专利快速检索-快速检索全球专利，免费商用专利数据库-IPRDB

11. 发明授权

US08597540B2 Compositions for polishing silicon-containing substrates 有权
标题翻译：用于抛光含硅基材的组合物
公开(公告)号：US08597540B2
公开(公告)日：2013-12-03
申请号：US13554829
申请日：2012-07-20
申请人： Francesco De Rege Thesauro , Zhan Chen
发明人： Francesco De Rege Thesauro , Zhan Chen
IPC分类号： C09K13/06
CPC分类号： C09K3/1463 , B24B37/044 , C09G1/02 , H01L21/31053 , H01L21/3212
摘要： The invention provides chemical-mechanical polishing (CMP) compositions and methods for polishing a silicon-containing substrate. A method of the invention comprises the steps of contacting a silicon-containing substrate with a polishing pad and an aqueous CMP composition, and causing relative motion between the polishing pad and the substrate while maintaining a portion of the CMP composition in contact with the surface of the substrate to abrade at least a portion of the substrate. The CMP composition comprises a ceria abrasive, a polishing additive bearing a functional group with a pKa of about 4 to about 9, a nonionic surfactant with an hydrophilic portion and a lipophilic portion wherein the hydrophilic portion has a number average molecular weight of about 500 g/mol or higher, and an aqueous carrier, wherein the pH of the composition is 7 or less. The method reduces defects on the wafers, particularly local areas of high removal. The method is also useful for polishing dielectric silicon-containing substrates at a high rate relative to semiconductor silicon-containing substrates.
摘要翻译：本发明提供用于抛光含硅基材的化学机械抛光（CMP）组合物和方法。本发明的方法包括以下步骤：使含硅衬底与抛光垫和水性CMP组合物接触，并且在保持CMP组合物的一部分与表面接触的同时引起抛光垫和衬底之间的相对运动所述衬底磨损所述衬底的至少一部分。 CMP组合物包括二氧化铈研磨剂，具有pKa约4至约9的官能团的抛光添加剂，具有亲水部分和亲油部分的非离子表面活性剂，其中亲水部分的数均分子量为约500g / mol以上，和水性载体，其中组合物的pH为7以下。该方法减少了晶片上的缺陷，特别是高去除的局部区域。该方法对于相对于含半导体硅的衬底以高速率抛光介电含硅衬底也是有用的。

12. 发明申请

US20110166857A1 Human Voice Distinguishing Method and Device 审中-公开
标题翻译：人声识别方法与设备
公开(公告)号：US20110166857A1
公开(公告)日：2011-07-07
申请号：US13001596
申请日：2009-09-15
申请人： Xiangyong Xie , Zhan Chen
发明人： Xiangyong Xie , Zhan Chen
IPC分类号： G10L15/00
CPC分类号： G10L25/78
摘要： A human voice distinguishing method and device are provided. The method involves: taking every n sampling points of the current frame of audio signals as one subsection, wherein n is a positive integer, judging whether two adjacent subsections have transition relative to a distinguishing threshold, wherein the sliding maximum absolute value of the two adjacent subsections is more and less than the distinguishing threshold respectively, if so, then determining the current frame to be human voice, where the sliding maximum absolute value of the subsection is obtained by the following method: taking the maximum value of absolute intensity of every sampling point in this subsection as the initial maximum absolute value of this subsection, and taking the maximum value of the initial maximum absolute value of this subsection and m subsections following this subsection as the sliding maximum absolute value of this subsection, wherein m is a positive integer.
摘要翻译：提供人声识别方法和装置。该方法包括：将音频信号当前帧的每n个采样点作为一个子部分，其中n是正整数，判断两个相邻子部分是否具有相对于一个区别阈值的转变，其中两个邻近的滑动最大绝对值如果是，则分节分别大于区别阈值，然后将当前帧确定为人声，其中通过以下方法获得子段的滑动最大绝对值：取每个采样的绝对强度的最大值指出本小节作为本款的初始最大绝对值，并将本小节的初始最大绝对值的最大值和本小节后面的m个小节作为本小节的滑动最大绝对值，其中m为正整数。

