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11. 发明授权

US06615098B1 Method and apparatus for controlling a tool using a baseline control script 有权
标题翻译：使用基线控制脚本控制工具的方法和装置
公开(公告)号：US06615098B1
公开(公告)日：2003-09-02
申请号：US09789871
申请日：2001-02-21
申请人： Christopher A. Bode , Alexander J. Pasadyn , Anthony J. Toprac , Joyce S. Oey Hewett , Anastasia Oshelski Peterson , Thomas J. Sonderman , Michael L. Miller
发明人： Christopher A. Bode , Alexander J. Pasadyn , Anthony J. Toprac , Joyce S. Oey Hewett , Anastasia Oshelski Peterson , Thomas J. Sonderman , Michael L. Miller
IPC分类号： G06F1760
CPC分类号： G05B19/41865 , G05B19/0426 , G05B2219/32129 , G05B2219/36225 , G05B2219/45031 , Y02P90/20
摘要： A method for controlling a manufacturing system includes processing workpieces in a plurality of tools; initiating a baseline control script for a selected tool of the plurality of tools; providing context information for the baseline control script; determining a tool type based on the context information; selecting a control routine for the selected tool based on the tool type; and executing the control routine to generate a control action for the selected tool. A manufacturing system includes a plurality of tools adapted to process workpieces, a control execution manager, and a control executor. The control execution manager is adapted to initiate a baseline control script for a selected tool of the plurality of tools and provide context information for the baseline control script. The control executor is adapted to execute the baseline control script, determine a tool type based on the context information, select a control routine for the selected tool based on the tool type, and execute the control routine to generate a control action for the selected tool.
摘要翻译：一种用于控制制造系统的方法包括：处理多个工具中的工件; 为所述多个工具的所选择的工具启动基线控制脚本; 提供基线控制脚本的上下文信息; 基于上下文信息确定工具类型; 根据刀具类型选择所选刀具的控制程序; 以及执行所述控制程序以产生所选择的工具的控制动作。制造系统包括适于处理工件的多个工具，控制执行管理器和控制执行器。所述控制执行管理器适于启动用于所述多个工具的所选工具的基线控制脚本并提供所述基线控制脚本的上下文信息。控制执行器适于执行基线控制脚本，基于上下文信息确定工具类型，基于工具类型选择所选刀具的控制程序，并执行控制程序以生成所选刀具的控制动作。

12. 发明授权

US06589875B1 Method of selectively processing wafer edge regions to increase wafer uniformity, and system for accomplishing same 有权
标题翻译：选择性地处理晶片边缘区域以增加晶片均匀性的方法，以及用于实现晶片边缘区域的系统
公开(公告)号：US06589875B1
公开(公告)日：2003-07-08
申请号：US09920997
申请日：2001-08-02
申请人： Christopher A. Bode , Alexander J. Pasadyn
发明人： Christopher A. Bode , Alexander J. Pasadyn
IPC分类号： H01L21311
CPC分类号： H01L21/31116 , H01L21/31144 , H01L21/32115 , H01L21/32139 , Y10S438/974
摘要： In one illustrative embodiment, the method includes providing a wafer including at least one non-production area, forming a process layer above the wafer, forming a masking layer above the process layer, the masking layer being patterned so as to expose a portion of the process layer formed above the at least one non-production area, and performing a process operation on the exposed portion of the process layer formed above the at least one non-production area. In another aspect, the present invention is directed to a system that includes a controller for identifying at least one non-production area of a wafer, a photolithography tool for forming a masking layer above the process layer, the masking layer being patterned so as to expose a portion of the process layer formed above the at least one non-production area, and an etch tool for performing an etching process on the exposed portion of the process layer formed above the at least one non-production area.
摘要翻译：在一个说明性实施例中，该方法包括提供包括至少一个非生产区域的晶片，在晶片上形成工艺层，在工艺层上方形成掩模层，掩模层被图案化，以暴露部分处理层，形成在至少一个非生产区域上方，并且对形成在至少一个非生产区域上方的处理层的暴露部分进行处理操作。在另一方面，本发明涉及一种系统，其包括用于识别晶片的至少一个非生产区域的控制器，用于在工艺层上方形成掩模层的光刻工具，所述掩模层被图案化，以便暴露形成在所述至少一个非生产区域之上的所述工艺层的一部分，以及蚀刻工具，用于对形成在所述至少一个非生产区域上方的所述工艺层的所述暴露部分进行蚀刻工艺。

