专利快速检索-快速检索全球专利，免费商用专利数据库-IPRDB

11. 发明授权

US08039385B1 IC devices having TSVS including protruding tips having IMC blocking tip ends 有权
标题翻译：具有TSVS的IC器件包括具有IMC阻塞末端的突出尖端
公开(公告)号：US08039385B1
公开(公告)日：2011-10-18
申请号：US12880629
申请日：2010-09-13
申请人： Jeffrey A. West , Young-Joon Park
发明人： Jeffrey A. West , Young-Joon Park
IPC分类号： H01L21/44 , H01L21/4763
CPC分类号： H01L23/481 , H01L24/05 , H01L24/08 , H01L24/13 , H01L24/16 , H01L24/81 , H01L24/94 , H01L25/0657 , H01L2224/0401 , H01L2224/05009 , H01L2224/05025 , H01L2224/05073 , H01L2224/05082 , H01L2224/05562 , H01L2224/0557 , H01L2224/05573 , H01L2224/05644 , H01L2224/05655 , H01L2224/05664 , H01L2224/06181 , H01L2224/08503 , H01L2224/13025 , H01L2224/13082 , H01L2224/13083 , H01L2224/13144 , H01L2224/13155 , H01L2224/13164 , H01L2224/16145 , H01L2224/16146 , H01L2224/16503 , H01L2224/81193 , H01L2224/81411 , H01L2224/81447 , H01L2224/94 , H01L2225/06513 , H01L2225/06541 , H01L2924/00014 , H01L2924/0002 , H01L2924/01005 , H01L2924/01013 , H01L2924/01024 , H01L2924/01029 , H01L2924/01033 , H01L2924/01042 , H01L2924/01045 , H01L2924/0105 , H01L2924/01073 , H01L2924/01074 , H01L2924/01078 , H01L2924/01079 , H01L2924/01082 , H01L2924/014 , H01L2924/10253 , H01L2924/14 , H01L2924/1461 , H01L2924/00 , H01L2224/05552
摘要： A through substrate via (TSV) die includes a plurality of TSVs including an outer dielectric sleeve and an inner metal core and protruding TSV tips including sidewalls that emerge from the TSV die. A passivation layer lateral to the protruding TSV tips is on a portion of the sidewalls of the protruding TSV tips. The passivation layers is absent from a distal portion of the protruding TSV tips to provide an exposed portion of the inner metal core. The TSV tips include bulbous distal tip ends including a first metal layer including a first metal other than solder and a second metal layer including a second metal other than solder that covers the exposed tip portion. The bulbous distal tip ends cover a portion of the TSV sidewalls and are over a topmost surface of the outer dielectric sleeve, and have a maximum cross sectional area that is ≧25% more as compared to a cross sectional area of the protruding TSV tips below the bulbous distal tip ends.
摘要翻译：贯穿衬底通孔（TSV）管芯包括多个TSV，其包括外部电介质套筒和内部金属芯体，以及突出的TSV端部，其包括从TSV管芯出来的侧壁。突出的TSV尖端侧面的钝化层位于突出的TSV尖端的侧壁的一部分上。钝化层不存在于突出的TSV尖端的远端部分，以提供内金属芯的暴露部分。 TSV尖端包括球茎远端尖端，其包括包括除焊料之外的第一金属的第一金属层和包括除了暴露的尖端部分的焊料以外的第二金属的第二金属层。球茎远侧末端覆盖TSV侧壁的一部分并且在外部电介质套管的最上表面之上，并且与下面突出的TSV尖端的横截面面积相比，具有最大横截面面积比≧25％更大球茎远端尖端。