13. 发明申请

US20100190339A1 COMPOSITIONS AND METHODS FOR CHEMICAL-MECHANICAL POLISHING OF PHASE CHANGE MATERIALS 审中-公开
标题翻译：化学机械抛光相变材料的组合物和方法
公开(公告)号：US20100190339A1
公开(公告)日：2010-07-29
申请号：US12670495
申请日：2008-07-24
申请人： Zhan Chen , Kai Luo , Robert Vacassy
发明人： Zhan Chen , Kai Luo , Robert Vacassy
IPC分类号： H01L21/304 , C09K13/00
CPC分类号： C09G1/02 , B24B37/044 , C09K3/1463 , G11C13/0004 , H01L21/31053
摘要： The present invention provides a chemical-mechanical polishing (CMP) composition suitable for polishing a substrate comprising a phase change material (PCM), such as a germanium-antimony-tellurium (GST) alloy. The composition comprises a particulate abrasive material in combination with lysine, an optional oxidizing agent, and an aqueous carrier therefor. CMP methods for polishing a phase change material-containing substrate utilizing the composition are also disclosed.
摘要翻译：本发明提供了适用于抛光包括相变材料（PCM）的基材的化学机械抛光（CMP）组合物，例如锗 - 锑 - 碲（GST）合金。组合物包含与赖氨酸组合的颗粒磨料，任选的氧化剂及其水性载体。还公开了利用该组合物研磨含相变材料的衬底的CMP方法。

14. 发明授权

US06189132B1 Design rule correction system and method 失效
标题翻译：设计规则校正系统及方法
公开(公告)号：US06189132B1
公开(公告)日：2001-02-13
申请号：US09057961
申请日：1998-04-09
申请人： Fook-Luen Heng , Zhan Chen , Gustavo E. Tellez , John Cohn , Rani Narayan
发明人： Fook-Luen Heng , Zhan Chen , Gustavo E. Tellez , John Cohn , Rani Narayan
IPC分类号： G06F1750
CPC分类号： G06F17/5081
摘要： A method of modifying a layout of a plurality of objects in accordance with a plurality of predetermined criteria is presented. An objective function is defined for measuring a location perturbation and a separation perturbation of the objects in the layout. A linear system is defined using linear constraints in terms of design rules and the objective function to describe separations between layout objects. The linear system is solved to simultaneously remove violations of the design rules, and shapes and positions of objects in the layout are modified in accordance with the solution of the linear system such that a total perturbation of the objects in the layout is reduced. A system for implementing the present invention is also presented.
摘要翻译：呈现了根据多个预定标准修改多个对象的布局的方法。定义了一个目标函数，用于测量布局中对象的位置扰动和分离扰动。使用线性约束在设计规则和用于描述布局对象之间的分离的目标函数方面定义线性系统。解决线性系统以同时消除违反设计规则的情况，并且根据线性系统的解决方案来修改布局中对象的形状和位置，使得布局中的对象的总扰动减小。还提出了用于实现本发明的系统。

15. 发明申请

US20080220610A1 Silicon oxide polishing method utilizing colloidal silica 审中-公开
标题翻译：使用胶体二氧化硅的氧化硅抛光方法
公开(公告)号：US20080220610A1
公开(公告)日：2008-09-11
申请号：US11478004
申请日：2006-06-29
申请人： Benjamin Bayer , Zhan Chen , Jeffrey P. Chamberlain , Robert Vacassy
发明人： Benjamin Bayer , Zhan Chen , Jeffrey P. Chamberlain , Robert Vacassy
IPC分类号： H01L21/306
CPC分类号： H01L21/31053 , C09G1/02 , H01L21/3212
摘要： The inventive method comprises chemically-mechanically polishing a substrate with a polishing composition comprising a liquid carrier and sol-gel colloidal silica abrasive particles.
摘要翻译：本发明的方法包括用包含液体载体和溶胶 - 凝胶胶态二氧化硅磨料颗粒的抛光组合物对衬底进行化学机械抛光。

16. 发明申请

US20080020680A1 Rate-enhanced CMP compositions for dielectric films 审中-公开
标题翻译：介电膜的速率增强CMP组成
公开(公告)号：US20080020680A1
公开(公告)日：2008-01-24
申请号：US11491612
申请日：2006-07-24
申请人： Robert Vacassy , Benjamin Bayer , Zhan Chen , Jeffrey P. Chamberlain
发明人： Robert Vacassy , Benjamin Bayer , Zhan Chen , Jeffrey P. Chamberlain
IPC分类号： B24B1/00 , B24D3/02 , B24B7/30 , C09K3/14
CPC分类号： C09G1/02 , B24B37/044 , C09K3/1463 , H01L21/31053 , H01L21/3212
摘要： The invention provides a chemical-mechanical polishing composition consisting essentially of silica, an oxidizing agent, a quaternary ammonium compound, and water. The invention further provides a method of chemically-mechanically polishing a substrate with the aforementioned polishing composition. The polishing composition provides for enhanced polishing rates when used to polish dielectric films.
摘要翻译：本发明提供了一种主要由二氧化硅，氧化剂，季铵化合物和水组成的化学 - 机械抛光组合物。本发明还提供了用上述抛光组合物对衬底进行化学机械抛光的方法。抛光组合物在用于抛光电介质膜时提供了增强的抛光速率。

