会员体验
专利管家(专利管理)
工作空间(专利管理)
风险监控(情报监控)
数据分析(专利分析)
侵权分析(诉讼无效)
联系我们
交流群
官方交流:
QQ群: 891211   
微信请扫码    >>>
现在联系顾问~
热词
    • 11. 发明授权
    • Socket apparatus for IC package testing
    • 用于IC封装测试的插座设备
    • US5482471A
    • 1996-01-09
    • US197437
    • 1994-02-16
    • Ikuo MoriKiyokazu Ikeya
    • Ikuo MoriKiyokazu Ikeya
    • G01R31/26G01R1/04H01L21/66H01L23/32H01R33/76H05K7/10H01R13/15
    • H05K7/1007G01R1/0483H05K7/1084
    • A socket for testing integrated circuit (IC) packages (100) has a lower block (10) with a plurality of contact elements (11) movable between open and closed positions mounted therein, an upper block (20) fixed on the lower bock (10) and formed with a lead insertion hole (21) for the insertion of each lead (101) of the IC package (100), a cover member (30) adapted for vertical, up and down movement relative to the upper block (20), and a spring biased slide block (40) mounted to slidably reciprocate in a recess formed between the upper and lower blocks (10,20) in a direction which crosses, at approximately a right angle, the direction in which a lead (101) of an IC package (100) would be inserted into an opened contact element (11). The slide block (40) has a plurality of apertures (41) for opening and closing contact elements (11) upon movement of the cover member (30) by the use of a contact part opening and closing element (50) converting movement of the cover (30) to sliding action of the slide block (40).
    • 用于测试集成电路(IC)封装(100)的插座具有下块(10),其中多个接触元件(11)可在安装在其中的打开和关闭位置之间移动,固定在下部块上的上块(20) 并且形成有用于插入IC封装(100)的每个引线(101)的引线插入孔(21),适于相对于上部块(20)垂直,上下移动的盖构件(30) )和弹簧偏置滑动块(40),其安装成在形成在所述上部和下部块(10,20)之间的凹部中可滑动地往复运动,所述凹部沿大致直角交叉的方向, )将被插入到打开的接触元件(11)中。 滑动块(40)具有多个孔(41),用于通过使用接触部分打开和关闭元件(50)来转动盖构件(30)的移动来打开和关闭接触元件(11) 盖(30)滑动块(40)的滑动动作。
    • 12. 发明申请
    • SOCKET
    • 插座
    • US20100248518A1
    • 2010-09-30
    • US12734933
    • 2008-11-18
    • Hideyuki TakahashiKiyokazu Ikeya
    • Hideyuki TakahashiKiyokazu Ikeya
    • H01R13/62
    • H01R12/7076H01R12/7082
    • Provided is a socket which protects an upper surface of a semiconductor device from being scratched due to contact, by using a latch plate. A socket (10) includes a base member (20); a cover member (30) which reciprocates in a direction to be close to or separated from the base member (20); a plurality of contacts (40); an adaptor (50), which moves in a direction to be close to or separated from the base member and provides a surface for placing a semiconductor package; a latch member (60) which rotationally shifts with reciprocation of the cover member (30); and a latch plate (70) connected to the latch member (60). The latch plate (70) prevents the leading edge of the latch member (60) from being directly brought into contact with a BGA, and presses down the BGA placed on the adaptor (50) in the vertical direction.
