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    • 14. 发明授权
    • TFT for LCD device and fabrication method thereof
    • LCD装置用TFT及其制造方法
    • US06562667B1
    • 2003-05-13
    • US09715188
    • 2000-11-20
    • Eui-Hoon HwangSang-Gul Lee
    • Eui-Hoon HwangSang-Gul Lee
    • H01L2100
    • H01L29/66757H01L29/78621
    • An object of the present invention is to crystallize and activate the doped amorphous semiconductor layer at the same time. It is also an object to provide the TFT with good electrical connection between the source or drain electrodes and the semiconductor layer. The inventive method of fabricating TFT for a liquid crystal display device, includes forming a buffer layer on a substrate; forming an amorphous semiconductor layer on the whole buffer layer, the semiconductor layer having a channel region and source and drain ohmic contact regions, each positioned at opposing ends of the channel region; doping n+ (or p+) ions on the source and drain ohmic contact regions of the semiconductor layer while covering the channel region with a photoresist; patterning the semiconductor layer to have an island shape, the island shape including the channel region and the source and drain ohmic contact regions; irradiating laser beams on the semiconductor layer having the island shape, thereby crystallizing and activating the semiconductor layer; forming a first insulating layer on the semiconductor layer; forming a gate electrode on the first insulating layer; forming a second insulating layer on the first insulating layer while covering the gate electrode; forming source and drain contact holes penetrating both the first and second insulating layers to the source and drain ohmic contact regions of the semiconductor layer, respectively; and forming the source and drain electrodes on the second insulating layer, while the source and drain electrodes having electrical connection to the source and drain ohmic contact regions of the semiconductor layer.
    • 本发明的目的是同时结晶和活化掺杂的非晶半导体层。 本发明的另一个目的是提供TFT在源极或漏极和半导体层之间的良好电连接。本发明制造用于液晶显示器件的TFT的方法包括在衬底上形成缓冲层; 在整个缓冲层上形成非晶半导体层,所述半导体层具有沟道区和源极和漏极欧姆接触区,每个位于沟道区的相对端; 在半导体层的源极和漏极欧姆接触区域上掺杂n +(或p +)离子,同时用光致抗蚀剂覆盖沟道区域; 将半导体层图形化为岛状,该岛状包括沟道区和源极和漏极欧姆接触区; 在具有岛状的半导体层上照射激光束,从而使半导体层结晶并起作用; 在所述半导体层上形成第一绝缘层; 在所述第一绝缘层上形成栅电极; 在覆盖所述栅电极的同时在所述第一绝缘层上形成第二绝缘层; 形成分别将所述第一和第二绝缘层穿过所述半导体层的源极和漏极欧姆接触区域的源极和漏极接触孔; 以及在所述第二绝缘层上形成所述源极和漏极,同时所述源极和漏极与所述半导体层的所述源极和漏极欧姆接触区域电连接。
    • 15. 发明授权
    • Method of fabricating thin film transistors
    • 制造薄膜晶体管的方法
    • US6077730A
    • 2000-06-20
    • US22415
    • 1998-02-12
    • Sang-Gul LeeJu-Cheon YeoYong-Min Ha
    • Sang-Gul LeeJu-Cheon YeoYong-Min Ha
    • H01L29/786H01L21/336H01L21/84
    • H01L27/127H01L29/78621
    • A method is provided for fabricating a thin film transistor on a substrate. The method includes the steps of forming an active layer having a channel region on the substrate, forming an impurity-blocking mask covering the channel region and portions of the active layer outside the channel region adjacent the channel region, and doping impurities of a first conductivity type at a high density into portions of the active layer uncovered by the impurity-blocking mask to form impurity-doped regions in the active layer. The method further includes the steps of removing the impurity-blocking mask and thereafter performing a plasma treatment on the resultant structure using a plasma gas containing impurities of the first conductivity type to form LDD regions in the active layer between the channel region and the impurity-doped regions.
    • 提供了一种在衬底上制造薄膜晶体管的方法。 该方法包括以下步骤:在衬底上形成具有沟道区的有源层,形成覆盖沟道区的杂质阻挡掩模和与沟道区相邻的沟道区之外的有源层的部分,以及掺杂第一导电性的杂质 以高密度键入由杂质阻挡掩模未覆盖的有源层的部分,以在有源层中形成杂质掺杂区域。 该方法还包括以下步骤:去除杂质阻挡掩模,然后使用含有第一导电类型的杂质的等离子气体对所得结构进行等离子体处理,以在沟道区和杂质阻挡掩模之间的有源层中形成LDD区, 掺杂区域。
    • 18. 发明授权
    • Method of fabricating array substrate
    • 阵列基板的制作方法
    • US07910414B2
    • 2011-03-22
    • US12591501
    • 2009-11-20
    • Hee-Dong ChoiSang-Gul LeeSeong-Moh SeoJun-Min LeeByung-Chul Ahn
    • Hee-Dong ChoiSang-Gul LeeSeong-Moh SeoJun-Min LeeByung-Chul Ahn
    • H01L21/00H01L21/84
    • H01L27/1274H01L27/1214H01L27/1288H01L29/4908
    • A method of fabricating an array substrate includes sequentially forming a first metal layer, a first inorganic insulating layer and an intrinsic amorphous silicon layer on a substrate, the first metal layer including a first metallic material layer and a second metallic material layer; crystallizing the intrinsic amorphous silicon; forming a gate electrode, a gate line, a gate insulating layer and an active layer; forming an interlayer insulating layer including first and second contact holes respectively exposing both sides of the active layer; forming first and second ohmic contact patterns respectively contacting the both sides of the active layers, a source electrode, a drain electrode, and a data line connecting the source electrode; forming a passivation layer on the source electrode, the drain electrode; and forming a pixel electrode on the passivation layer and contacting the drain electrode.
    • 制造阵列基板的方法包括在基板上依次形成第一金属层,第一无机绝缘层和本征非晶硅层,所述第一金属层包括第一金属材料层和第二金属材料层; 结晶本征非晶硅; 形成栅电极,栅极线,栅绝缘层和有源层; 形成包括分别暴露有源层的两侧的第一和第二接触孔的层间绝缘层; 形成分别接触有源层的两侧的第一和第二欧姆接触图案,源电极,漏电极和连接源电极的数据线; 在源极上形成钝化层,漏电极; 以及在所述钝化层上形成像素电极并与所述漏电极接触。