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11. 发明申请

US20090161314A1 HEAT DISSIPATION DEVICE HAVING A FAN HOLDER FOR ATTACHMENT OF A FAN 有权
标题翻译：具有风扇附件的散热装置的散热装置
公开(公告)号：US20090161314A1
公开(公告)日：2009-06-25
申请号：US11961375
申请日：2007-12-20
申请人： JIN-BIAO LIU
发明人： JIN-BIAO LIU
IPC分类号： H05K7/20
CPC分类号： H01L23/467 , H01L23/4093 , H01L23/427 , H01L2924/0002 , H01L2924/00
摘要： A heat dissipation device includes a heat sink, a fan and a fan holder locking the fan on the heat sink. The heat sink defines two slots in two opposite lateral sides thereof. The fan holder includes two opposite first beams and another two opposite second beams. Each of the first beams has a latching leg extending downwardly therefrom and two locking tabs extending upwardly therefrom. The two latching legs are engaged into the two slots of the heat sink. The locking tabs are fastened to two lateral sides of the fan.
摘要翻译：散热装置包括散热器，风扇和将风扇锁定在散热器上的风扇架。散热片在其两个相对的侧面限定了两个槽。风扇架包括两个相对的第一梁和另外两个相对的第二梁。每个第一梁具有从其向下延伸的闩锁腿和从其向上延伸的两个锁定突舌。两个锁定腿接合到散热器的两个槽中。锁定片固定在风扇的两侧。

12. 发明授权

US07447035B2 Heat dissipation device assembly 失效
标题翻译：散热装置总成
公开(公告)号：US07447035B2
公开(公告)日：2008-11-04
申请号：US11566015
申请日：2006-12-01
申请人： Jin-Biao Liu , Guang Yu , Shih-Hsun Wung , Chun-Chi Chen
发明人： Jin-Biao Liu , Guang Yu , Shih-Hsun Wung , Chun-Chi Chen
IPC分类号： H05K7/20 , F28F7/00 , H01L23/34
CPC分类号： H01L23/4006 , H01L23/3672 , H01L23/427 , H01L2023/4056 , H01L2023/4081 , H01L2924/0002 , H01L2924/00
摘要： A heat dissipation device assembly is mounted on a printed circuit board (80). First and second electronic components (82, 84) are mounted on the printed circuit board. The heat dissipation device assembly includes a first heat sink (10) in thermal contact with the first electronic component, and a second heat sink (20) in thermal contact with the second electronic component. A spring tab (24) is sandwiched between the first and second heat sinks for providing spring force between the first and second heat sinks thus securely mounting the second heat sink on the second electronic component.
摘要翻译：散热装置组件安装在印刷电路板（80）上。第一和第二电子部件（82,84）安装在印刷电路板上。散热装置组件包括与第一电子部件热接触的第一散热器（10）和与第二电子部件热接触的第二散热器（20）。在第一和第二散热器之间夹有弹簧片（24），以在第一和第二散热器之间提供弹簧力，从而将第二散热器牢固地安装在第二电子部件上。

13. 发明授权

US07414841B2 Electronic cooling system having a ventilating duct 失效
标题翻译：具有通风管的电子冷却系统
公开(公告)号：US07414841B2
公开(公告)日：2008-08-19
申请号：US11307011
申请日：2006-01-19
申请人： Chun-Chi Chen , Shih-Hsun Wung , Guang Yu , Da-Yuan Zhou , Jin-Biao Liu
发明人： Chun-Chi Chen , Shih-Hsun Wung , Guang Yu , Da-Yuan Zhou , Jin-Biao Liu
IPC分类号： H05K7/20 , H05K5/00 , F28D15/00
CPC分类号： G06F1/20 , H01L23/427 , H01L23/467 , H01L2924/0002 , H01L2924/00
摘要： A heat dissipation device in a computer enclosure includes a heat spreader (20) mounted on a CPU (12), a first heat sink (30), a cooling fan (40) coupled to the first heat sink, a second heat sink (50), a heat pipe (80) mounted on the heat spreader and thermally connected the first heat sink and the second heat sink, a system fan (60) attached to the second heat sink, and a fan duct (70) interconnected between the cooling fan and the second heat sink. The system fan is positioned adjacent to louvers of the computer enclosure. An airflow generated by the cooling fan and the system fan flows through the first heat sink, then the fan duct, the second heat sink, and finally the louvers to leave the computer enclosure.
摘要翻译：计算机外壳中的散热装置包括安装在CPU（12）上的散热器（20），第一散热器（30），耦合到第一散热器的冷却风扇（40），第二散热器（50）），安装在所述散热器上并热连接所述第一散热器和所述第二散热器的热管（80），附接到所述第二散热器的系统风扇（60）和在所述冷却风扇和第二个散热器。系统风扇位于计算机外壳的百叶窗附近。由冷却风扇和系统风扇产生的气流流过第一散热器，然后流过风扇导管，第二散热器，最后通风百叶窗离开电脑外壳。

