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    • 5. 发明申请
    • INSPECTION APPARATUS AND INSPECTION METHOD
    • 检查装置和检查方法
    • US20090161943A1
    • 2009-06-25
    • US12338528
    • 2008-12-18
    • Hiroyuki YamashitaNorio SakaiyaKei ShimuraMasaaki Ito
    • Hiroyuki YamashitaNorio SakaiyaKei ShimuraMasaaki Ito
    • G01N21/88G06T11/20G06K9/00
    • G01N21/88G01N21/9501G01N21/956G01N21/95607G01N2021/8848G01N2021/8861G06K9/2036G06K2209/19G06T7/00
    • The invention is directed to find a false defect from defect candidates and obtain a threshold with which the false defect can be eliminated by the smallest number of review times. Defect candidates are reviewed and selected as a defect or a false defect. By deleting a defect candidate having a characteristic quantity equal to or less than that of the false defect from a map or displaying it in another sign, the false defect can be determined visually. Since the defect candidate having the characteristic quantity equal to or less than that of the selected false defect is deleted from the map or displayed in another sign, the defect candidates unnecessary to set a threshold are not reviewed. The number of defect candidates to be reviewed can be largely reduced as compared with that in the conventional technique. Further, by repeating the above work, the threshold is automatically calculated, and an inspection result map with the threshold is displayed, so that a re-inspection is unnecessary.
    • 本发明旨在从缺陷候选中找到虚假缺陷,并获得最小次数的审查时间可以消除错误缺陷的阈值。 缺陷候选者被审查和选择为缺陷或假缺陷。 通过从地图中删除具有等于或小于虚假缺陷的特征量的缺陷候选物,或者以另一个符号显示,可以视觉地确定假缺陷。 由于具有等于或小于所选择的错误缺陷的特征量的缺陷候选者从地图中删除或以另一个符号显示,所以不会检查不必设置阈值的缺陷候选。 与常规技术相比,可以大大减少待审查的缺陷候选物的数量。 此外,通过重复上述工作,自动计算阈值,并且显示具有阈值的检查结果图,使得不需要重新检查。
    • 6. 发明授权
    • Inspection apparatus and inspection method
    • 检验仪器和检验方法
    • US08351683B2
    • 2013-01-08
    • US12338528
    • 2008-12-18
    • Hiroyuki YamashitaNorio SakaiyaKei ShimuraMasaaki Ito
    • Hiroyuki YamashitaNorio SakaiyaKei ShimuraMasaaki Ito
    • G01N21/88G06T11/20
    • G01N21/88G01N21/9501G01N21/956G01N21/95607G01N2021/8848G01N2021/8861G06K9/2036G06K2209/19G06T7/00
    • The invention is directed to find a false defect from defect candidates and obtain a threshold with which the false defect can be eliminated by the smallest number of review times. Defect candidates are reviewed and selected as a defect or a false defect. By deleting a defect candidate having a characteristic quantity equal to or less than that of the false defect from a map or displaying it in another sign, the false defect can be determined visually. Since the defect candidate having the characteristic quantity equal to or less than that of the selected false defect is deleted from the map or displayed in another sign, the defect candidates unnecessary to set a threshold are not reviewed. The number of defect candidates to be reviewed can be largely reduced as compared with that in the conventional technique. Further, by repeating the above work, the threshold is automatically calculated, and an inspection result map with the threshold is displayed, so that a re-inspection is unnecessary.
    • 本发明旨在从缺陷候选中找到虚假缺陷,并获得最小次数的审查时间可以消除错误缺陷的阈值。 缺陷候选者被审查和选择为缺陷或假缺陷。 通过从地图中删除具有等于或小于虚假缺陷的特征量的缺陷候选物,或者以另一个符号显示,可以视觉地确定假缺陷。 由于具有等于或小于所选择的错误缺陷的特征量的缺陷候选者从地图中删除或以另一个符号显示,所以不会检查不必设置阈值的缺陷候选。 与常规技术相比,可以大大减少待审查的缺陷候选物的数量。 此外,通过重复上述工作,自动计算阈值,并且显示具有阈值的检查结果图,使得不需要重新检查。
    • 7. 发明申请
    • INSPECTION APPARATUS AND INSPECTION SYSTEM
    • 检查装置和检查系统
    • US20130250297A1
    • 2013-09-26
    • US13990103
    • 2011-10-11
    • Masaaki ItoMinori Noguchi
    • Masaaki ItoMinori Noguchi
    • G01N21/95
    • G01N21/9501G01N21/95607
    • Disclosed here is a macro inspection apparatus for a sample such as a semiconductor wafer having a pattern formed thereon, the apparatus being capable of detecting abnormalities in dimension and size with high sensitivity.The inspection apparatus for a sample having pattern formed thereon includes: an illumination optical system which illuminates the sample having the pattern formed thereon; a detection optical system which receives scattered light from the pattern; an imaging device which is disposed over a pupil plane of the detection optical system, the imaging device acquiring Fourier images of the pattern; and a processing unit which compares the Fourier images with the Fourier image of the normal pattern to detect an irregularity of the pattern.