    • 提供了一种通过使用闩锁板来保护半导体器件的上表面由于接触而被划伤的插座。 插座(10)包括基座(20); 覆盖构件(30),其在与所述基座构件(20)接近或分离的方向上往复运动; 多个触点(40); 适配器(50),其沿与所述基座构件接近或分离的方向移动并提供用于放置半导体封装的表面; 与所述盖构件(30)往复运动的卡合构件(60)。 以及连接到所述闩锁构件(60)的闩锁板(70)。 闩锁板(70)防止闩锁构件(60)的前缘直接与BGA接触,并且沿垂直方向按压放置在适配器(50)上的BGA。
    • 13. 发明授权
    • Socket adaptor apparatus
    • 插座适配器
    • US07601008B2
    • 2009-10-13
    • US12136460
    • 2008-06-10
    • Hideyuki TakahashiKiyokazu Ikeya
    • Hideyuki TakahashiKiyokazu Ikeya
    • H01R12/00
    • H01R13/112G01R1/0483H01R12/57H01R13/111H01R13/2421H05K7/1084
    • A socket adaptor 10 made of an electrically insulating material has a main adaptor body 12 on which a plurality of through holes 14 containing an upper opening and a lower opening has been formed. In certain preferred embodiments a probe pin 60 and coil spring 62 is placed in each through hole 14. An electrical engagement clipping part 68 for clipping a contact inserted in a respective through hole from said upper opening is formed on the upper end of each probe pin 60. The coil spring 62 is installed on each probe pin and biases the respective probe pin toward a position so that a tip formed on the lower end of the probe pin protrudes from the lower opening.
    • 由电绝缘材料制成的插座适配器10具有主适配器主体12,其上形成有包含上开口和下开口的多个通孔14。 在某些优选实施例中,探针60和螺旋弹簧62被放置在每个通孔14中。用于夹住从所述上开口插入相应通孔的触点的电接合夹持部分68形成在每个探针的上端 螺旋弹簧62安装在每个探针上,并将相应的探头针偏压到一个位置,使得形成在探针的下端的尖端从下开口突出。
    • 14. 发明授权
    • Socket for removably mounting electronic packages
    • 用于可拆卸地安装电子封装的插座
    • US06666691B2
    • 2003-12-23
    • US10234613
    • 2002-09-04
    • Kiyokazu Ikeya
    • Kiyokazu Ikeya
    • H01R1362
    • H05K7/1069G01R1/0466G01R1/0483
    • A socket (1) has a base (2) on which rows of contact pins 4 are arranged, the contact pins being elastically deformable in the vertical direction, an adaptor (5) having rows of contact holes (5d) arranged extending through a seating surface (5c) and which is capable of vertical movement relative to the base (2) so that contact tips (4a) of contact pins (4) can move in respective contact holes (5d). Latches (21) are arranged to be able to press the IC package on the seating surface (5c) of the adaptor (5) and a vertically movable regulator (7) is arranged at a selected position relative to adaptor (5) when stop surfaces (7e) of the regulator are engaged with a part (4e) of the contact pins (4) so as to regulate the position of the contact tips (4a) in the contact holes (5d).
    • 插座(1)具有基座(2),接触销4排布置在该基座上,接触销可在垂直方向上弹性变形,适配器(5)具有一排接触孔(5d) 表面(5c)并且能够相对于基座(2)垂直移动,使得接触销(4)的接触尖端(4a)能够在相应的接触孔(5d)中移动。 闩锁(21)被布置成能够将适配器(5)的座面(5c)上的IC封装按压,并且当停止表面(5)处于相对于适配器(5)的选定位置时,可升降的调节器 (7e)与接触销(4)的部分(4e)接合,以便调节接触孔(5d)中接触尖端(4a)的位置。
    • 15. 发明授权
    • Socket apparatus for removably mounting electronic packages with improved contacting system
    • 用于可拆卸地安装具有改进的接触系统的电子封装的插座装置
    • US06439897B1
    • 2002-08-27
    • US09999134
    • 2001-11-01
    • Kiyokazu Ikeya
    • Kiyokazu Ikeya
    • H01R1200
    • H05K7/1061G01R1/0466G01R1/0483H01L2224/16225H01L2924/00014H01L2224/0401
    • A socket (1) has a base (10) which forms a recess (10d) for receiving a support member (12). The support member (12) has a recessed surface (12a) for carrying a contact film (14) and has bores for mounting spring contact elements (15). The spring contact elements engage contact members (14b) of contact film (14) from below the film. An adapter (13) has a seat (13b) for a BGA package (2) for exposing solder balls (2a) to contact members (14b) from a location above the film. Socket terminal pins (11b) are electrically connected to spring contact elements (15) through circuit paths (13c) on a pitch expansion substrate (11). A cover (20) and a compression member (30) apply a force to the package.