14. 发明申请

US20070247819A1 MEMORY MODULE ASSEMBLY INCLUDING HEAT DISSIPATING MEMBERS 审中-公开
标题翻译：存储模块组件，其中包括热消耗器件
公开(公告)号：US20070247819A1
公开(公告)日：2007-10-25
申请号：US11308701
申请日：2006-04-24
申请人： CHUN-CHI CHEN , SHIH-HSUN WUNG , GUANG YU , DA-YUAN ZHOU , JIN-BIAO LIU
发明人： CHUN-CHI CHEN , SHIH-HSUN WUNG , GUANG YU , DA-YUAN ZHOU , JIN-BIAO LIU
IPC分类号： H05K7/00
CPC分类号： H01L23/4093 , H01L2924/0002 , H01L2924/00
摘要： A memory module assembly includes a memory card having a circuit board and a plurality of electronic components mounted on the circuit board. A pair of shells covers two faces of the memory card for dissipating heat generated by the electronic components of the memory card. A pair of clips each clamps the pair of shells and memory card. Each of the pair of clips has a pair of abutting pieces being pivotably connected together and resilient pressing the pair of shells toward the electronic components of the memory card. The abutting pieces of the pair of clips are detachably engaged with the pair of shells, and form protrusions thereon engaging in indentations defined in the shells.
摘要翻译：存储器模块组件包括具有电路板和安装在电路板上的多个电子部件的存储卡。一对外壳覆盖存储卡的两个面，用于散发由存储卡的电子部件产生的热量。一对夹子夹住一对壳和存储卡。一对夹具中的每一个具有一对可枢转地连接在一起的邻接件，并且弹性地将该对外壳按压到存储卡的电子部件。一对夹子的抵接件可拆卸地与该对外壳接合，并在其上形成突起，其上形成有限定在壳中的凹陷。

15. 发明申请

US20060273137A1 HEAT DISSIPATION DEVICE WITH HEAT PIPES 失效
标题翻译：带热管的散热装置
公开(公告)号：US20060273137A1
公开(公告)日：2006-12-07
申请号：US11308383
申请日：2006-03-20
申请人： Chun-Chi Chen , Shih-Hsun Wung , Guang Yu , Da-Yuan Zhou , Jin-Biao Liu
发明人： Chun-Chi Chen , Shih-Hsun Wung , Guang Yu , Da-Yuan Zhou , Jin-Biao Liu
IPC分类号： A47J36/02
CPC分类号： H01L23/4006 , H01L23/427 , H01L2023/4056 , H01L2023/4081 , H01L2924/0002 , H01L2924/00
摘要： A heat dissipation device comprises a seat for absorbing heat from a heat generating device. At least a heat pipe has a first section thereof thermally combined to the seat, and two second sections thereof extending from the first section and remotely from the seat. Pluralities of heat sinks are located on the seat. Each of the pluralities of heat sinks has a base and a plurality of fins integrally extending from the base and is made of aluminum extrusion. The bases of the heat sinks thermally sandwich the two second sections of the at least a heat pipe therebetween. At least one of the bases of the heat sinks is angled or perpendicular to the seat.
摘要翻译：散热装置包括用于从发热装置吸收热量的座。至少一个热管具有与座椅热结合的第一部分，并且其第二部分从第一部分延伸并远离座椅。多个散热片位于座椅上。多个散热器中的每一个具有基部和从基部一体地延伸并由铝挤压制成的多个翅片。散热器的基部将其中的至少一个热管的两个第二部分热夹心。散热器的至少一个基座成角度或垂直于座椅。

