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11. 发明授权

US07750248B2 Dielectric lamination structure, manufacturing method of a dielectric lamination structure, and wiring board including a dielectric lamination structure 失效
标题翻译：电介质层叠结构体，电介质层叠结构体的制造方法以及包含电介质层叠结构的配线基板
公开(公告)号：US07750248B2
公开(公告)日：2010-07-06
申请号：US11634170
申请日：2006-12-06
申请人： Yasuhiko Inui , Takamichi Ogawa , Seiji Ichiyanagi , Jun Otsuka , Manabu Sato
发明人： Yasuhiko Inui , Takamichi Ogawa , Seiji Ichiyanagi , Jun Otsuka , Manabu Sato
IPC分类号： H05K1/16
CPC分类号： H05K1/162 , H01L21/4857 , H01L23/49822 , H01L23/50 , H01L2924/0002 , H01L2924/09701 , H05K1/092 , H05K3/4644 , H05K2201/0175 , H05K2201/0352 , H05K2201/0355 , H05K2201/09309 , H05K2201/09509 , H05K2201/09718 , H05K2201/09736 , Y10T29/49124 , Y10T29/49126 , Y10T29/49128 , Y10T29/49155 , Y10T29/49165 , Y10T29/4981 , Y10T407/1946 , Y10T407/1948 , H01L2924/00
摘要： A dielectric structure including a metal foil, a dielectric layer and a conductor layer provided in this order, wherein the metal foil has a thickness of from 10 to 40 μm, the dielectric layer has a thickness of from 0.3 to 5 μm, and the conductor layer has a thickness of from 0.3 to 10 μm. The dielectric structure has plural vias which are separated from each other, and which penetrate through both of the dielectric layer and the conductor layer. The vias of the dielectric layer have different diameters which are in a range of from 100 to 300 μm, a diameter of each of the vias of the conductor layer is larger than a diameter of a corresponding via of the dielectric layer by 5 to 50 μm, and a minimum via pitch is from 100 to 350 μm.
摘要翻译：包括依次设置的金属箔，电介质层和导体层的电介质结构体，其中金属箔的厚度为10〜40μm，电介质层的厚度为0.3〜5μm，导体层的厚度为0.3〜10μm。电介质结构具有彼此分离并且穿透介电层和导体层两者的多个通孔。电介质层的通孔具有不同的直径，范围为100〜300μm，导体层的通孔的直径大于电介质层的通孔的直径为5〜50μm ，最小通孔间距为100〜350μm。

12. 发明申请

US20090242516A1 PLASMA ETCHING METHOD AND COMPUTER READABLE STORAGE MEDIUM 有权
标题翻译：等离子体蚀刻方法和计算机可读存储介质
公开(公告)号：US20090242516A1
公开(公告)日：2009-10-01
申请号：US12413999
申请日：2009-03-30
申请人： Masanobu Honda , Hiroyuki Nakayama , Manabu Sato
发明人： Masanobu Honda , Hiroyuki Nakayama , Manabu Sato
IPC分类号： C23F1/02 , H01L21/3065
CPC分类号： H01L21/31116 , H01J37/32027 , H01J37/32091 , H01L21/67069
摘要： A plasma etching method includes disposing a first electrode and a second electrode to face each other; preparing a part in the processing chamber; supporting a substrate; vacuum-evacuating the processing chamber; supplying an etching gas into a processing space between the first electrode and the second electrode; generating a plasma of the etching gas in the processing space by applying a radio wave power to the first electrode or the second electrode; and etching a film to be processed on a surface of the substrate by using the plasma. Further, a DC voltage is applied to the part during the etching process, the part being disposed away from the substrate and being etched by reaction with reactant species in the plasma.
摘要翻译：等离子体蚀刻方法包括：将第一电极和第二电极相对配置; 在处理室中准备一部分; 支撑底物; 真空抽真空处理室; 向第一电极和第二电极之间的处理空间提供蚀刻气体; 通过向所述第一电极或所述第二电极施加无线电波来在所述处理空间中产生蚀刻气体的等离子体; 并且通过使用等离子体在基板的表面上蚀刻待处理的膜。此外，在蚀刻工艺期间，将DC电压施加到该部件，该部分被设置为远离衬底并且通过与等离子体中的反应物物质的反应进行蚀刻。