12. 发明申请

US20080017989A1 Electrically inactive via for electromigration reliability improvement 有权
标题翻译：电气非活动通道，用于电迁移可靠性改进
公开(公告)号：US20080017989A1
公开(公告)日：2008-01-24
申请号：US11491846
申请日：2006-07-24
申请人： Ki-Don Lee , Young-Joon Park , Ennis Takashi Ogawa
发明人： Ki-Don Lee , Young-Joon Park , Ennis Takashi Ogawa
IPC分类号： H01L23/52 , H01L21/4763
CPC分类号： H01L23/522 , H01L23/5226 , H01L23/53295 , H01L2924/0002 , H01L2924/00
摘要： A semiconductor device 300 includes a metal line 304 formed in a first dielectric layer 302. A capping layer 306 is formed the metal line 304. A second dielectric layer 308 is formed over the first dielectric layer 302 and the metal line 304. A first via 310 is formed in the second dielectric layer 308 and in contact with the metal line 304. A second via 312 is formed in the second dielectric layer 308 and in contact with the metal line 304, and is positioned a distance away from the first via 310. An electrically isolated via 326 is formed in the second dielectric layer 308 and in contact with the metal line 304 and in between the first via 310 and the second via 312. A third dielectric layer 314 is formed over the second dielectric layer 308. First and second trenches 316, 318 are formed in the third dielectric layer 314 and in contact with the first via 310 and the second via 312, respectively. An isolated trench 328 is formed in the third dielectric layer and in contact with the isolated via 326. The isolated via 326 mitigates void formation and/or void migration during operation/conduction with electrons traveling from the first trench 316 to the second trench 318 via the metal line 304.
摘要翻译：半导体器件300包括形成在第一电介质层302中的金属线304.覆盖层306形成为金属线304.第二电介质层308形成在第一电介质层302和金属线304上。第一通孔 310形成在第二电介质层308中并与金属线304接触。第二通孔312形成在第二电介质层308中并与金属线304接触，并且与第一通孔310相距一定距离电绝缘通孔326形成在第二电介质层308中并与金属线304接触并且在第一通孔310和第二通孔312之间。第三电介质层314形成在第二介电层308上。首先并且第二沟槽316,318分别形成在第三电介质层314中并与第一通孔310和第二通孔312接触。隔离沟槽328形成在第三电介质层中并且与隔离通孔326接触。隔离通孔326可减少在从第一沟槽316行进到第二沟槽318的电子的操作/传导过程中的空隙形成和/或空隙迁移金属线304。

13. 发明授权

US07215000B2 Selectively encased surface metal structures in a semiconductor device 有权
标题翻译：在半导体器件中选择性地封装表面金属结构
公开(公告)号：US07215000B2
公开(公告)日：2007-05-08
申请号：US10924346
申请日：2004-08-23
申请人： Richard A. Faust , Young-Joon Park
发明人： Richard A. Faust , Young-Joon Park
IPC分类号： H01L29/00 , H01L23/48 , H01L23/52 , H01L29/40
CPC分类号： H01L23/5227 , H01L23/5223 , H01L2924/0002 , H01L2924/00
摘要： The present invention provides, in one embodiment, An integrated circuit device (100). The integrated circuit device (100) comprises a circuit feature (105) located over a semiconductor substrate (110) and an insulating layer (115) located over the circuit feature (105). A protective overcoat (120) is located over the insulating layer (115) and a metal structure (125) is located over the protective overcoat (120). The metal structure (125) is electrically connected to the circuit feature (105) by an interconnect (130). The metal structure (125) is coated with a conductive encasement (135), the conductive encasement (135) terminating at a perimeter (140) of the metal structure (125). Another embodiment of the invention in a method of manufacturing an integrated circuit device (200).
摘要翻译：本发明在一个实施例中提供一种集成电路装置（100）。集成电路器件（100）包括位于半导体衬底（110）之上的电路特征（105）和位于电路特征（105）之上的绝缘层（115）。保护性外涂层（120）位于绝缘层（115）上方，并且金属结构（125）位于保护外涂层（120）上方。金属结构（125）通过互连（130）电连接到电路特征（105）。金属结构（125）涂覆有导电封套（135），导电封套（135）终止于金属结构（125）的周边（140）。在制造集成电路器件（200）的方法中本发明的另一个实施例。

