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1. 发明申请

US20050051356A1 Copper paste and wiring board using the same 有权
标题翻译：铜膏和接线板使用相同
公开(公告)号：US20050051356A1
公开(公告)日：2005-03-10
申请号：US10620361
申请日：2003-07-17
申请人： Hiroshi Sumi , Hidetoshi Mizutani , Manabu Sato
发明人： Hiroshi Sumi , Hidetoshi Mizutani , Manabu Sato
IPC分类号： H01B1/22 , H01L23/047 , H01L23/498 , H05K1/02 , H05K1/09 , H05K1/18
CPC分类号： H05K1/092 , H01B1/22 , H01L23/047 , H01L23/49883 , H01L24/48 , H01L2224/05599 , H01L2224/45099 , H01L2224/48091 , H01L2224/48227 , H01L2924/00014 , H01L2924/01012 , H01L2924/0102 , H01L2924/01078 , H01L2924/01079 , H01L2924/09701 , H01L2924/15153 , H01L2924/1517 , H01L2924/15312 , H01L2924/1532 , H01L2924/16195 , H01L2924/3025 , H05K1/0203 , H05K1/182 , Y10T29/49163 , Y10T428/24917 , H01L2224/45015 , H01L2924/207
摘要： A wiring board comprising: a conductor layer comprising Fe and Cu; and at least one of a radiator, a connection terminal, a cover and a circuit component, connected to the conductor layer through a joining member, which is obtained by coating a copper paste comprising a copper powder, an organic vehicle and an Fe2O3 particle as a conductor layer on a ceramic green sheet and firing it.
摘要翻译：一种布线板，包括：包含Fe和Cu的导体层; 以及通过连接构件连接到导体层的散热器，连接端子，盖和电路部件中的至少一个，其通过将包含铜粉，有机载体和Fe 2 O 3颗粒的铜浆涂布为在陶瓷生片上的导体层并烧制。

2. 发明授权

US06855399B2 Copper paste and wiring board using the same 失效
标题翻译：铜膏和接线板使用相同
公开(公告)号：US06855399B2
公开(公告)日：2005-02-15
申请号：US10620595
申请日：2003-07-17
申请人： Hiroshi Sumi , Hidetoshi Mizutani , Manabu Sato
发明人： Hiroshi Sumi , Hidetoshi Mizutani , Manabu Sato
IPC分类号： H05K1/11 , H01L23/498 , H05K1/09 , H05K3/40 , B32B9/00 , B32B3/00 , H01B1/02
CPC分类号： H05K1/092 , H01L23/49883 , H01L24/01 , H01L2924/09701 , H01L2924/15174 , H01L2924/15787 , H05K3/4061 , H05K3/4629 , Y10T428/24917 , Y10T428/252 , H01L2924/00
摘要： A wiring board obtained by filling a copper paste in a via hole formed on a ceramic green sheet and firing it to form an insulating layer and a via conductor, the copper paste comprising a copper powder, an organic vehicle and at least one selected from the group consisting of: a ceramic particle having an average particle size of 100 nm or less; and an Fe2O3 particle, wherein the copper paste comprises from 6 to 20 parts by mass of the organic vehicle per 100 parts by mass of the copper powder.
摘要翻译： 1.一种布线基板，其特征在于，在形成于陶瓷生片上的通路孔中填充铜膏而进行烧成以形成绝缘层和通路导体，所述铜膏包含铜粉末，有机载体和选自组成：平均粒径为100nm以下的陶瓷粒子; 和Fe 2 O 3粒子，其中，所述铜膏相对于每100质量份的铜粉含有6〜20质量份的有机载体。