13. 发明授权

US07580240B2 Via array capacitor, wiring board incorporating a via array capacitor, and method of manufacturing the same 失效
标题翻译：通过阵列电容器，并入通孔阵列电容器的布线板及其制造方法
公开(公告)号：US07580240B2
公开(公告)日：2009-08-25
申请号：US11603161
申请日：2006-11-22
申请人： Hiroshi Yamamoto , Toshitake Seki , Jun Otsuka , Manabu Sato , Masahiko Okuyama
发明人： Hiroshi Yamamoto , Toshitake Seki , Jun Otsuka , Manabu Sato , Masahiko Okuyama
IPC分类号： H01G4/06 , H01G4/228
CPC分类号： H05K1/186 , H01G4/232 , H01G4/30 , H01L23/49822 , H01L23/50 , H01L24/81 , H01L2224/05568 , H01L2224/05573 , H01L2224/16 , H01L2224/16235 , H01L2224/81192 , H01L2224/81801 , H01L2224/82039 , H01L2224/82047 , H01L2924/01019 , H01L2924/01078 , H01L2924/09701 , H01L2924/14 , H01L2924/15174 , H01L2924/15311 , H01L2924/3511 , H05K1/0231 , H05K1/112 , H05K3/4602 , H05K2201/10674 , H05K2201/10712 , H01L2924/00
摘要： A via array capacitor including a capacitor body having a first main surface and a second main surface and having a structure in which dielectric layers and inner electrode layers are alternately laminated; a plurality of via conductors which conduct the inner electrode layers to each other and are, as a whole, arranged in array form; and metal-containing layers which are disposed on at least one of the first main surface and the second main surface, wherein a total volume of the inner electrode layers and the metal-containing layers included in the via array capacitor is from 45 vol.% to 95 vol.% of a volume of the via array capacitor.
摘要翻译：一种通孔阵列电容器，包括具有第一主表面和第二主表面的电容器体，并且具有其中电介质层和内电极层交替层叠的结构; 多个通孔导体，其将内部电极层彼此导引并且整体上排列成阵列形式; 和设置在第一主表面和第二主表面中的至少一个上的含金属层，其中包含在通孔阵列电容器中的内部电极层和含金属层的总体积为45体积％至95体积％的通孔阵列电容器的体积。

14. 发明申请

US20080251285A1 CAPACITOR AND WIRING BOARD INCLUDING THE CAPACITOR 有权
标题翻译：电容器和接线板，包括电容器
公开(公告)号：US20080251285A1
公开(公告)日：2008-10-16
申请号：US12100527
申请日：2008-04-10
申请人： Motohiko Sato , Kenji Murakami , Jun Otsuka , Manabu Sato , Masahiko Okuyama , Kozo Yamazaki
发明人： Motohiko Sato , Kenji Murakami , Jun Otsuka , Manabu Sato , Masahiko Okuyama , Kozo Yamazaki
IPC分类号： H01G4/06 , H05K1/16
CPC分类号： H05K1/0231 , H01G4/232 , H01G4/30 , H01G4/33 , H01L23/50 , H01L23/642 , H01L2224/0554 , H01L2224/05568 , H01L2224/05573 , H01L2224/16 , H01L2224/16225 , H01L2224/16265 , H01L2224/32225 , H01L2224/73204 , H01L2924/00014 , H01L2924/01025 , H01L2924/01078 , H01L2924/09701 , H01L2924/3011 , H01L2924/3025 , H01L2924/3511 , H05K1/185 , H05K3/4602 , H05K2201/10712 , H01L2924/00 , H01L2224/05599 , H01L2224/0555 , H01L2224/0556
摘要： A capacitor is provided having a tough surface portion which prevents cracking that tends to occur when the capacitor is built-in or surface-mounted on a wiring board. A ceramic sintered body of the capacitor includes a capacitor forming layer portion, a cover layer portion and an interlayer portion. The capacitor forming layer portion has a laminated structure wherein ceramic dielectric layers and inner electrodes connected to a peripheral portion of capacitor via conductors, are alternately laminated. The cover layer portion is exposed at a surface portion of the ceramic body and has a laminated structure wherein ceramic dielectric layers and dummy electrodes not connected to the capacitor via conductors, are alternately laminated.
摘要翻译：提供一种电容器，其具有坚韧的表面部分，其防止当电容器内置或表面安装在布线板上时容易发生的开裂。电容器的陶瓷烧结体包括电容器形成层部分，覆盖层部分和中间层部分。电容器形成层部分具有层叠结构，其中陶瓷电介质层和连接到电容器通孔导体的周边部分的内部电极交替层叠。覆盖层部分在陶瓷体的表面部分露出，并且具有层叠结构，其中不连接到电容器通孔导体的陶瓷电介质层和虚拟电极交替层叠。

