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    • 13. 发明授权
    • External reset device for an electric water heater
    • 电热水器外部复位装置
    • US07242858B1
    • 2007-07-10
    • US11374620
    • 2006-03-13
    • Richard E. WelchMichael L. Miller
    • Richard E. WelchMichael L. Miller
    • F24H1/20
    • F24H9/2021
    • An external reset device that is operable in combination with an electric water heater is disclosed. The external reset device is attached to an element cover that is mounted to the water heater and conceals the water heater's control device, such as a manual reset thermostat. The external reset device comprises a bushing member and a key member attached to the element cover. The bushing member is aligned with a reset button on the control device. The key member is adapted for insertion into the bushing member to depress the reset button and close a switch, enabling the heating elements of the electric water heater to power ON and heat the water within the electric water heater.
    • 公开了一种与电热水器组合可操作的外部复位装置。 外部复位装置安装在安装在热水器上的元件盖上,并隐藏热水器的控制装置,例如手动复位恒温器。 外部复位装置包括衬套构件和附接到元件盖的键构件。 衬套构件与控制装置上的复位按钮对准。 键构件适于插入衬套构件中以按压复位按钮并闭合开关,使得电热水器的加热元件能够接通并加热电热水器内的水。
    • 18. 发明授权
    • Method and apparatus for using scatterometry to perform feedback and feed-forward control
    • 使用散射法进行反馈和前馈控制的方法和装置
    • US06643557B1
    • 2003-11-04
    • US09591038
    • 2000-06-09
    • Michael L. MillerAnthony J. Toprac
    • Michael L. MillerAnthony J. Toprac
    • G06F1900
    • H01L22/26
    • The present invention provides for a method and an apparatus for using scatterometry to perform feedback and feed-forward control. A processing run of semiconductor devices is performed. Metrology data from the processed semiconductor devices is acquired. Error data is acquired by analyzing the acquired metrology data. A determination is made whether the error data merits modification to the processing of semiconductor devices. A feedback modification of the processing of semiconductor devices is performed in response to the determination that the error data merits modification to the processing of semiconductor devices. A feed-forward modification of the processing of the semiconductor devices is performed in response to the determination that the error data merits modification to the processing of semiconductor devices.
    • 本发明提供了一种使用散射测量来执行反馈和前馈控制的方法和装置。 执行半导体器件的处理运行。 获取来自处理的半导体器件的计量数据。 通过分析获取的测量数据获取误差数据。 确定误差数据是否优于对半导体器件的处理的修改。 响应于确定误差数据优于对半导体器件的处理的修改,执行半导体器件的处理的反馈修改。 响应于确定误差数据优于对半导体器件的处理的修改,执行半导体器件的处理的前馈修改。
    • 19. 发明授权
    • Method and apparatus for using equipment state data for run-to-run control of manufacturing tools
    • 使用设备状态数据进行运行控制制造工具的方法和装置
    • US06449524B1
    • 2002-09-10
    • US09477465
    • 2000-01-04
    • Michael L. MillerThomas J. Sonderman
    • Michael L. MillerThomas J. Sonderman
    • G06F1900
    • H01L22/20
    • The present invention provides for a method and an apparatus for using equipment state data for controlling a manufacturing process. Initial equipment state data is acquired. At least one semiconductor device is processed using the initial equipment state data is performed. Equipment and wafer state data processing is performed using data from the processing of the semiconductor device and the initial equipment state data. A determination is made whether at least one control input parameter used for processing of the semiconductor device is to be modified in response to performing the equipment and wafer state data processing. The control input parameter is modified in response to determining that at least one the control input parameter is to be modified.
    • 本发明提供一种使用设备状态数据来控制制造过程的方法和装置。 初始设备状态数据被获取。 使用初始设备处理至少一个半导体器件状态数据。 使用来自半导体器件的处理和初始设备状态数据的数据进行设备和晶片状态数据处理。 确定是否要响应于执行设备和晶片状态数据处理来修改用于半导体器件的处理的至少一个控制输入参数。 响应于确定至少一个控制输入参数被修改而修改控制输入参数。