17. 发明申请

US20070298612A1 Compositions and methods for polishing silicon nitride materials 有权
标题翻译：用于研磨氮化硅材料的组合物和方法
公开(公告)号：US20070298612A1
公开(公告)日：2007-12-27
申请号：US11448205
申请日：2006-06-07
申请人： Jeffrey Dysard , Sriram Anjur , Timothy Johns , Zhan Chen
发明人： Jeffrey Dysard , Sriram Anjur , Timothy Johns , Zhan Chen
IPC分类号： C03C15/00 , H01L21/302
CPC分类号： C09K3/1463 , C09G1/02 , H01L21/31053
摘要： The present invention provides a method for polishing silicon nitride-containing substrates. The method comprises abrading a surface of a silicon nitride substrate with a polishing composition, which comprises colloidal silica, at least one acidic component, and an aqueous carrier. The at least one acidic component has a pKa in the range of about 1 to 4.5. The composition has a pH in the range of about 0.5 pH units less than the pKa of the at least one acidic component to about 1.5 pH units greater than the pKa.
摘要翻译：本发明提供一种研磨含氮化硅的基板的方法。该方法包括用抛光组合物研磨氮化硅衬底的表面，抛光组合物包括胶体二氧化硅，至少一种酸性组分和水性载体。所述至少一种酸性组分的pKa在约1至4.5的范围内。所述组合物的pH值比所述至少一种酸性组分的pKa小约0.5pH单位至大于pKa约1.5pH单位。

18. 发明申请

US20060221452A1 Anti-glare reflective and transmissive devices 审中-公开
标题翻译：防眩光反射和透射装置
公开(公告)号：US20060221452A1
公开(公告)日：2006-10-05
申请号：US11373579
申请日：2006-03-10
申请人： Zhan Chen
发明人： Zhan Chen
IPC分类号： G02B5/08
CPC分类号： B60R1/088 , G02F1/13725
摘要： Devices that include a dichroic material sandwiched between first and second electrodes layers and exhibiting a high optical absorption when the first and second electrode layers are biased at a first electrical bias state and a low optical absorption when the first and second electrode layers are biased at a second, different electrical bias state. Such devices may be used to construct optically reflective devices such as anti-glare mirrors and optically transmissive devices such as eye glasses. The dichroic material may be selected to be operable to switch between the high optical absorption and the low optical absorption in less than 0.1 second.
摘要翻译：包括夹在第一和第二电极层之间的二向色材料的装置，并且当第一和第二电极层被偏置在第一电偏置状态时呈现高的光吸收，而当第一和第二电极层被偏置在第二，不同的电偏置状态。这种装置可用于构造光学反射装置，例如防眩光镜和诸如眼镜的光学透射装置。二色性材料可以被选择为可操作以在小于0.1秒内在高光吸收和低光吸收之间切换。