15. 发明授权

US07365946B2 Recorder/reproducer 失效
标题翻译：记录器/再现器
公开(公告)号：US07365946B2
公开(公告)日：2008-04-29
申请号：US10502941
申请日：2003-11-07
申请人： Mamoru Nakamura , Tadami Nakamura , Takashi Takamatsu , Manabu Sato
发明人： Mamoru Nakamura , Tadami Nakamura , Takashi Takamatsu , Manabu Sato
IPC分类号： G11B5/54
CPC分类号： G11B17/0438 , G11B11/10558 , G11B17/046
摘要： A recording/reproducing apparatus includes a cartridge holder which is rotatably provided on a chassis, into which a disc cartridge enclosing a magneto-optical disc is inserted, and which holds the inserted disc cartridge, an optical pickup that irradiates laser light onto the magneto-optical disc, a magnetic head that is provided on the upper surface side of the cartridge holder facing the optical pickup and that is moved between a lowered position close to the optical disc and a raised position away from the magneto-optical disc, at least one first sliding member that is movably provided on the cartridge holder, a head raising/lowering mechanism that moves the magnetic head between the upper position and the lower position by moving the first sliding member, and a driving mechanism that is disposed on a lower surface side of the chassis, engages the sliding member, and moves the first sliding member.
摘要翻译：一种记录/再现装置，包括一个可旋转地设置在一个底盘上的盒保持器，一个包含磁光盘的盘盒被插入到其中，并保持插入的盘盒;一个光学拾取器，将激光照射到磁光盘上，光盘，设置在盒保持器的面向光学拾取器的上表面侧并且在靠近光盘的降低位置和远离磁光盘的升高位置之间移动的磁头，至少一个可移动地设置在盒保持器上的第一滑动构件，通过移动第一滑动构件而将磁头移动在上部位置和下部位置之间的头部升高/降低机构，以及设置在下表面侧的驱动机构使滑动构件接合，并使第一滑动构件移动。

16. 发明授权

US07291789B2 Copper paste and wiring board using the same 有权
标题翻译：铜膏和接线板使用相同
公开(公告)号：US07291789B2
公开(公告)日：2007-11-06
申请号：US10620361
申请日：2003-07-17
申请人： Hiroshi Sumi , Hidetoshi Mizutani , Manabu Sato
发明人： Hiroshi Sumi , Hidetoshi Mizutani , Manabu Sato
IPC分类号： H05K1/09
CPC分类号： H05K1/092 , H01B1/22 , H01L23/047 , H01L23/49883 , H01L24/48 , H01L2224/05599 , H01L2224/45099 , H01L2224/48091 , H01L2224/48227 , H01L2924/00014 , H01L2924/01012 , H01L2924/0102 , H01L2924/01078 , H01L2924/01079 , H01L2924/09701 , H01L2924/15153 , H01L2924/1517 , H01L2924/15312 , H01L2924/1532 , H01L2924/16195 , H01L2924/3025 , H05K1/0203 , H05K1/182 , Y10T29/49163 , Y10T428/24917 , H01L2224/45015 , H01L2924/207
摘要： A wiring board comprising: a conductor layer comprising Fe and Cu; and at least one of a radiator, a connection terminal, a cover and a circuit component, connected to the conductor layer through a joining member, which is obtained by coating a copper paste comprising a copper powder, an organic vehicle and an Fe2O3 particle as a conductor layer on a ceramic green sheet and firing it.
摘要翻译：一种布线板，包括：包含Fe和Cu的导体层; 以及通过连接构件连接到导体层的散热器，连接端子，盖和电路部件中的至少一个，其通过涂覆包含铜粉，有机载体和Fe 2 3 颗粒作为陶瓷生片上的导体层并烧制。