14. 发明申请

US20060015681A1 Apparatus and method for writing and reading data 审中-公开
标题翻译：用于写入和读取数据的装置和方法
公开(公告)号：US20060015681A1
公开(公告)日：2006-01-19
申请号：US11182822
申请日：2005-07-18
申请人： Young-Joon Park
发明人： Young-Joon Park
IPC分类号： G06F12/00
CPC分类号： G06F3/0643 , G06F3/0608 , G06F3/061 , G06F3/0676 , G11B27/329 , G11B2220/20
摘要： Provided is an apparatus and method for writing and reading data. The apparatus for writing and reading data includes an input unit to which data is input, a disc which stores the input data, a disc controller which controls operation of the disc, an output unit which outputs data stored in the disc, and an operation unit which controls operations of the input unit, the disc controller, and the output unit, wherein the disc controller obtains information about an area of the disc in which data can be written, writes data of a file in consecutive positions of the disc using the information about the area of the disc to avoid empty space between files, and reads the data written in the consecutive positions.
摘要翻译：提供了一种用于写入和读取数据的装置和方法。用于写入和读取数据的装置包括输入数据的输入单元，存储输入数据的盘，控制盘的操作的盘控制器，输出存储在盘中的数据的输出单元和操作单元其控制输入单元，盘控制器和输出单元的操作，其中盘控制器获取关于可以写入数据的盘的区域的信息，使用该信息在盘的连续位置写入文件的数据关于光盘的区域，以避免文件之间的空白，并读取连续位置写入的数据。

15. 发明授权

US06251427B1 Pharmaceutical capsule compositions containing loratadine and psuedoephedrine 失效
标题翻译：含有氯雷他定和伪麻黄碱的药物胶囊组合物
公开(公告)号：US06251427B1
公开(公告)日：2001-06-26
申请号：US09507995
申请日：2000-02-22
申请人： Hyun-Soo Kim , Young-Joon Park , Hang-Bum Jo
发明人： Hyun-Soo Kim , Young-Joon Park , Hang-Bum Jo
IPC分类号： A61K948
CPC分类号： A61K9/5084 , A61K9/1635 , A61K9/1652 , A61K9/1676 , A61K9/5015 , A61K9/5026 , A61K9/5047 , A61K9/5078 , A61K31/445 , A61K31/135 , A61K2300/00
摘要： A pharmaceutical capsule composition for oral administration exhibiting controllable, satisfactory release profiles of both loratadine and pseudoephedrine or its salts, which comprises: (a) a plurality of rapid-release pellets (pellets A), each pellet containing (i) a therapeutically effective amount of loratadine, (ii) pseudoephedrine or a pharmaceutically acceptable salt thereof, and (iii) one or more pharmaceutically acceptable excipients; and (b) a plurality of extended-release pellets (pellets B), each pellet containing (i) pseudoephedrine or a pharmaceutically acceptable salt thereof and (ii) one or more pharmaceutically acceptable excipients, which are coated with a water-insoluble polymer in an amount ranging from 2 to 30 wt % and a wet-blocking agent selected from the group consisting of magnesium stearate, talc, fatty acid ester and a mixture thereof in an amount ranging from 2 to 30 wt %, based on the total weight of pellets B.
摘要翻译：一种用于口服给药的药物胶囊组合物，其表现出氯雷他定和伪麻黄碱或其盐的可控，令人满意的释放曲线，其包括：（a）多个快速释放丸粒（丸粒A），每个丸剂包含（i）治疗有效量的氯雷他定，（ii）伪麻黄碱或其药学上可接受的盐，和（iii）一种或多种药学上可接受的赋形剂; 和（b）多个延长释放丸粒（丸粒B），每个丸粒含有（i）伪麻黄碱或其药学上可接受的盐，和（ii）一种或多种药学上可接受的赋形剂，其中涂有水不溶性聚合物 2至30重量％的量和基于总重量的2-30重量％的选自硬脂酸镁，滑石，脂肪酸酯及其混合物的湿阻断剂颗粒B.