13. 发明授权

US06947803B1 Dispatch and/or disposition of material based upon an expected parameter result 失效
标题翻译：根据预期的参数结果调度和/或布置材料
公开(公告)号：US06947803B1
公开(公告)日：2005-09-20
申请号：US10259064
申请日：2002-09-27
申请人： Christopher A. Bode , Alexander J. Pasadyn
发明人： Christopher A. Bode , Alexander J. Pasadyn
IPC分类号： G06F19/00 , H01L21/00
CPC分类号： H01L21/67253
摘要： A method and an apparatus for affecting dispatch and/or disposition of a workpiece. A process step upon a workpiece is performed based upon a predetermined routing plan. An end-of-line parameter is modeled based upon the process performed upon the workpiece. A workpiece routing/disposition process is performed based upon modeling an end-of-line (EOL) parameter. The workpiece routing/disposition process includes using a controller to modify the routing plan.
摘要翻译：一种用于影响工件的调度和/或布置的方法和装置。基于预定的布线计划执行工件上的工艺步骤。根据在工件上执行的过程来对行尾参数进行建模。基于对行尾（EOL）参数的建模来执行工件路线/配置过程。工件路线/处理过程包括使用控制器修改路由计划。

14. 发明授权

US06823231B1 Tuning of a process control based upon layer dependencies 有权
标题翻译：基于层依赖关系调整过程控制
公开(公告)号：US06823231B1
公开(公告)日：2004-11-23
申请号：US10303307
申请日：2002-11-25
申请人： Christopher A. Bode , Alexander J. Pasadyn
发明人： Christopher A. Bode , Alexander J. Pasadyn
IPC分类号： G06F1900
CPC分类号： H01L22/12
摘要： A method and an apparatus for selectively processing a layer of a workpiece based upon dependencies with other layers in the workpiece. A process step upon the workpiece is performed. Metrology data relating to the workpiece is acquired. A process adjustment relating to a first layer on the workpiece is calculated based upon the metrology data. A determination whether an error on a second layer on the workpiece would occur in response to an implementation of the process adjustment performed on the first layer. A magnitude of the calculated process adjustment is reduced in response to a determination that the second layer would be affected in response to the implementation of the process adjustment.
摘要翻译：一种用于基于与工件中的其它层的依赖性选择性地处理工件层的方法和装置。执行工件上的工艺步骤。获取与工件有关的计量数据。基于测量数据计算与工件上的第一层有关的过程调整。响应于在第一层上执行的过程调整的实现，确定在工件上的第二层上是否发生错误。响应于响应于过程调整的实现而影响第二层的确定，所计算的过程调整的大小被减小。

15. 发明授权

US06737208B1 Method and apparatus for controlling photolithography overlay registration incorporating feedforward overlay information 有权
标题翻译：用于控制包含前馈叠加信息的光刻重叠配准的方法和装置
公开(公告)号：US06737208B1
公开(公告)日：2004-05-18
申请号：US10022488
申请日：2001-12-17
申请人： Christopher A. Bode , Alexander J. Pasadyn
发明人： Christopher A. Bode , Alexander J. Pasadyn
IPC分类号： G03F900
CPC分类号： G03F7/70525
摘要： A method for controlling a photolithography process includes forming a first layer on a selected wafer. A first overlay error associated with the first layer is measured. At least one parameter in an operating recipe for performing a photolithography process on a second layer formed on the first wafer is determined based on at least the first overlay error measurement. A processing line includes a photolithography stepper, and overlay metrology tool, and a controller. The photolithography stepper is configured to process wafers in accordance with an operating recipe. The overlay metrology tool is configured to measure overlay errors associated with the processing of the wafers in the photolithography stepper. The controller is configured to receive a first overlay error measurement associated with the formation of a first layer on a selected wafer and determine at least one parameter in the operating recipe for performing a photolithography process on a second layer formed on the selected wafer based on at least the first overlay error measurement
摘要翻译：一种用于控制光刻工艺的方法包括在所选晶片上形成第一层。测量与第一层相关联的第一重叠错误。至少基于第一覆盖误差测量来确定用于在形成在第一晶片上的第二层上进行光刻工艺的操作配方中的至少一个参数。处理线包括光刻步进机，重叠计量工具和控制器。光刻步进器被配置为根据操作配方处理晶片。覆盖计量工具被配置为测量与光刻步进机中的晶片的处理相关联的重叠误差。控制器被配置为接收与所选择的晶片上形成第一层相关联的第一重叠误差测量，并确定操作配方中的至少一个参数，用于在形成于所选择的晶片上的第二层上进行光刻处理最少重叠错误测量

