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    • 12. 发明授权
    • Method of designing an integrated circuit based on a combination of manufacturability, test coverage and, optionally, diagnostic coverage
    • 基于可制造性,测试覆盖和可选地诊断覆盖的组合来设计集成电路的方法
    • US08347260B2
    • 2013-01-01
    • US12880228
    • 2010-09-13
    • Kerry BernsteinJames A. CulpLeah M. P. PastelKirk D. PetersonNorman J. Rohrer
    • Kerry BernsteinJames A. CulpLeah M. P. PastelKirk D. PetersonNorman J. Rohrer
    • G06F11/22
    • G06F17/5045G06F2217/12Y02P90/265
    • Disclose are embodiments of an integrated circuit design method based on a combination of manufacturability, test coverage and, optionally, diagnostic coverage. Design-for manufacturability (DFM) modifications to the layout of an integrated circuit can be made in light of test coverage. Alternatively, test coverage of an integrated circuit can be established in light of DFM modifications. Alternatively, an iterative process can be performed, where DFM modifications to the layout of an integrated circuit are made in light of test coverage and then test coverage is altered in light of the DFM modifications. Alternatively, DFM modifications to the layout of an integrated circuit can be made in light of test coverage and also diagnostic coverage. In any case, after making DFM modifications and establishing test coverage, any unmodified and untested nodes (and, optionally, any unmodified and undiagnosable tested nodes) in the integrated circuit can be identified and tagged for subsequent in-line inspection.
    • 披露是基于可制造性,测试覆盖和任选的诊断覆盖的组合的集成电路设计方法的实施例。 根据测试覆盖范围,可以对集成电路布局的可制造性(DFM)进行设计修改。 或者,可以根据DFM修改建立集成电路的测试覆盖。 或者,可以执行迭代处理,其中根据测试覆盖进行DFM对集成电路的布局的修改,然后根据DFM修改来改变测试覆盖。 或者,DFM可以根据测试覆盖范围和诊断覆盖范围对集成电路布局进行修改。 在任何情况下,在进行DFM修改和建立测试覆盖之后,可以识别和标记集成电路中的任何未修改和未测试的节点(以及可选地,任何未修改和不可判定的测试节点)以便随后的在线检查。
    • 18. 发明申请
    • Hot Switchable Voltage Bus for Iddq Current Measurements
    • 可开关电压总线,用于Iddq电流测量
    • US20080129324A1
    • 2008-06-05
    • US10595526
    • 2003-11-05
    • Leah M. P. Pastel
    • Leah M. P. Pastel
    • G01R31/30
    • G01R31/3008
    • A voltage island system including a hot-switchable voltage bus for IDDQ current measurements. The voltage island system includes a plurality of voltage islands (V1, V2, . . . , Vn), a global power system, and a quiescent power system. The global power system includes a plurality of on-chip global header devices (H1, H2, . . . , Hn) for selectively providing a voltage VDDg to the plurality of voltage islands in response to global header control signals (x1, x2, . . . , xn), respectively. A global VDDg power supply provides power to the global header devices (H1, H2, . . . , Hn) via a VDDg power distribution grid/bus. The quiescent power system includes a plurality of on-chip quiescent header devices (H1q, H2q, . . . , Hnq) for selectively providing a quiescent voltage VDDq to the plurality of voltage islands in response to quiescent header control signals x1q, x2q, . . . , xnq, respectively. A quiescent VDDq power supply provides power to the quiescent header devices via a VDDq power distribution grid/bus.