16. 发明授权

US10074726B2 Fin semiconductor device including dummy gate on isolation layer 有权
公开(公告)号：US10074726B2
公开(公告)日：2018-09-11
申请号：US14710776
申请日：2015-05-13
申请人： Jung-Gun You , Young-Joon Park , Ji-Yong Ha
发明人： Jung-Gun You , Young-Joon Park , Ji-Yong Ha
IPC分类号： H01L27/088 , H01L29/423 , H01L29/78 , H01L29/06 , H01L29/49 , H01L29/51 , H01L27/02 , H01L21/8234
CPC分类号： H01L29/42376 , H01L21/823431 , H01L21/823437 , H01L21/823456 , H01L21/823821 , H01L27/0207 , H01L27/0886 , H01L29/0649 , H01L29/4916 , H01L29/518 , H01L29/7851
摘要： A semiconductor device and a method of manufacturing a semiconductor device, the device including an active fin protruding from a substrate and extending in a first direction, a first device isolation region disposed at a sidewall of the active fin and extending in a second direction, the second direction crossing the first direction, a normal gate electrode crossing the active fin, a first dummy gate electrode having an undercut portion on the first device isolation region, the first dummy gate electrode extending in the second direction, and a first filler filling the undercut portion on the first device isolation region, wherein the undercut portion is disposed at a lower portion of the first dummy gate electrode.

17. 发明申请

US20140148748A1 Medical Dressing and Method for Making the Same 有权
标题翻译：医疗敷料及其制作方法
公开(公告)号：US20140148748A1
公开(公告)日：2014-05-29
申请号：US14016301
申请日：2013-09-03
申请人： Ji Hye Park , Young Joon Park
发明人： Ji Hye Park
IPC分类号： A61F13/02 , B32B38/00 , B32B37/26
CPC分类号： A61F13/0266 , A61F13/0259 , B32B37/26 , B32B38/0004 , B32B2037/268 , B32B2556/00 , Y10T156/1082
摘要： A medical dressing is used to dress and treat skin wounds such as burns, cuts or traumatic injuries, and a method for making the same. The medical dressing includes an auxiliary release paper which makes it convenient to separate a pressure sensitive adhesive sheet from a release paper and is very easily separated from the pressure sensitive adhesive sheet after application to a wound site, thus improving the convenience of use of the dressing, and prevents the contamination of the pressure sensitive adhesive sheet in the process of either separating the pressure sensitive adhesive sheet from the release paper or separating the auxiliary release paper, thus preventing the secondary bacterial infection of a wound site, and is not exposed to the outside so that the dressing has an improved appearance and is convenient to carry and store.
摘要翻译：使用医用敷料来穿戴和治疗诸如烧伤，切割或创伤性损伤的皮肤伤口及其制造方法。医用敷料包括辅助剥离纸，其可以方便地将剥离纸分离出压敏粘合片，并且在施加到伤口部位之后非常容易地与压敏粘合片分离，从而提高了敷料的使用方便性并且在将压敏粘合片从剥离纸分离或分离辅助剥离纸的过程中防止压敏粘合片的污染，从而防止伤口部位的二次细菌感染，并且不暴露于使敷料外观改善，携带方便。

