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11. 发明专利

JP2001328069A METHOD AND DEVICE FOR CLEANING OF DRESSER IN GRINDING DEVICE 失效
公开(公告)号：JP2001328069A
公开(公告)日：2001-11-27
申请号：JP2000153399
申请日：2000-05-24
申请人： EBARA CORP
发明人： SEKIMOTO MASAHIKO , FUJIMOTO KENJI
IPC分类号： B24B55/06 , B24B53/017 , H01L21/304 , B24B37/00
摘要： PROBLEM TO BE SOLVED: To provide a method and device for cleaning a dresser in a grinding device capable of efficiently removing clogging by improving capacity to remove chips on a grinding surface adhered to a dressing surface of the dresser and the clogging by the chips. SOLUTION: This dresser cleaning device in the grinding device is for cleaning the dressing surface abutting on the grinding surface of the dresser 6 for dressing the grinding surface of the grinding device, is provided with a liquid tank 9 for accommodating liquid, and one or more such things as an injection nozzle 11 for injecting a flow of liquid followed by cavitation on the dressing surface in a state of the dresser 6 soaked in the cleaning liquid of the tank 9, an ultrasonic vibrator for applying ultrasonic vibration on the liquid of the liquid tank 9 or a bubble generator for diffusing bubbles in the liquid of the tank and abutting them on the dressing surface.

12. 发明专利

JP2007314880A Plating processing unit 有权
标题翻译：镀锌加工单元
公开(公告)号：JP2007314880A
公开(公告)日：2007-12-06
申请号：JP2007136464
申请日：2007-05-23
申请人： Ebara Corp , 株式会社荏原製作所
发明人： KATSUOKA SEIJI , SEKIMOTO MASAHIKO , YOKOYAMA TOSHIO , WATANABE TERUYUKI , OGAWA TAKAHIRO , KOBAYASHI KENICHI , MIYAZAKI MITSURU , MOTOJIMA YASUYUKI , OWATARI AKIRA , DAI NAOKI
IPC分类号： C23C18/31 , B65G49/04 , C23C18/16 , C25D7/12 , C25D17/00 , H01L21/00 , H01L21/288 , H01L21/677 , H01L21/683 , H01L21/687
CPC分类号： H01L21/67161 , C23C18/1628 , C23C18/1893 , C25D7/123 , C25D17/001 , C25D17/08 , H01L21/67051 , H01L21/67126 , H01L21/67173 , H01L21/6719 , H01L21/67196 , H01L21/6723 , H01L21/67742 , H01L21/67751 , H01L21/67766 , H01L21/67781 , H01L21/68707 , H01L21/68721 , Y10S134/902 , Y10T279/11
摘要： PROBLEM TO BE SOLVED: To provide a plating processing unit where not only plating processing can be securely performed with high quality, but also, the compacting of the whole unit and the reduction of unit cost can be attained. SOLUTION: Regarding the plating processing unit where, in a state where a substrate W held by an attracting head 789 is inserted into a processing tank, the processing face of the substrate W is subjected to liquid contact processing with a plating solution, the attracting head 789 is composed so as to be mounted with a ring-shaped substrate attracting portion 795 vacuum-attracting the back surface of the substrate W so as to be a ring shape to the peripheral lower surface of the base 791 and also functioning as a seal for preventing intrusion of the plating solution into the inside of the vacuum-attracted portion of the back surface of the substrate W. The base 791 has opening parts for opening the space between the substrate W attached to the substrate attracting portion 795 and the base 791. COPYRIGHT: (C)2008,JPO&INPIT
摘要翻译：要解决的问题：为了提供一种电镀处理单元，其不仅可以以高质量可靠地执行电镀处理，而且可以实现整个单元的压实和单元成本的降低。解决方案：关于电镀处理单元，其中在由吸引头789保持的基板W插入处理槽的状态下，使基板W的处理面与电镀液进行液体接触处理，吸引头789构成为安装有环状基板吸引部795，其将基板W的背面真空吸附成环状，从而形成为基部791的周边下表面，并且还起到用于防止电镀溶液侵入到基板W的背面的真空吸引部分的内部的密封。基部791具有用于打开附着到基板吸引部795的基板W与安装在基板吸引部795之间的空间的开口部基地791.版权所有（C）2008年，JPO＆INPIT