16. 发明授权

US06708075B2 Method and apparatus for utilizing integrated metrology data as feed-forward data 有权
标题翻译：利用综合计量数据作为前馈数据的方法和装置
公开(公告)号：US06708075B2
公开(公告)日：2004-03-16
申请号：US09992447
申请日：2001-11-16
申请人： Thomas J. Sonderman , Alexander J. Pasadyn , Christopher A. Bode
发明人： Thomas J. Sonderman , Alexander J. Pasadyn , Christopher A. Bode
IPC分类号： G06F1900
CPC分类号： H01L22/20 , H01L22/12 , H01L22/26
摘要： A method and an apparatus for performing feed-forward correction during semiconductor wafer manufacturing. A first process on a semiconductor wafer is performed. Integrated metrology data related to the first process of the semiconductor wafer is acquired. An integrated metrology feed-forward process is performed based upon the integrated metrology data, the integrated metrology feed-forward process comprising identifying at least one error on the semiconductor wafer based upon the integrated metrology data related to the first process of the semiconductor wafer and performing an adjustment process to a second process to be performed on the wafer to compensate for the error. The second process on the semiconductor wafer is performed based upon the adjustment process.
摘要翻译：一种用于在半导体晶片制造期间执行前馈校正的方法和装置。执行半导体晶片上的第一工序。获得与半导体晶片的第一工艺有关的集成度量数据。基于综合度量学数据进行综合计量学前馈过程，所述综合度量学前馈过程包括基于与半导体晶片的第一工艺相关的集成测量数据识别半导体晶片上的至少一个误差并执行对在晶片上执行的补偿误差的第二处理的调整处理。基于调整处理进行半导体晶片上的第二工序。

17. 发明授权

US06699727B1 Method for prioritizing production lots based on grade estimates and output requirements 有权
标题翻译：根据年龄估计和产出要求确定生产批次的方法
公开(公告)号：US06699727B1
公开(公告)日：2004-03-02
申请号：US09821675
申请日：2001-03-29
申请人： Anthony J. Toprac , Joyce S. Oey Hewett , Christopher A. Bode , Alexander J. Pasadyn , Anastasia Oshelski Peterson , Thomas J. Sonderman , Michael L. Miller
发明人： Anthony J. Toprac , Joyce S. Oey Hewett , Christopher A. Bode , Alexander J. Pasadyn , Anastasia Oshelski Peterson , Thomas J. Sonderman , Michael L. Miller
IPC分类号： G01R3126
CPC分类号： H01L22/20 , G05B19/418 , G05B2219/32194 , G05B2219/32263 , Y02P90/02 , Y02P90/18 , Y02P90/20 , Y02P90/22
摘要： A method for prioritizing production flow includes processing a plurality of manufactured items in a process flow; measuring characteristics of a plurality of manufactured items in the process flow; estimating performance grades for the plurality of manufactured items based on the measured characteristics; grouping the manufactured items with like estimated performance grades; assigning priorities to groups of manufactured items with like estimated performance grades; and directing the plurality of manufactured items through the process flow based on the assigned priorities. A manufacturing system includes a plurality of processing tools adapted to process a plurality of manufactured items in a process flow, a metrology tool, and a process control server. The metrology tool is adapted to measure characteristics of a plurality of manufactured items in the process flow. The process control server is adapted to estimate performance grades for the plurality of manufactured items based on the measured characteristics, group the manufactured items with like estimated performance grades, assign priorities to groups of manufactured items with like estimated performance grades, and direct the plurality of manufactured items through the process flow based on the assigned priorities.
摘要翻译：一种用于确定生产流程优先级的方法包括在处理流程中处理多个制造的物品; 测量处理流程中的多个制成品的特性; 基于所测量的特性来估计所述多个制造物品的性能等级; 对具有相似估计性能等级的制成品进行分组; 将优先事项分配给具有类似估计绩效等级的制成品组; 以及基于所分配的优先级，通过所述处理流程来引导所述多个制造的物品。制造系统包括多个处理工具，其适用于处理流程中的多个制造物品，计量工具和过程控制服务器。计量工具适于测量处理流程中的多个制造物品的特性。过程控制服务器适于基于测量的特性来估计多个制造物品的性能等级，将具有相似估计性能等级的制造物品分组，将具有相似估计性能等级的制造商品组的优先级分配给多个基于分配的优先级，通过流程流程制造出的物品。