18. 发明授权

US08663658B2 Revaprazan-containing solid dispersion and process for the preparation thereof 失效
标题翻译：含有雷帕拉唑的固体分散体及其制备方法
公开(公告)号：US08663658B2
公开(公告)日：2014-03-04
申请号：US12520037
申请日：2007-12-21
申请人： Young-Joon Park , Chang-Keun Hyun
发明人： Young-Joon Park , Chang-Keun Hyun
IPC分类号： A61K31/506 , A61K47/48
CPC分类号： A61K9/1635 , A61K9/1617 , A61K9/1623 , A61K9/1652 , A61K31/506
摘要： The present invention provides a solid dispersion in which revaprazan particles are surface-modified with a water-soluble polymer, a water-soluble saccharide, a surfactant, or a mixture thereof and a process for preparing the same. The present invention also provides a pharmaceutical composition containing the solid dispersion and a process for preparing the pharmaceutical composition.
摘要翻译：本发明提供了一种固体分散体，其中雷帕拉坦颗粒用水溶性聚合物，水溶性糖，表面活性剂或其混合物进行表面改性，以及其制备方法。本发明还提供含有固体分散体的药物组合物和制备该药物组合物的方法。

19. 发明授权

US08219953B2 Budgeting electromigration-related reliability among metal paths in the design of a circuit 有权
标题翻译：在电路设计中预算金属通道之间的电迁移相关可靠性
公开(公告)号：US08219953B2
公开(公告)日：2012-07-10
申请号：US12355796
申请日：2009-01-18
申请人： Palkesh Jain , Young-Joon Park , Srikanth Krishnan , Guru Chakrapani Prasad
发明人： Palkesh Jain , Young-Joon Park , Srikanth Krishnan , Guru Chakrapani Prasad
IPC分类号： G06F17/50
CPC分类号： G06F17/5036
摘要： Apportioning unequally contributions of different metal paths of a circuit to electromigration (EM) reliability. In an embodiment, a corresponding parameter value representing a magnitude of excess current flowing in a single direction in each metal path is determined. A desired reliability measure for electromigration (EM) is apportioned among the metal paths based on computed parameter values for the corresponding metal path. A reliability analysis for the circuit is performed based on the apportioning. In an embodiment, metal paths which predominantly carry currents with an average value less than a threshold are excluded from being considered as contributors to EM degradation.
摘要翻译：分配电路的不同金属路径对电迁移（EM）可靠性的不平等贡献。在一个实施例中，确定表示在每个金属路径中沿单个方向流动的过量电流的大小的相应参数值。基于用于相应金属路径的计算参数值，在金属路径中分配用于电迁移（EM）的期望的可靠性度量。基于分配进行电路的可靠性分析。在一个实施例中，主要承载具有小于阈值的平均值的电流的金属路径被排除为被认为是EM降解的贡献者。

20. 发明申请

US20100041688A1 REVAPRAZAN-CONTAINING SOLID DISPERSION AND PROCESS FOR THE PREPARATION THEREOF 失效
标题翻译：含REVAPRAZAN的固体分散体及其制备方法
公开(公告)号：US20100041688A1
公开(公告)日：2010-02-18
申请号：US12520037
申请日：2007-12-21
申请人： Young-Joon Park , Chang-Keun Hyun
发明人： Young-Joon Park , Chang-Keun Hyun
IPC分类号： A61K31/506 , A61K47/48
CPC分类号： A61K9/1635 , A61K9/1617 , A61K9/1623 , A61K9/1652 , A61K31/506
摘要： The present invention provides a solid dispersion in which revaprazan particles are surface-modified with a water-soluble polymer, a water-soluble saccharide, a surfactant, or a mixture thereof and a process for preparing the same. The present invention also provides a pharmaceutical composition containing the solid dispersion and a process for preparing the pharmaceutical composition.
摘要翻译：本发明提供了一种固体分散体，其中雷帕拉坦颗粒用水溶性聚合物，水溶性糖，表面活性剂或其混合物进行表面改性，以及其制备方法。本发明还提供含有固体分散体的药物组合物和制备该药物组合物的方法。

你已经成功收藏专利！

检索式保存成功!

IPRDB

热门服务

关于我们

友情链接

联系方式