13. 发明专利

JP2004084020A Substrate treatment apparatus and method 有权
公开(公告)号：JP2004084020A
公开(公告)日：2004-03-18
申请号：JP2002247715
申请日：2002-08-27
申请人： Ebara Corp , 株式会社荏原製作所
发明人： YOKOYAMA TOSHIO , SEKIMOTO MASAHIKO , OGATA KEN , INOUE HIROAKI
IPC分类号： C23C18/31 , H01L21/288
摘要： PROBLEM TO BE SOLVED: To make it possible to uniformly perform treatment of materials to be treated, such as formation of uniform plating films, by maintaining a treating solution (a plating solution) in an always optimum state while minimizing the consumption of the processing solution, for example the plating solution, as far as possible.
SOLUTION: A substrate treatment apparatus has: a plurality of solution supply vessels 50a and 50b for separately holding a plurality of the solutions for forming the treating solution 54 by being mixed while controlling the temperatures thereof; mixing vessels 52a and 52b for forming the treating solution 54 by mixing the plurality of the solutions separately supplied from the plurality of the vessels 50a and 50b while controlling their temperatures; and a treating vessel 56 for introducing the treating solution 54 into its inside and treating a substrate W by bringing the substrate into contact with the treating solution 54 while controlling the temperature of the treating solution 54.
COPYRIGHT: (C)2004,JPO

14. 发明专利

JP2007262526A Substrate treatment apparatus and substrate treatment method 审中-公开
标题翻译：基板处理装置和基板处理方法
公开(公告)号：JP2007262526A
公开(公告)日：2007-10-11
申请号：JP2006091237
申请日：2006-03-29
申请人： Ebara Corp , 株式会社荏原製作所
发明人： YOKOYAMA TOSHIO , KATSUOKA SEIJI , SEKIMOTO MASAHIKO
IPC分类号： C23C18/31 , H01L21/304
摘要： PROBLEM TO BE SOLVED: To provide a substrate treatment apparatus and a substrate treatment method which allows treating liquid such as plating liquid to reliably penetrate even the inner part of a recessed part for wiring of a micronized trench, etc. and can perform prescribed treatment such as plating.
SOLUTION: The substrate treatment apparatus comprises: a treatment chamber 32 which is opened to the upper side and is connected with a vacuum part; and a vertically freely-movable substrate holding head 10 which is arranged on the upper side of the treatment chamber 32 and holds a substrate W on the lower surface, wherein an opening part of the treatment chamber 32 is covered with the substrate holding head 10 which holds the substrate W, the treatment chamber 32 is tightly closed, the inside thereof is evacuated, thereafter, the substrate W is brought into contact with the treatment liquid Q introduced to the treatment chamber 32 and the substrate W is treated.
COPYRIGHT: (C)2008,JPO&INPIT
摘要翻译：要解决的问题：提供一种基板处理装置和基板处理方法，其能够使诸如电镀液体的液体能够可靠地穿透甚至用于微细化沟槽等的布线的凹部的内部，并且可以执行规定处理如电镀。解决方案：基板处理装置包括：处理室32，其向上侧敞开并与真空部连接; 以及设置在处理室32的上侧并且在下表面上保持基板W的可垂直自由移动的基板保持头10，其中处理室32的开口部分被基板保持头10覆盖，基板保持头10 保持基板W，处理室32紧密地关闭，其内部被抽真空，然后使基板W与引入处理室32的处理液Q接触，并且处理基板W. 版权所有（C）2008，JPO＆INPIT