    • 插座(1)具有形成用于接收支撑构件(12)的凹部(10d)的基座(10)。 支撑构件(12)具有用于承载接触膜(14)的凹入表面(12a),并且具有用于安装弹簧接触元件(15)的孔。 弹簧接触元件从膜下方接触接触膜(14)的接触构件(14b)。 适配器(13)具有用于BGA封装(2)的座(13b),用于从胶片上方的位置将焊球(2a)暴露于接触构件(14b)。 插座端子引脚(11b)通过间距扩展基板(11)上的电路路径(13c)电连接到弹簧接触元件(15)。 盖(20)和压缩构件(30)对包装施加力。
    • 16. 发明授权
    • Electrical socket apparatus
    • 电插座设备
    • US06322384B1
    • 2001-11-27
    • US09706379
    • 2000-11-03
    • Kiyokazu Ikeya
    • Kiyokazu Ikeya
    • H01R1362
    • H01R12/88
    • A socket (10) includes an adaptor (28) which has a seating surface (28b) for an IC (100) and which has a plurality of contact member receiving holes (28d) in the seating surface. The tips (14c) of a plurality of contact members (14) are received through the contact member receiving holes (28d) of the adaptor, with contact established with each respective terminal (101) of the IC (100) that has been placed on the seating surface. The IC on the seating surface is held by means of rotary latches (22). The latches (22) have an opened position for placement of the IC on the seating surface of the adaptor and a closed position for holding the IC from above it, rotating about a shaft (32) fixed to the base. A cover (20) is movable between first and second positions and a links (24) connected to the cover (24) open the latches when the cover is at a first position and close the latches when the cover is at a second position.
    • 插座(10)包括适配器(28),适配器(28)具有用于IC(100)的就座表面(28b),并且在座面中具有多个接触构件接收孔(28d)。 多个接触构件(14)的尖端(14c)通过适配器的接触构件接收孔(28d)被接收,与已被放置在IC(100)上的每个相应端子(101)建立接触 座位面。 座位表面上的IC通过旋转闩锁(22)保持。 闩锁(22)具有用于将IC放置在适配器的就座表面上的打开位置和用于将IC从其上方保持的关闭位置,围绕固定到基座的轴(32)旋转。 盖(20)可在第一位置和第二位置之间移动,并且当盖处于第一位置时连接到盖(24)的连杆(24)打开闩锁,并且当盖处于第二位置时闭合闩锁。
    • 17. 发明授权
    • Socket
    • 插座
    • US5816828A
    • 1998-10-06
    • US780305
    • 1997-01-08
    • Kiyokazu IkeyaShinji Tsuboi
    • Kiyokazu IkeyaShinji Tsuboi
    • H01R33/76H05K1/14H05K3/32H05K3/36H05K7/10H01R9/09
    • H05K7/1023H05K1/141H05K3/325H05K3/361
    • A socket (2, 52) for attachment to a printed substrate (10, 60), has a central aperture therethrough. A connective part (3, 53) including a flexible insulative sheet (8, 58) is provided to cover the aperture and act as an electrically connective interface between an electrical part (31, 81) mounted in the socket and the printed substrate. The flexible sheet (8, 58) has a first contact means (5, 55) associated with a first surface of the flexible sheet for electrically connecting with leads (32, 82) of the electrical part and a second contact means (6, 56) associated with a second surface of the flexible sheet for electrically connecting with the printed substrate. An electroconductive member (7, 57) provides electrical connection between the first and second contact means. Such a socket is especially useful for testing electrical parts with high clock speeds and a large number of leads.
    • 用于附接到印刷基板(10,60)的插座(2,52)具有穿过其的中心孔。 提供包括柔性绝缘片(8,58)的连接部分(3,53)以覆盖该孔并用作安装在插座中的电气部件(31,81)和印刷基板之间的电连接接口。 柔性片材(8,58)具有与柔性片材的第一表面相关联的第一接触装置(5,55),用于电连接电气部件的引线(32,82)和第二接触装置(6,56 )与柔性片的第二表面相关联,用于与印刷的基底电连接。 导电构件(7,57)提供第一和第二接触装置之间的电连接。 这种插座对于测试具有高时钟速度和大量引线的电气部件特别有用。