17. 发明申请

US20070145449A1 Capacitor to be incorporated in wiring substrate, method for manufacturing the capacitor, and wiring substrate 有权
标题翻译：配线基板中的电容器，电容器的制造方法以及布线基板
公开(公告)号：US20070145449A1
公开(公告)日：2007-06-28
申请号：US11643871
申请日：2006-12-22
申请人： Motohiko Sato , Kazuhiro Hayashi , Kenji Murakami , Motonobu Kurahashi , Yusuke Kaieda , Jun Otsuka , Manabu Sato
发明人： Motohiko Sato , Kazuhiro Hayashi , Kenji Murakami , Motonobu Kurahashi , Yusuke Kaieda , Jun Otsuka , Manabu Sato
IPC分类号： H01L29/94
CPC分类号： H05K1/0231 , H01G4/228 , H01G4/30 , H01G4/38 , H01L23/49822 , H01L2924/0002 , H01L2924/3511 , H05K1/185 , H05K3/4602 , H05K2201/10712 , H01L2924/00
摘要： A wiring substrate in which a capacitor is provided, the capacitor comprising a capacitor body including a plurality of dielectric layers and internal electrode layers provided between the different dielectric layers, wherein said capacitor body has, in at least one side face of said capacitor body, recesses extending in a thickness direction of said capacitor body from at least one of a first principal face of said capacitor body and a second principal face positioned on the side opposite to the first principal face.
摘要翻译：一种电容器，其具有电容器，所述电容器包括：电容器主体，包括多个电介质层和设置在所述不同电介质层之间的内部电极层，其中所述电容器本体在所述电容器主体的至少一个侧面中，从所述电容器主体的第一主面和位于与所述第一主面相反的一侧的第二主面中的至少一个在所述电容器本体的厚度方向上延伸的凹部。

18. 发明授权

US07233480B2 Capacitor and method for manufacturing the same 有权
标题翻译：电容器及其制造方法
公开(公告)号：US07233480B2
公开(公告)日：2007-06-19
申请号：US11475891
申请日：2006-06-28
申请人： Kazuhiro Hayashi , Akifumi Tosa , Motohiko Sato , Jun Otsuka , Manabu Sato
发明人： Kazuhiro Hayashi , Akifumi Tosa , Motohiko Sato , Jun Otsuka , Manabu Sato
IPC分类号： H01G4/228
CPC分类号： H01G4/30 , H01G4/12
摘要： A laminated ceramic capacitor (10) divided into a first laminate (11), a second laminate (12), a third laminate (13), and a fourth laminate (14). The first laminate (11) includes a ceramic layer (15) serving as a dielectric layer. The ceramic layer (15) is thicker than a ceramic layer (17) sandwiched between internal electrodes (16a) in the second laminate (12) or the fourth laminate (14), and thinner than 20 times the thickness of the ceramic layer (17). The third laminate (13) includes dielectric layers, which serve as the ceramic layers (17), and has a thickness of 5% of the total thickness of the second laminate (12) and the fourth laminate (14). Accordingly, the third laminate (13) achieves the function of absorbing an electrode-induced thickness differential. Also, by means of regulating the thickness of the first laminate (11), portions of via electrodes (18) that extend without being electrically connected to the internal electrodes (16b) can be shortened.
摘要翻译：分为第一层压体（11），第二层压板（12），第三层压板（13）和第四层压板（14）的层压陶瓷电容器（10）。第一层压体（11）包括用作电介质层的陶瓷层（15）。陶瓷层（15）比夹在第二层叠体（12）或第四层叠体（14）的内部电极（16a）之间的陶瓷层（17）厚，比陶瓷层（15）的厚度薄 17）。第三层压体（13）包括作为陶瓷层（17）的电介质层，其厚度为第二层叠体（12）和第四层叠体（14）的总厚度的5％。因此，第三层压体（13）实现吸收电极引起的厚度差的功能。此外，通过调整第一层压体（11）的厚度，能够缩短在不与内部电极（16b）电连接的情况下延伸的通孔电极（18）的部分。