19. 发明申请

US20130296576A1 HIGH STABLE NON-IONIC N-VINYL BUTYROLACTAM IODINE AND PREPARATION METHOD THEREOF 审中-公开
标题翻译：高稳定性非离子型N-乙烯基丁酰胺碘化物及其制备方法
公开(公告)号：US20130296576A1
公开(公告)日：2013-11-07
申请号：US13978329
申请日：2011-08-18
申请人： Yu Wang , Zhan Chen
发明人： Yu Wang , Zhan Chen
IPC分类号： C07D207/267
CPC分类号： C07D207/267 , C08F8/22 , C08F126/10
摘要： The present invention relates to a preparation method of a high-stable non-ionic N-vinyl butyrolactam iodine, wherein non-ionic N-vinyl butyrolactam, iodine and at least one grinding aid are stirred at 150-800 r/min at a temperature of 50° C.-90° C. for 1 to 12 hours to prepare the high-stable non-ionic N-vinyl butyrolactam iodine, wherein the K value of the non-ionic N-vinyl butyrolactam is 32±1, the PD value of the main peak of the non-ionic N-vinyl butyrolactam is ≦1.6, the moisture content of the non-ionic N-vinyl butyrolactam is ≦2.5%, preferably, the grinding aid is selected one or several from sodium chloride, sodium citrate, sodium carbonate and sodium phosphate, the amount of the grinding aid added is 0.02 to 2% of the total amount of the non-ionic N-vinyl butyrolactam and the iodine, the non-ionic N-vinyl butyrolactam is PVP-K32, the high-stable non-ionic N-vinyl butyrolactam iodine prepared by the above mentioned method is also provided, the stability of the high-stable non-ionic N-vinyl butyrolactam iodine of the present invention is high, thereby facilitating long-term storage and use, thus the high-stable non-ionic N-vinyl butyrolactam iodine is suitable for large-scale popularization.
摘要翻译：本发明涉及一种高稳定性非离子型N-乙烯基丁内酰胺碘的制备方法，其中非离子N-乙烯基丁内酰胺碘和至少一种研磨助剂以150-800r / min的温度在50℃-90℃下反应1至12小时以制备高稳定性非离子型N-乙烯基丁内酰胺碘，其中非离子型N-乙烯基丁内酰胺的K值为32±1，PD 非离子型N-乙烯基丁内酰胺的主峰的值为1.6，非离子型N-乙烯基丁内酰胺的水分含量为2.5％，优选的是，研磨助剂由氯化钠，钠柠檬酸钠，碳酸钠和磷酸钠，加入的助磨剂的量为非离子型N-乙烯基丁内酰胺和碘的总量的0.02〜2％，非离子型N-乙烯基丁内酰胺为PVP-K32，还提供了通过上述方法制备的高稳定性非离子型N-乙烯基丁内酰胺碘，稳定性高本发明的离子型N-乙烯基丁内酰胺碘高，从而促进长期保存和使用，因此高稳定性的非离子型N-乙烯基丁内酰胺碘适用于大规模普及。

20. 发明申请

US20100029181A1 Methods and compositions for polishing silicon-containing substrates 有权
标题翻译：抛光含硅基材的方法和组合物
公开(公告)号：US20100029181A1
公开(公告)日：2010-02-04
申请号：US12221023
申请日：2008-07-30
申请人： Francesco De Rege Thesauro , Zhan Chen
发明人： Francesco De Rege Thesauro , Zhan Chen
IPC分类号： B24B29/00 , C09G1/02 , C09K3/14 , B24B1/00
CPC分类号： C09K3/1463 , B24B37/044 , C09G1/02 , H01L21/31053 , H01L21/3212
摘要： The invention provides chemical-mechanical polishing (CMP) compositions and methods for polishing a silicon-containing substrate. A method of the invention comprises the steps of contacting a silicon-containing substrate with a polishing pad and an aqueous CMP composition, and causing relative motion between the polishing pad and the substrate while maintaining a portion of the CMP composition in contact with the surface of the substrate to abrade at least a portion of the substrate. The CMP composition comprises a ceria abrasive, a polishing additive bearing a functional group with a pKa of about 4 to about 9, a nonionic surfactant with an hydrophilic portion and a lipophilic portion wherein the hydrophilic portion has a number average molecular weight of about 500 g/mol or higher, and an aqueous carrier, wherein the pH of the composition is 7 or less. The method reduces defects on the wafers, particularly local areas of high removal. The method is also useful for polishing dielectric silicon-containing substrates at a high rate relative to semiconductor silicon-containing substrates.
摘要翻译：本发明提供用于抛光含硅基材的化学机械抛光（CMP）组合物和方法。本发明的方法包括以下步骤：使含硅衬底与抛光垫和水性CMP组合物接触，并且在保持CMP组合物的一部分与表面接触的同时引起抛光垫和衬底之间的相对运动所述衬底磨损所述衬底的至少一部分。 CMP组合物包括二氧化铈研磨剂，具有pKa约4至约9的官能团的抛光添加剂，具有亲水部分和亲油部分的非离子表面活性剂，其中亲水部分的数均分子量为约500g / mol以上，和水性载体，其中组合物的pH为7以下。该方法减少了晶片上的缺陷，特别是高去除的局部区域。该方法对于相对于含半导体硅的衬底以高速率抛光介电含硅衬底也是有用的。

你已经成功收藏专利！

检索式保存成功!

IPRDB

热门服务

关于我们

友情链接

联系方式