3. 发明授权

US07309669B2 Dielectric material and dielectric sintered body, and wiring board using the same 有权
标题翻译：电介质材料和电介质烧结体，以及使用其的接线板
公开(公告)号：US07309669B2
公开(公告)日：2007-12-18
申请号：US11165020
申请日：2005-06-24
申请人： Hiroshi Sumi , Masashi Suzumura , Tsutomu Sakai , Hidetoshi Mizutani , Manabu Sato
发明人： Hiroshi Sumi , Masashi Suzumura , Tsutomu Sakai , Hidetoshi Mizutani , Manabu Sato
IPC分类号： C03C14/00 , B32B17/06
CPC分类号： C03C8/14 , C03C14/004 , C03C2214/04 , C03C2214/30 , H01L23/49894 , H01L2924/0002 , H01L2924/09701 , H05K1/0306 , H05K1/162 , H05K3/4629 , H05K3/4676 , Y10T428/24926 , H01L2924/00
摘要： A dielectric material comprising: a glass powder constituted of a glass comprising Si, B and an alkali metal element, the glass being amorphous in sintering at a temperature of 1,050° C. or lower; and a ceramic filler comprising at least one member of SiO2, Al2O3 and 3Al2O3.2SiO2, and an alkali metal element, wherein when a total sum of Si converted into SiO2, B converted into B2O3 and the alkali metal element converted into A2O, wherein A represents an alkali metal element, all of which are contained in the glass, is 100 mole %, the content of the alkali metal element converted into A2O, which is contained in the glass, is 0.5 mole % or less; and when a total sum of at least one member of SiO2, Al2O3 and 3Al2O3.2SiO2, and the alkali metal element converted into A2O, all of which are contained in the ceramic filler, is 100 mole %, a content of the alkali metal element converted into A2O, which is contained in the ceramic filler, is 0.5 mole % or less.
摘要翻译：一种电介质材料，包括：由包含Si，B和碱金属元素的玻璃构成的玻璃粉末，所述玻璃在1050℃或更低的温度下烧结为非晶态; 和包含SiO 2，Al 2 O 3 3和3Al 2 O 2的至少一种元素的陶瓷填料， B 2 SiO 2，以及碱金属元素，其中当转化为SiO 2的Si的总和转化为B 2 O 3和碱金属元素转化为A 2 O，其中A表示所有这些都包含在玻璃中的碱金属元素是 100摩尔％，玻璃中含有的转化为A 2 O 2的碱金属元素的含量为0.5摩尔％以下; 并且当至少一个SiO 2成分，Al 2 O 3 3和3Al 2 O 2的总和时， 3Si 2 SiO 2，转化成A 2 O 2的碱金属元素全部包含在陶瓷填料中，为100摩尔％，陶瓷填料中所含的转化成A 2 O 2的碱金属元素的含量为0.5摩尔％以下。

4. 发明授权

US07291789B2 Copper paste and wiring board using the same 有权
标题翻译：铜膏和接线板使用相同
公开(公告)号：US07291789B2
公开(公告)日：2007-11-06
申请号：US10620361
申请日：2003-07-17
申请人： Hiroshi Sumi , Hidetoshi Mizutani , Manabu Sato
发明人： Hiroshi Sumi , Hidetoshi Mizutani , Manabu Sato
IPC分类号： H05K1/09
CPC分类号： H05K1/092 , H01B1/22 , H01L23/047 , H01L23/49883 , H01L24/48 , H01L2224/05599 , H01L2224/45099 , H01L2224/48091 , H01L2224/48227 , H01L2924/00014 , H01L2924/01012 , H01L2924/0102 , H01L2924/01078 , H01L2924/01079 , H01L2924/09701 , H01L2924/15153 , H01L2924/1517 , H01L2924/15312 , H01L2924/1532 , H01L2924/16195 , H01L2924/3025 , H05K1/0203 , H05K1/182 , Y10T29/49163 , Y10T428/24917 , H01L2224/45015 , H01L2924/207
摘要： A wiring board comprising: a conductor layer comprising Fe and Cu; and at least one of a radiator, a connection terminal, a cover and a circuit component, connected to the conductor layer through a joining member, which is obtained by coating a copper paste comprising a copper powder, an organic vehicle and an Fe2O3 particle as a conductor layer on a ceramic green sheet and firing it.
摘要翻译：一种布线板，包括：包含Fe和Cu的导体层; 以及通过连接构件连接到导体层的散热器，连接端子，盖和电路部件中的至少一个，其通过涂覆包含铜粉，有机载体和Fe 2 3 颗粒作为陶瓷生片上的导体层并烧制。

