号：US11886904
申请日：2007-04-24
申请人： Mitsuo Sugino , Satoru Katsurayama , Tomoe Yamashiro , Tetsuya Miyamoto , Hiroyuki Yamashita
发明人： Mitsuo Sugino , Satoru Katsurayama , Tomoe Yamashiro , Tetsuya Miyamoto , Hiroyuki Yamashita
IPC分类号： H01L23/02 , H01L23/04 , H01L23/053 , H01L23/12 , H01L23/48
CPC分类号： H01L25/0657 , H01L23/16 , H01L23/3128 , H01L23/562 , H01L24/48 , H01L24/73 , H01L25/105 , H01L25/18 , H01L2224/16225 , H01L2224/32225 , H01L2224/48091 , H01L2224/48227 , H01L2224/73204 , H01L2224/73265 , H01L2225/0651 , H01L2225/06517 , H01L2225/0652 , H01L2225/06541 , H01L2225/06551 , H01L2225/06572 , H01L2225/06582 , H01L2225/06586 , H01L2225/1023 , H01L2225/1058 , H01L2225/107 , H01L2924/00014 , H01L2924/01012 , H01L2924/01019 , H01L2924/0102 , H01L2924/01046 , H01L2924/01078 , H01L2924/01079 , H01L2924/01087 , H01L2924/07802 , H01L2924/07811 , H01L2924/09701 , H01L2924/12041 , H01L2924/12042 , H01L2924/14 , H01L2924/15311 , H01L2924/15331 , H01L2924/181 , H01L2924/3511 , H01L2924/00 , H01L2924/00012 , H01L2224/45099 , H01L2224/45015 , H01L2924/207
摘要： A semiconductor device (100) comprises a first resin substrate (101) on which a first semiconductor chip (125) is mounted a surface thereof; a second resin substrate (111) on which a second semiconductor chip (131) is mounted on a surface thereof; and a resin base material (109), joined to a front surface of the first resin substrate (101) and to a back surface of the second resin substrate (111), so that these surfaces are electrically connected. The resin base material (109) is disposed in a circumference of the first resin substrate (101) in the surface of the first resin substrate (101). Further, the first semiconductor chip (125) is disposed in a space section provided among the first resin substrate (101), the second resin substrate (111) and the resin base material (109) in the surface of the first resin substrate (101).
摘要翻译：半导体器件（100）包括第一树脂基板（101），第一半导体芯片（125）的表面安装有第一树脂基板（101）第二树脂基板（111），其表面上安装有第二半导体芯片（131）; 以及与第一树脂基板（101）的前表面和第二树脂基板（111）的背面接合的树脂基材（109），使得这些表面电连接。树脂基材（109）在第一树脂基板（101）的表面设置在第一树脂基板（101）的周围。此外，第一半导体芯片（125）设置在设置在第一树脂基板（101），第二树脂基板（111）和树脂基材（109）之间的空间部分中，第一树脂基板）。

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