15. 发明专利

JP2004169075A Substrate treatment system 有权
公开(公告)号：JP2004169075A
公开(公告)日：2004-06-17
申请号：JP2002334277
申请日：2002-11-18
申请人： Ebara Corp , 株式会社荏原製作所
发明人： KATSUOKA SEIJI , SEKIMOTO MASAHIKO , YOKOYAMA TOSHIO , WATANABE TERUYUKI , OGAWA TAKAHIRO , KOBAYASHI KENICHI , MIYAZAKI MITSURU , MOTOJIMA YASUYUKI
IPC分类号： B08B1/04 , C23C18/18 , C23C18/31 , H01L21/304 , H01L21/68 , H01L21/683
摘要： PROBLEM TO BE SOLVED: To provide a substrate treatment system which delivers a substrate in a state where the substrate is quickly and securely held without causing the risk of falling to thereby exhibit improved throughput. SOLUTION: The substrate treatment system comprises a substrate receiving ring 90 fitted with a seal ring 92, a freely vertically movable substrate holder 60 having a substrate fixing ring 100 for holding the peripheral part of a substrate W between the ring 100 and the seal ring 92 to support the substrate W, and a temporary placement part 94 fitted to a position surrounding the seal ring 92 of the substrate receiving ring 90 and forming a space between the substrate W and the seal ring 92, and where the substrate W is temporarily placed. COPYRIGHT: (C)2004,JPO

16. 发明专利

JP2003260301A METHOD FOR CONCENTRATING CHEMICAL TREATING LIQUID AND DEVICE TO BE USED THEREFOR 审中-公开
公开(公告)号：JP2003260301A
公开(公告)日：2003-09-16
申请号：JP2002065502
申请日：2002-03-11
申请人： EBARA CORP
发明人： O CHIKAAKI , TAKAGI DAISUKE , MISHIMA KOJI , SEKIMOTO MASAHIKO , OWATARI AKIRA
IPC分类号： C02F1/04 , B01D1/14 , B01D1/22 , C23C18/16
摘要： PROBLEM TO BE SOLVED: To provide a means to effectively remove water mixed in a chemical treating liquid while suppressing changes in the component of the chemical treating liquid as much as possible. SOLUTION: The method for concentrating a chemical treating liquid features that the chemical treating liquid is brought into contact with inert gas or reduced pressure gas to vaporize the water component in the chemical treating liquid into the inert gas. The concentration device for a chemical treating liquid is equipped with a reservoir tank of the chemical treating liquid communicating with the chemical treating tank by feed and return pipes, a vaporizer communicating with the reservoir tank of the chemical treating liquid by a circulating means so as to enable the inert gas or reduced pressure gas pass, and a gas/ liquid separating means to enable the inert gas or reduced pressure gas from the vaporizer pass. COPYRIGHT: (C)2003,JPO

17. 发明专利

JP2001239457A POLISHING DEVICE 失效
公开(公告)号：JP2001239457A
公开(公告)日：2001-09-04
申请号：JP2000048241
申请日：2000-02-24
申请人： EBARA CORP
发明人： KATSUOKA SEIJI , SEKIMOTO MASAHIKO , MIYAZAKI MITSURU
IPC分类号： B24B37/013 , B24B37/10 , H01L21/304 , B24B37/04
摘要： PROBLEM TO BE SOLVED: To provide a polishing device capable of increasing the number of polished substrates such as a semiconductor wafer per unit time and polishing each substrate uniformly. SOLUTION: In this multihead type polishing device provided with a polishing table 6 having a polishing face, a plurality of top rings 5 holding a semiconductor wafer 8 and pressing it against the polishing table 6, and a rotary base 3 holding a plurality of top rings 5 and rotating and indexing a plurality of top rings 5, a substrate transfer device 20 transferring the semiconductor wafer 8 between the top rings and it is provided in adjacent to the polishing table 6, and one top ring 5 is positioned in adjacent to the substrate transfer device 20 by rotation and indexing operations of the rotary base 3 to exchange the semiconductor wafers 8 so as to polish the semiconductor wafer 8 held by the other top ring 5 during the exchange of the semiconductor wafers 8.