5. 发明申请

US20060083930A1 Dielectric material and dielectric sintered body, and wiring board using the same 有权
标题翻译：电介质材料和电介质烧结体，以及使用其的接线板
公开(公告)号：US20060083930A1
公开(公告)日：2006-04-20
申请号：US11165020
申请日：2005-06-24
申请人： Hiroshi Sumi , Masashi Suzumura , Tsutomu Sakai , Hidetoshi Mizutani , Manabu Sato
发明人： Hiroshi Sumi , Masashi Suzumura , Tsutomu Sakai , Hidetoshi Mizutani , Manabu Sato
IPC分类号： B32B17/06 , C03C14/00
CPC分类号： C03C8/14 , C03C14/004 , C03C2214/04 , C03C2214/30 , H01L23/49894 , H01L2924/0002 , H01L2924/09701 , H05K1/0306 , H05K1/162 , H05K3/4629 , H05K3/4676 , Y10T428/24926 , H01L2924/00
摘要： A dielectric material comprising: a glass powder constituted of a glass comprising Si, B and an alkali metal element, the glass being amorphous in sintering at a temperature of 1,050° C. or lower; and a ceramic filler comprising at least one member of SiO2, Al2O3 and 3Al2O3.2SiO2, and an alkali metal element, wherein when a total sum of Si converted into SiO2, B converted into B2O3 and the alkali metal element converted into A2O, wherein A represents an alkali metal element, all of which are contained in the glass, is 100 mole %, the content of the alkali metal element converted into A2O, which is contained in the glass, is 0.5 mole % or less; and when a total sum of at least one member of SiO2, Al2O3 and 3Al2O3.2SiO2, and the alkali metal element converted into A2O, all of which are contained in the ceramic filler, is 100 mole %, a content of the alkali metal element converted into A2O, which is contained in the ceramic filler, is 0.5 mole % or less.
摘要翻译：一种电介质材料，包括：由包含Si，B和碱金属元素的玻璃构成的玻璃粉末，所述玻璃在1050℃或更低的温度下烧结为非晶态; 和包含SiO 2，Al 2 O 3 3和3Al 2 O 2的至少一种元素的陶瓷填料， B 2 SiO 2，以及碱金属元素，其中当转化为SiO 2的Si的总和转化为B 2 O 3和碱金属元素转化为A 2 O，其中A表示所有这些都包含在玻璃中的碱金属元素是 100摩尔％，玻璃中含有的转化为A 2 O 2的碱金属元素的含量为0.5摩尔％以下; 并且当至少一个SiO 2成分，Al 2 O 3 3和3Al 2 O 2的总和时， 3Si 2 SiO 2，转化成A 2 O 2的碱金属元素全部包含在陶瓷填料中，为100摩尔％，陶瓷填料中所含的转化成A 2 O 2的碱金属元素的含量为0.5摩尔％以下。

6. 发明授权

US06852655B2 Dielectric ceramic 失效
标题翻译：电介质陶瓷
公开(公告)号：US06852655B2
公开(公告)日：2005-02-08
申请号：US10354074
申请日：2003-01-30
申请人： Eiji Kodera , Kazuyuki Fujii , Makoto Baba , Hidetoshi Mizutani , Manabu Sato
发明人： Eiji Kodera , Kazuyuki Fujii , Makoto Baba , Hidetoshi Mizutani , Manabu Sato
IPC分类号： C03C8/04 , C03C8/14 , H05K1/03 , C03C1/00
CPC分类号： C03C8/14 , C03C8/04 , H05K1/0306
摘要： The invention is to offer such a dielectric ceramic enabling to simultaneously sinter with the low resistant conductor of Ag based metals and Cu based metals, having the excellent mechanical strength and exhibiting the excellent dielectric characteristics in the GHz zone. Mixed powders of Si: 20 to 30 weight %, B: 5 to 30 weight %, Al: 20 to 30 weight %, Ca: 10 to 20 weight %, and Zn: 10 to 20 weight % are prepared, melted, and rapidly cooled to produce glass frits. The glass frits are granulated and mixed with gahnite filler and titania filler which are inorganic filler powders. Subsequently, a binder is thrown into the powders to produce a composition of dielectric ceramic, and then is formed, followed by sintering. The mixed powders may contain at least one kind of alkali metal of Li, K and Na.
摘要翻译：本发明提供一种这样的电介质陶瓷，能够与Ag基金属和Cu基金属的低电阻导体同时烧结，具有优异的机械强度并且在GHz区域表现出优异的介电特性。混合粉末Si：20〜30重量％，B：5〜30重量％，Al：20〜30重量％，Ca：10〜20重量％，Zn：10〜20重量％冷却生产玻璃料。将玻璃料与粒状填料和作为无机填料粉末的二氧化钛填料混合。随后，将粘合剂投入到粉末中以产生电介质陶瓷的组合物，然后形成，随后烧结。混合粉末可含有至少一种Li，K和Na的碱金属。