18. 发明授权

US06698009B1 Method and apparatus for modeling of batch dynamics based upon integrated metrology 有权
标题翻译：基于综合计量学的批量动力学建模方法和装置
公开(公告)号：US06698009B1
公开(公告)日：2004-02-24
申请号：US10085938
申请日：2002-02-28
申请人： Alexander J. Pasadyn , Christopher A. Bode
发明人： Alexander J. Pasadyn , Christopher A. Bode
IPC分类号： G06F1750
CPC分类号： H01L22/20 , H01L2223/54453
摘要： A method and an apparatus for performing modeling of batch dynamics in processing of semiconductor wafers. The method includes performing the process on the first semiconductor wafer in a lot, the process being controlled by a tool model, and acquiring integrated metrology data related to the process of the first semiconductor wafer using an integrated metrology tool. The method further includes performing a lot dynamic modeling process based upon an analysis of the integrated metrology data, the lot dynamic modeling process comprising adjusting the tool model based upon analysis of the integrated metrology data, and performing the process on a second semiconductor wafer in the lot based upon the adjusted tool model.
摘要翻译：一种用于在半导体晶片的处理中执行批量动力学建模的方法和装置。该方法包括在第一半导体晶片上进行大量的处理，该工艺由工具模型控制，以及使用集成计量工具获取与第一半导体晶片的工艺相关的集成度量数据。该方法还包括基于综合测量数据的分析来执行大量动态建模过程，批量动态建模过程包括基于集成测量数据的分析来调整工具模型，以及在第二半导体晶片上执行该过程基于调整后的工具模型。

19. 发明授权

US06675058B1 Method and apparatus for controlling the flow of wafers through a process flow 有权
标题翻译：通过工艺流程控制晶片流动的方法和装置
公开(公告)号：US06675058B1
公开(公告)日：2004-01-06
申请号：US09821630
申请日：2001-03-29
申请人： Alexander J. Pasadyn , Anthony J. Toprac , Christopher A. Bode , Joyce S. Oey Hewett , Anastasia Oshelski Peterson , Thomas J. Sonderman , Michael L. Miller
发明人： Alexander J. Pasadyn , Anthony J. Toprac , Christopher A. Bode , Joyce S. Oey Hewett , Anastasia Oshelski Peterson , Thomas J. Sonderman , Michael L. Miller
IPC分类号： G06F1900
CPC分类号： G05B19/41865 , G05B2219/32272 , H01L21/67276 , Y02P90/18 , Y02P90/20 , Y02P90/86
摘要： A method for controlling the flow of wafers through a process flow includes monitoring operating states of a plurality of processing tools adapted to process wafers; measuring a characteristic of a particular incoming wafer; identifying a particular processing tool having an operating state complimentary to the measured characteristic; and routing the particular incoming wafer to the particular processing tool for processing. A manufacturing system includes a plurality of processing tools adapted to process wafers and a process control server. The process control server is adapted to access metrology data related to a characteristic of a particular incoming wafer, identify a particular processing tool having an operating state complimentary to the characteristic, and route the particular incoming wafer to the particular processing tool for processing.
摘要翻译：用于通过工艺流程控制晶片流动的方法包括监测适于处理晶片的多个处理工具的操作状态; 测量特定输入晶片的特性; 识别具有与测量特性相互补充的操作状态的特定加工工具; 并将特定进入的晶片路由到特定的处理工具进行处理。制造系统包括适于处理晶片的多个处理工具和过程控制服务器。过程控制服务器适于访问与特定输入晶片的特性相关的度量数据，识别具有与该特征相互补充的操作状态的特定处理工具，并将特定输入晶片路由到特定处理工具进行处理。

20. 发明授权

US06665623B1 Method and apparatus for optimizing downstream uniformity 失效
标题翻译：优化下游均匀性的方法和装置
公开(公告)号：US06665623B1
公开(公告)日：2003-12-16
申请号：US10209789
申请日：2002-07-31
申请人： Alexander J. Pasadyn , Christopher A. Bode
发明人： Alexander J. Pasadyn , Christopher A. Bode
IPC分类号： G01R3126
CPC分类号： G01R31/2831
摘要： A method includes measuring a characteristic of a workpiece at a plurality of locations. A uniformity profile is generated based on the characteristic measurements. At least one acceptable region of the workpiece is identified based on the uniformity profile. At least one unacceptable region of the workpiece is identified based on the uniformity profile. The uniformity profile is filtered to remove at least a portion of the characteristic measurements associated with the second unacceptable region. At least one parameter of an operating recipe for performing a process on the workpiece is determined based on the filtered uniformity profile.
摘要翻译：一种方法包括在多个位置测量工件的特性。基于特征测量产生均匀性曲线。基于均匀性轮廓识别工件的至少一个可接受区域。基于均匀性轮廓来识别工件的至少一个不可接受的区域。过滤均匀性分布以去除与第二不可接受区域相关联的特征测量的至少一部分。基于滤波的均匀性轮廓来确定用于在工件上执行处理的操作配方的至少一个参数。

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