18. 发明专利

JP2000294616A ALIGNMENT MECHANISM WITH TEMPORARY LOADING TABLE AND POLISHING DEVICE 失效
公开(公告)号：JP2000294616A
公开(公告)日：2000-10-20
申请号：JP9849399
申请日：1999-04-06
申请人： EBARA CORP
发明人： SEKIMOTO MASAHIKO
IPC分类号： B24B37/00 , H01L21/304 , H01L21/68
摘要： PROBLEM TO BE SOLVED: To provide a positioning mechanism with a temporary loading table and polishing device by which both semiconductor wafers subject to pre- processing and post-processing in two reverse directions can be handled smoothly and simultaneously. SOLUTION: This alignment mechanism pushes up a semiconductor wafer which is placed on a supporting member 55, from the supporting member 55 by using an alignment member 58, and rotates it so as to align the reference position of a notch or the like of the semiconductor wafer at a desired position. A temporary loading table 59 on which the semiconductor wafer is placed separately is installed under a part placing and aligning the semiconductor wafer.

19. 发明专利

JP2004353048A Plating device, and plating method 有权
标题翻译：镀层装置和镀层方法
公开(公告)号：JP2004353048A
公开(公告)日：2004-12-16
申请号：JP2003153420
申请日：2003-05-29
申请人： Ebara Corp , 株式会社荏原製作所
发明人： SEKIMOTO MASAHIKO , ENDO YASUHIKO , STRAUSSER STEPHEN
IPC分类号： C25D17/00 , C25C7/00 , C25D5/00 , C25D5/08 , C25D7/12 , C25D17/06 , H01L21/288 , H01L21/445
CPC分类号： C25D5/08
摘要： PROBLEM TO BE SOLVED: To provide a compacted plating device by which plating can be performed in a state where the outer circumferential face of a substrate is securely be sealed, and which is particularly suitable in the case of a small amount of product in a small lot, and to provide a plating method.
SOLUTION: The plating device is equipped with: a plating tank 32 in which an opening part 42c is provided at the side face and an anode 46 is arranged at the inside; and a substrate holder 34 holding a substrate W in a state where its surface is exposed so as to seal the outer circumferential part thereof with a seal ring 140 and it is brought into contact with a cathode electrode 142. The opening part 42c of the plating tank 32 is sealed with the substrate holder 34 in a watertight way, a plating liquid introduced into the plating tank 32 is brought into contact with the exposed surface of the substrate W held by the substrate holder 34, and then, plating is performed.
COPYRIGHT: (C)2005,JPO&NCIPI
摘要翻译：要解决的问题：提供一种压实电镀装置，其可以在基板的外周面被牢固地密封的状态下进行电镀，并且特别适合于少量产品的情况在很小的地方，并提供电镀方法。电镀装置配备有：镀槽32，在侧面设有开口部42c，阳极46配置在内侧; 以及基板保持件34，其在表面露出的状态下保持基板W，以密封环140的外周部分，并与阴极电极142接触。镀层的开口部42c 水箱32以水密方式与基板保持件34密封，导入镀槽32的电镀液体与由基板保持件34保持的基板W的露出面接触，然后进行电镀。版权所有（C）2005，JPO＆NCIPI

20. 发明专利

JP2004353004A Plating device 审中-公开
公开(公告)号：JP2004353004A
公开(公告)日：2004-12-16
申请号：JP2003148811
申请日：2003-05-27
申请人： Ebara Corp , 株式会社荏原製作所
发明人： SEKIMOTO MASAHIKO , ENDO YASUHIKO , STRAUSSER STEPHEN
IPC分类号： C25D7/12 , C25D19/00
CPC分类号： H01L2224/1146 , H01L2224/1147 , H01L2924/01078
摘要： PROBLEM TO BE SOLVED: To provide a plating device which can continuously perform treatments including a series of plating processes such as a bump formation process, can attain the saving of a space as the whole of the device, and further which is suitable for production on a scale of a small quantity in a variety of kinds.
SOLUTION: In the plating device, a plating metal is deposited on a prescribed position in the surface of a substrate using a resist to form a plating film. The plating device provided with plating modules 16 performing plating treatment is integrally incorporated with resist peeling modules 18 and etching modules 20 consisting of the independent modules.
COPYRIGHT: (C)2005,JPO&NCIPI

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