7. 发明授权

US08546700B2 Capacitor for incorporation in wiring board, wiring board, method of manufacturing wiring board, and ceramic chip for embedment 有权
标题翻译：用于布线板的电容器，布线板，制造布线板的方法和用于嵌入的陶瓷芯片
公开(公告)号：US08546700B2
公开(公告)日：2013-10-01
申请号：US13042686
申请日：2011-03-08
申请人： Hiroshi Yamamoto , Toshitake Seki , Shinji Yuri , Masaki Muramatsu , Motohiko Sato , Kazuhiro Hayashi , Jun Otsuka , Manabu Sato
发明人： Hiroshi Yamamoto , Toshitake Seki , Shinji Yuri , Masaki Muramatsu , Motohiko Sato , Kazuhiro Hayashi , Jun Otsuka , Manabu Sato
IPC分类号： H05K1/16
CPC分类号： H01G4/232 , H01G4/30 , H01L23/49822 , H01L2224/05568 , H01L2224/05573 , H01L2224/16225 , H01L2224/16235 , H01L2924/00014 , H01L2924/01019 , H01L2924/01078 , H01L2924/01079 , H01L2924/09701 , H01L2924/15311 , H01L2924/3511 , H05K1/0231 , H05K1/112 , H05K1/185 , H05K3/4602 , H05K2201/096 , H05K2201/09781 , H05K2201/10674 , H05K2201/10712 , H01L2224/05599
摘要： A capacitor comprising: a capacitor body including a plurality of laminated dielectric layers, a plurality of inner electrode layers which are respectively disposed between mutually adjacent ones of the dielectric layers, a first main surface located in a laminated direction of the dielectric layers, and a second main surface opposite to the first main surface; a first outer electrode formed on the first main surface of the capacitor body and electrically connected to the inner electrode layers; a second outer electrode formed on the second main surface of the capacitor body and electrically connected to the inner electrode layers; a first dummy electrode formed on the first main surface of the capacitor body; and a second dummy electrode formed on the second main surface of the capacitor body.
摘要翻译：一种电容器，包括：电容器主体，包括多个叠层电介质层，多个内部电极层，分别设置在相互相邻的电介质层之间，第一主表面位于电介质层的层叠方向上，第二主表面与第一主表面相对; 第一外电极，形成在所述电容器主体的所述第一主表面上并电连接到所述内电极层; 形成在所述电容器主体的所述第二主表面上并与内部电极层电连接的第二外部电极; 形成在所述电容器主体的所述第一主表面上的第一虚拟电极; 以及形成在电容器主体的第二主表面上的第二虚拟电极。