19. 发明申请

US20070086407A1 Wireless communication method, wireless comunication system using the same, and wireless terminal therrof 有权
标题翻译：无线通信方式，使用无线通信系统，无线终端热线
公开(公告)号：US20070086407A1
公开(公告)日：2007-04-19
申请号：US10586146
申请日：2005-01-13
申请人： Manabu Sato
发明人： Manabu Sato
IPC分类号： H04B7/208
CPC分类号： H04W68/12 , H04W88/04 , H04W88/06
摘要： A business wireless communication system, which includes both a repeater relay station of a wireless network using a repeater system and an FDMA relay station of a wireless network using FDMA system, comprises means for ensuring that the repeater relay station, when receiving a call signal from a repeater wireless terminal of the wireless communication network of the repeater system, is communication-line-connected to the FDMA relay station so as to forward the call signal to the FDMA relay station, which sets the forwarded call signal to a control signal and transmits it to an FDMA wireless terminal of the wireless communication network of the FDMA system; and means for ensuring that the FDMA wireless terminal receives the control signal to communicate with the repeater wireless terminal via the repeater relay station. In this way, there can be provided a wireless communication method, a system using the same, and a wireless terminal thereof, wherein a single reception frequency is used to attend to call signals of two different wireless communication systems.
摘要翻译：包括使用中继器系统的无线网络的中继站中继站和使用FDMA系统的无线网络的FDMA中继站的业务无线通信系统包括用于确保中继器中继站在接收到来自中继器系统的无线通信网络的中继器无线终端通信线路连接到FDMA中继站，以将呼叫信号转发到FDMA中继站，FDMA中继站将转发的呼叫信号设置为控制信号，并发送它到FDMA系统的无线通信网络的FDMA无线终端; 以及用于确保FDMA无线终端经由中继器中继站接收到与中继器无线终端通信的控制信号的装置。以这种方式，可以提供一种无线通信方法，使用该无线通信方法的系统及其无线终端，其中使用单个接收频率来接收两个不同无线通信系统的呼叫信号。

20. 发明申请

US20070045815A1 Wiring board construction including embedded ceramic capacitors(s) 有权
标题翻译：接线板结构包括嵌入式陶瓷电容器
公开(公告)号：US20070045815A1
公开(公告)日：2007-03-01
申请号：US11513249
申请日：2006-08-31
申请人： Kazuhiro Urashima , Shinji Yuri , Manabu Sato , Jun Otsuka
发明人： Kazuhiro Urashima , Shinji Yuri , Manabu Sato , Jun Otsuka
IPC分类号： H01L23/04
CPC分类号： H05K1/185 , H01G2/06 , H01G4/38 , H01L21/568 , H01L21/6835 , H01L23/50 , H01L23/5383 , H01L23/5386 , H01L23/642 , H01L24/81 , H01L2221/68345 , H01L2224/05568 , H01L2224/05573 , H01L2224/16225 , H01L2224/16237 , H01L2224/81192 , H01L2224/81801 , H01L2924/00014 , H01L2924/01005 , H01L2924/01006 , H01L2924/01013 , H01L2924/01019 , H01L2924/01029 , H01L2924/01033 , H01L2924/01038 , H01L2924/01042 , H01L2924/01047 , H01L2924/01056 , H01L2924/01074 , H01L2924/01078 , H01L2924/01082 , H01L2924/014 , H01L2924/09701 , H01L2924/12042 , H01L2924/14 , H01L2924/15174 , H01L2924/15311 , H01L2924/15787 , H01L2924/19041 , H01L2924/19043 , H01L2924/30105 , H01L2924/30107 , H01L2924/3011 , H01L2924/3025 , H01L2924/351 , H05K1/0231 , H05K3/4602 , H05K2201/10522 , H05K2201/10674 , H05K2201/10712 , H01L2924/00 , H01L2224/05599
摘要： A wiring board includes a substrate core, ceramic capacitors and a built-up layer. The substrate core has a housing opening portion therein which opens at a core main surface. The ceramic capacitors are accommodated in the housing opening portion and oriented such that the core main surface and a capacitor main surface of each capacitor face the same way. The built-up layer includes semiconductor integrated circuit element mounting areas at various locations on a surface thereof. In the substrate core, each ceramic capacitor is respectively disposed in an area corresponding to each semiconductor integrated circuit element mounting area.
摘要翻译：布线板包括基板芯，陶瓷电容器和积层。基板芯具有在芯主表面上开口的壳体开口部分。陶瓷电容器容纳在壳体开口部分中并且取向为使得每个电容器的芯主表面和电容器主表面相同。积层在其表面上的各个位置包括半导体集成电路元件安装区域。在基板芯中，每个陶瓷电容器分别设置在对应于每个半导体集成电路元件安装区域的区域中。

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