    • 这里公开了一种用于诸如其上形成有图案的半导体晶片的样品的宏观检查装置,该装置能够以高灵敏度检测尺寸和尺寸的异常。 用于其上形成有图案的样品的检查装置包括:照射具有形成在其上的图案的样品的照明光学系统; 检测光学系统,其接收来自图案的散射光; 成像装置,其设置在所述检测光学系统的光瞳平面上,所述成像装置获取所述图案的付里叶图像; 以及处理单元,其将傅立叶图像与正常图案的傅里叶图像进行比较,以检测图案的不规则性。
    • 8. 发明申请
    • INSPECTION APPARATUS
    • 检查装置
    • US20090202138A1
    • 2009-08-13
    • US12361954
    • 2009-01-29
    • Masaaki ItoMinori NoguchiShigeru Matsui
    • Masaaki ItoMinori NoguchiShigeru Matsui
    • G06K9/00
    • G01N21/9501G01N21/95623G01N2021/8822G06K9/74
    • The present invention provides an inspection apparatus having a high throughput and high sensitivity with respect to a number of various manufacturing processes and defects of interest in inspection of a specimen such as a semiconductor wafer on which a pattern is formed. The apparatus illuminates with light the specimen having the pattern formed thereon, forms an image of the specimen on an image sensor through a reflective optics, and determines the existence/nonexistence of a defect. The reflective optics has a conjugate pair of Fourier transform optics. An aberration of the reflective optics is corrected off-axis. The reflective optics has a field of view in non-straight-line slit form on the specimen surface. Also, the optics is of a reflection type, includes a conjugate pair of Fourier transform optics and has a field of view in non-straight-line slit form. An optimum wavelength band is selected according to the specimen (FIG. 1).
    • 本发明提供了一种检测装置,其相对于在其上形成有图案的半导体晶片的样本的检查中的多种制造工艺和多个不同的制造工艺和缺陷而具有高生产率和高灵敏度。 该装置用光照射具有形成在其上的图案的样本,通过反射光学元件在图像传感器上形成样本的图像,并且确定缺陷的存在/不存在。 反射光学器件具有傅立叶变换光学器件的共轭对。 反射光学器件的像差被偏离校正。 反射光学元件在样品表面上具有非直线狭缝形式的视场。 此外,光学器件是反射型的,包括傅立叶变换光学器件的共轭对,并且具有非直线狭缝形式的视场。 根据样品选择最佳波长带(图1)。
    • 9. 发明授权
    • Inspection apparatus
    • 检验仪器
    • US08542354B2
    • 2013-09-24
    • US12361954
    • 2009-01-29
    • Masaaki ItoMinori NoguchiShigeru Matsui
    • Masaaki ItoMinori NoguchiShigeru Matsui
    • G01N21/00
    • G01N21/9501G01N21/95623G01N2021/8822G06K9/74
    • The present invention provides an inspection apparatus having a high throughput and high sensitivity with respect to a number of various manufacturing processes and defects of interest in inspection of a specimen such as a semiconductor wafer on which a pattern is formed. The apparatus illuminates with light the specimen having the pattern formed thereon, forms an image of the specimen on an image sensor through a reflective optics, and determines the existence/nonexistence of a defect. The reflective optics has a conjugate pair of Fourier transform optics. An aberration of the reflective optics is corrected off-axis. The reflective optics has a field of view in non-straight-line slit form on the specimen surface. Also, the optics is of a reflection type, includes a conjugate pair of Fourier transform optics and has a field of view in non-straight-line slit form. An optimum wavelength band is selected according to the specimen (FIG. 1).
    • 本发明提供了一种检测装置,其相对于在其上形成有图案的半导体晶片的样本的检查中的多种制造工艺和多个不同的制造工艺和缺陷而具有高生产率和高灵敏度。 该装置用光照射具有形成在其上的图案的样本,通过反射光学元件在图像传感器上形成样本的图像,并且确定缺陷的存在/不存在。 反射光学器件具有傅立叶变换光学器件的共轭对。 反射光学器件的像差被偏离校正。 反射光学元件在样品表面上具有非直线狭缝形式的视场。 此外,光学器件是反射型的,包括傅立叶变换光学器件的共轭对,并且具有非直线狭缝形式的视场。 根据样品选择最佳波长带(图1)。
    • 10. 发明申请
    • PATTERN DEFECT INSPECTING APPARATUS AND METHOD
    • 图案缺陷检查装置及方法
    • US20110221886A1
    • 2011-09-15
    • US13059908
    • 2009-07-08
    • Hidetoshi NishiyamaMasaaki ItoSachio UtoKei Shimura
    • Hidetoshi NishiyamaMasaaki ItoSachio UtoKei Shimura
    • H04N7/18
    • G01N21/956G01N21/94H01L22/12
    • In recent years, a wafer inspection time in semiconductor manufacturing processes is being required to be reduced for reduction in manufacturing time and for early detection of yield reduction factors. To meet this requirement, there is a need to reduce the time required for inspection parameter setup, as well as the time actually required for inspection. Based on the speed or position change information relating to a transport system 2, inspection is also conducted during acceleration/deceleration of the transport system 2 by controlling an accumulation time and/or operational speed of a detector or by correcting acquired images. Alternate display of review images of a detection region at fixed time intervals improves visibility of the detection region and makes it possible to confirm within a short time whether a defect is present.
    • 近年来,为了减少制造时间和减少因素的早期检测,需要减少半导体制造工序中的晶片检查时间。 为了满足这一要求,需要减少检查参数设置所需的时间以及检查所需的时间。 基于与运输系统2有关的速度或位置变化信息,通过控制检测器的累积时间和/或操作速度或通过校正所获取的图像,也可以在运输系统2的加速/减速期间进行检查。 以固定的时间间隔交替显示检测区域的检查图像提高了检测区域的可视性,并且使得可以在短时间内确认是否存在缺陷。