8. 发明申请

US20130214920A1 METHOD OF EMANATING A SOUND FROM A VEHICLE 有权
标题翻译：从汽车发出声音的方法
公开(公告)号：US20130214920A1
公开(公告)日：2013-08-22
申请号：US13402090
申请日：2012-02-22
申请人： Heather Konet , Tsuyoshi Kanuma , Manabu Sato , Toshiyuki Tabata , Andy Christensen
发明人： Heather Konet , Tsuyoshi Kanuma , Manabu Sato , Toshiyuki Tabata , Andy Christensen
IPC分类号： B60Q1/50 , B60Q1/54 , B60Q1/26
CPC分类号： B60Q5/008
摘要： A method of emanating a sound from a vehicle includes detecting a transmission state and a brake state of the vehicle and determining whether a vehicle movement state indicates intent to move the vehicle from a stationary state based on the transmission state and the brake state. The method further includes emanating the sound when the vehicle movement state indicates intent to move the vehicle, and refraining from emanating the sound when the vehicle is in the stationary state and the vehicle movement state fails to indicate intent to move the vehicle.
摘要翻译：从车辆发出声音的方法包括检测车辆的发送状态和制动状态，并且基于发送状态和制动状态来确定车辆运动状态是否表示意图将车辆从静止状态移动。该方法还包括当车辆移动状态表示意图移动车辆时发出声音，并且当车辆处于静止状态时不发出声音，并且车辆移动状态未能指示移动车辆的意图。

9. 发明授权

US08415124B2 Method for producing an immobilized enzyme for hydrolyzing fats and oils 有权
标题翻译：生产用于水解脂肪和油的固定化酶的方法
公开(公告)号：US08415124B2
公开(公告)日：2013-04-09
申请号：US12839711
申请日：2010-07-20
申请人： Manabu Sato , Kazuhiro Onozuka , Takaaki Watanabe , Hiroyuki Konishi
发明人： Manabu Sato , Kazuhiro Onozuka , Takaaki Watanabe , Hiroyuki Konishi
IPC分类号： C12N11/14 , C12N11/02 , C12N11/10 , C12N11/08 , C12P7/64
CPC分类号： C12N11/14 , C11C1/045
摘要： A method for producing an immobilized enzyme which includes the steps of immobilizing an enzyme used for hydrolyzing fats and oils on a immobilization carrier by adsorption, bringing the immobilized enzyme into contact with an organic solvent in which fat-soluble fatty acids or the derivatives thereof have been dissolved, and adjusting the moisture content of the immobilized enzyme from 1 to 20% by weight based on the weight of the carrier.
摘要翻译：一种固定化酶的制造方法，其特征在于，包括以下步骤：通过吸附将固定化载体上的水解油脂的酶固定化，使固定化酶与脂溶性脂肪酸或其衍生物具有的有机溶剂接触已经溶解，并且基于载体的重量将固定化酶的水分含量调整为1至20重量％。

10. 发明授权

US08404595B2 Plasma processing method 有权
标题翻译：等离子体处理方法
公开(公告)号：US08404595B2
公开(公告)日：2013-03-26
申请号：US11860788
申请日：2007-09-25
申请人： Masanobu Honda , Manabu Sato , Yoshiki Igarashi
发明人： Masanobu Honda , Manabu Sato , Yoshiki Igarashi
IPC分类号： H01L23/302 , H01L21/461 , B23P15/00 , C03C25/00 , C03C15/00 , C03C25/68 , C23F1/00 , C23F3/00 , B44C1/22
CPC分类号： H01L21/467 , H01J37/32091 , H01J37/32165 , H01L21/31116
摘要： A plasma processing method for processing a target substrate uses a plasma processing apparatus which includes a vacuum evacuable processing vessel for accommodating the target substrate therein, a first electrode disposed in the processing vessel and connected to a first RF power supply for plasma generation and a second electrode disposed to face the first electrode. The method includes exciting a processing gas containing fluorocarbon in the processing vessel to generate a plasma while applying a negative DC voltage having an absolute value ranging from about 100 V to 1500 V or an RF power of a frequency lower than about 4 MHz to the second electrode. The target layer is etched by the plasma, thus forming recesses on the etching target layer based on the pattern of the resist layer.
摘要翻译：用于处理目标基板的等离子体处理方法使用等离子体处理装置，该等离子体处理装置包括用于容纳目标基板的真空可排除处理容器，设置在处理容器中的第一电极，并连接到用于等离子体产生的第一RF电源，设置成面对第一电极的电极。该方法包括在处理容器中激发含有碳氟化合物的处理气体，以产生等离子体，同时施加绝对值范围从约100V至1500V或低于约4MHz的RF功率的负DC电压至第二电极。通过等离子体蚀刻目标层，由此基于抗蚀剂层的图案在蚀刻目标层上形成凹部。

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