    • 一个电压岛系统,包括用于IDDQ电流测量的热切换电压总线。 电压岛系统包括多个电压岛(V 1,V 2,...,Vn),全球电力系统和静态电力系统。 全球电力系统包括多个片上全局头部装置(H 1,H 2,...,Hn),用于响应于全局头部控制信号(x 1,...,H n)选择性地向多个电压岛提供电压VDDg, x 2,...,xn)。 全局VDDg电源通过VDDg配电网/总线为全局总线设备(H 1,H 2,...,Hn)提供电源。 静态电力系统包括多个片上静态头部装置(H 1 q,H 2 q,...,Hnq),用于响应于静态头部控制信号x而选择性地向多个电压岛提供静态电压VDDq 1 q,x 2 q,。 。 。 ,xnq。 静态VDDq电源通过VDDq配电网/总线为静态接头设备供电。
    • 19. 发明授权
    • Method for designing an integrated circuit defect monitor
    • 设计集成电路缺陷监视器的方法
    • US07093213B2
    • 2006-08-15
    • US10710940
    • 2004-08-13
    • John M. CohnLeah M. P. Pastel
    • John M. CohnLeah M. P. Pastel
    • G06F17/50G01R31/28
    • G06F17/505
    • A method and system for designing a test structure. The method including: defining and placing test circuit pins in an integrated circuit design; routing one or more fat wires, each fat wire routed between a set of the test circuit pins; processing each fat wire into a continuous wire and one or more corresponding wire segments adjacent to the continuous wire, the continuous wire separated from the one or more corresponding wire segments by a space; and connecting the continuous wire and the one or more wire segments to circuit elements of a defect monitor scan chain, the circuit elements previously inserted into the integrated circuit design.
    • 一种用于设计测试结构的方法和系统。 该方法包括:将集成电路设计中的测试电路引脚定义和放置; 布置一条或多条脂肪线,每条脂肪线在一组测试电路引脚之间布线; 将每个脂肪丝处理成连续的线和与所述连续线相邻的一个或多个对应的线段,所述连续线从所述一个或多个对应的线段与空间分离; 以及将连续线和一个或多个线段连接到缺陷监视器扫描链的电路元件,电路元件先前插入到集成电路设计中。
    • 20. 发明授权
    • Canary device for failure analysis
    • 金丝雀装置进行故障分析
    • US07089138B1
    • 2006-08-08
    • US10906590
    • 2005-02-25
    • Pierre J. BouchardMark C. HakeyMark E. MastersLeah M. P. PastelJames A. SlinkmanDavid P. Vallett
    • Pierre J. BouchardMark C. HakeyMark E. MastersLeah M. P. PastelJames A. SlinkmanDavid P. Vallett
    • G06F11/00
    • G01R31/2856G01R31/2831G01R31/318511G01R31/3187
    • A diagnostic system and method for testing an integrated circuit during fabrication thereof. The diagnostic system has at least one integrated circuit chip that has an electrical signature associated with it; a sacrificial circuit that is adjacent to the integrated circuit chip and has a known electrical signature associated with it and intentionally mis-designed circuitry; and a comparator adapted to compare the electrical signature of the integrated circuit chip with the known electrical signature of the sacrificial circuit, wherein a match in the electrical signature of the integrated circuit chip with the known electrical signature of the sacrificial circuit indicates that the integrated circuit chip is mis-designed. The diagnostic system further includes a semiconductor wafer that has a plurality of integrated circuit chips and a kerf area separating one integrated circuit chip from another integrated circuit chip. A mis-designed integrated circuit chip has abnormally functioning circuitry.
    • 一种在其制造期间测试集成电路的诊断系统和方法。 诊断系统具有至少一个具有与其相关联的电特征的集成电路芯片; 牺牲电路,其与集成电路芯片相邻并且具有与其相关联的已知电气签名和故意错误设计的电路; 以及比较器,用于将集成电路芯片的电特征与牺牲电路的已知电特征进行比较,其中集成电路芯片的电特征中与牺牲电路的已知电气签名的匹配指示集成电路 芯片设计错误。 诊断系统还包括具有多个集成电路芯片的半导体晶片和将一个集成电路芯片与另一个集成电路芯片分离的切口区域。 错误设计的集成电路芯片具有异常功能的电路。