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    • 12. 发明授权
    • Bit failure signature identification
    • 位故障签名识别
    • US08451018B2
    • 2013-05-28
    • US12706228
    • 2010-02-16
    • Thomas D. FurlandRobert J. Milne, Jr.Leah M. P. PastelKevin W. StanleyRobert C. Virun
    • Thomas D. FurlandRobert J. Milne, Jr.Leah M. P. PastelKevin W. StanleyRobert C. Virun
    • G01R31/26
    • G01R31/31703G01R31/31935
    • A method, system, and program product for identifying at least one bit failure among a plurality of semiconductor chips are provided. A first aspect of the invention provides a method of identifying at least one bit failure signature among a plurality of semiconductor chips, the method comprising: counting failures of each failing bit among the plurality of semiconductor chips; determining a most commonly failing bit (MCFB) among the failing bits; establishing a bit failure signature including the MCFB; counting failures of each failing bit on semiconductor chips on which the MCFB fails; determining a next most commonly failing bit (NMCFB) among the failing bits on semiconductor chips on which the MCFB fails; determining whether the NMCFB tends to fail when the MCFB fails; and in response to a determination that the NMCFB tends to fail when the MCFB fails, adding the NMCFB to the bit failure signature.
    • 提供了用于识别多个半导体芯片中的至少一个位故障的方法,系统和程序产品。 本发明的第一方面提供了一种识别多个半导体芯片中的至少一个位故障签名的方法,所述方法包括:对所述多个半导体芯片中的每个故障位进行计数故障; 确定故障位中最常见的故障位(MCFB); 建立包括MCFB在内的位故障签名; 在MCFB故障的半导体芯片上的每个故障位的计数失败; 确定在MCFB故障的半导体芯片上的故障位中的下一个最常故障位(NMCFB); 确定当MCFB发生故障时,NMCFB是否会失败; 并且响应于当MCFB失败时NMCFB趋向于失败的确定,将NMCFB添加到位故障签名。
    • 15. 发明授权
    • Method of designing an integrated circuit based on a combination of manufacturability, test coverage and, optionally, diagnostic coverage
    • 基于可制造性,测试覆盖和可选地诊断覆盖的组合来设计集成电路的方法
    • US08347260B2
    • 2013-01-01
    • US12880228
    • 2010-09-13
    • Kerry BernsteinJames A. CulpLeah M. P. PastelKirk D. PetersonNorman J. Rohrer
    • Kerry BernsteinJames A. CulpLeah M. P. PastelKirk D. PetersonNorman J. Rohrer
    • G06F11/22
    • G06F17/5045G06F2217/12Y02P90/265
    • Disclose are embodiments of an integrated circuit design method based on a combination of manufacturability, test coverage and, optionally, diagnostic coverage. Design-for manufacturability (DFM) modifications to the layout of an integrated circuit can be made in light of test coverage. Alternatively, test coverage of an integrated circuit can be established in light of DFM modifications. Alternatively, an iterative process can be performed, where DFM modifications to the layout of an integrated circuit are made in light of test coverage and then test coverage is altered in light of the DFM modifications. Alternatively, DFM modifications to the layout of an integrated circuit can be made in light of test coverage and also diagnostic coverage. In any case, after making DFM modifications and establishing test coverage, any unmodified and untested nodes (and, optionally, any unmodified and undiagnosable tested nodes) in the integrated circuit can be identified and tagged for subsequent in-line inspection.
    • 披露是基于可制造性,测试覆盖和任选的诊断覆盖的组合的集成电路设计方法的实施例。 根据测试覆盖范围,可以对集成电路布局的可制造性(DFM)进行设计修改。 或者,可以根据DFM修改建立集成电路的测试覆盖。 或者,可以执行迭代处理,其中根据测试覆盖进行DFM对集成电路的布局的修改,然后根据DFM修改来改变测试覆盖。 或者,DFM可以根据测试覆盖范围和诊断覆盖范围对集成电路布局进行修改。 在任何情况下,在进行DFM修改和建立测试覆盖之后,可以识别和标记集成电路中的任何未修改和未测试的节点(以及可选地,任何未修改和不可判定的测试节点)以便随后的在线检查。
    • 20. 发明申请
    • Hot Switchable Voltage Bus for Iddq Current Measurements
    • 可开关电压总线,用于Iddq电流测量
    • US20080129324A1
    • 2008-06-05
    • US10595526
    • 2003-11-05
    • Leah M. P. Pastel
    • Leah M. P. Pastel
    • G01R31/30
    • G01R31/3008
    • A voltage island system including a hot-switchable voltage bus for IDDQ current measurements. The voltage island system includes a plurality of voltage islands (V1, V2, . . . , Vn), a global power system, and a quiescent power system. The global power system includes a plurality of on-chip global header devices (H1, H2, . . . , Hn) for selectively providing a voltage VDDg to the plurality of voltage islands in response to global header control signals (x1, x2, . . . , xn), respectively. A global VDDg power supply provides power to the global header devices (H1, H2, . . . , Hn) via a VDDg power distribution grid/bus. The quiescent power system includes a plurality of on-chip quiescent header devices (H1q, H2q, . . . , Hnq) for selectively providing a quiescent voltage VDDq to the plurality of voltage islands in response to quiescent header control signals x1q, x2q, . . . , xnq, respectively. A quiescent VDDq power supply provides power to the quiescent header devices via a VDDq power distribution grid/bus.
    • 一个电压岛系统,包括用于IDDQ电流测量的热切换电压总线。 电压岛系统包括多个电压岛(V 1,V 2,...,Vn),全球电力系统和静态电力系统。 全球电力系统包括多个片上全局头部装置(H 1,H 2,...,Hn),用于响应于全局头部控制信号(x 1,...,H n)选择性地向多个电压岛提供电压VDDg, x 2,...,xn)。 全局VDDg电源通过VDDg配电网/总线为全局总线设备(H 1,H 2,...,Hn)提供电源。 静态电力系统包括多个片上静态头部装置(H 1 q,H 2 q,...,Hnq),用于响应于静态头部控制信号x而选择性地向多个电压岛提供静态电压VDDq 1 q,x 2 q,。 。 。 ,xnq。 静态VDDq电源通过VDDq配电网/总线为静态接头设备供电。