16. 发明申请

US20100053906A1 HEAT DISSIPATION DEVICE 有权
标题翻译：散热装置
公开(公告)号：US20100053906A1
公开(公告)日：2010-03-04
申请号：US12392082
申请日：2009-02-24
申请人： Jin-Biao Liu
发明人： Jin-Biao Liu
IPC分类号： H05K7/20
CPC分类号： H01L23/4006 , F28F3/06 , H01L2924/0002 , H01L2924/00
摘要： A heat dissipation device for dissipating heat generated by an electronic device on a printed circuit board includes a heat sink and a plurality of mounting devices. A plurality of retaining pillars are secured on the printed circuit board at positions around the electronic device. Each of the mounting devices includes a fixing portion connecting with the heat sink, a mounting portion extending from the fixing portion and a locating portion extending from the mounting portion to a position below the mounting portion. The retaining pillars on the printed circuit board extend through the locating portions and abut against bottoms of the mounting portions to accurately position the heat dissipation device on the electronic device on the circuit board before fasteners are brought to extend through the mounting portions to screw in the retaining pillars.
摘要翻译：用于散发印刷电路板上的电子装置产生的热量的散热装置包括散热器和多个安装装置。多个保持柱在电子设备周围的位置固定在印刷电路板上。每个安装装置包括与散热器连接的固定部分，从固定部分延伸的安装部分和从安装部分延伸到安装部分下方的定位部分。印刷电路板上的保持柱延伸穿过定位部分并抵靠安装部分的底部，以在将紧固件延伸穿过安装部分之前将散热装置精确地定位在电路板上的电子装置上，以将其拧入留柱。

17. 发明申请

US20100053904A1 LOCKING DEVICE FOR HEAT SINK 失效
标题翻译：用于散热的锁定装置
公开(公告)号：US20100053904A1
公开(公告)日：2010-03-04
申请号：US12202391
申请日：2008-09-01
申请人： CHUN-CHI CHEN , HONG-CHENG YANG , JIN-BIAO LIU , HE-PING LIU
发明人： CHUN-CHI CHEN , HONG-CHENG YANG , JIN-BIAO LIU , HE-PING LIU
IPC分类号： H05K7/20 , H01R4/28
CPC分类号： H01L23/4093 , H01L23/3672 , H01L2924/0002 , H01L2924/00
摘要： A locking device is used for securing a heat sink to an electronic device mounted on a first face of a printed circuit board which defines a first hole. The heat sink defines a second hole therein. The locking device has a fastener including a head portion located aside the heat sink, a foot portion located aside a second face of the printed circuit board, and a body portion extending through the holes of the heat sink and the printed circuit board and interconnecting the head portion and the foot portion. The foot portion includes a buckling part abutting against the second face of the printed circuit board, and a positioning part extending toward the head portion to a position above the buckling part. When the buckling part abuts against the printed circuit board, the positioning part has a portion thereof entering into the first hole.
摘要翻译：锁定装置用于将散热器固定到安装在限定第一孔的印刷电路板的第一面上的电子装置上。散热器在其中限定了第二个孔。锁定装置具有紧固件，该紧固件包括位于散热器的头部的部分，位于印刷电路板的第二面的脚部以及延伸穿过散热器和印刷电路板的孔的主体部分，头部和脚部。脚部包括抵靠印刷电路板的第二面的弯曲部，以及朝向头部延伸到屈曲部上方的位置的定位部。当屈曲部分抵靠印刷电路板时，定位部分的一部分进入第一孔。

18. 发明申请

US20090165999A1 HEAT SINK 审中-公开
标题翻译：散热器
公开(公告)号：US20090165999A1
公开(公告)日：2009-07-02
申请号：US11964917
申请日：2007-12-27
申请人： JIN-BIAO LIU
发明人： JIN-BIAO LIU
IPC分类号： F28F7/00
CPC分类号： H01L23/3672 , H01L2924/0002 , H01L2924/00
摘要： A heat sink includes a plurality of fins. Each of fins includes a body having two locking members at a top portion and a lower portion thereof respectively. Each of the locking members includes two parallel clasping plates. The two clasping plates of one of the fins clasp the main body of another fin adjacent said one fin, thereby interlocking the fins together.
摘要翻译：散热器包括多个翅片。每个翅片包括分别在其顶部和下部具有两个锁定构件的主体。每个锁定构件包括两个平行的夹紧板。其中一个翅片的两个扣板夹住与所述一个翅片相邻的另一个翅片的主体，从而将翅片互锁在一起。

19. 发明申请

US20070263363A1 FIXING APPARATUS FOR HEAT SINK 审中-公开
标题翻译：固定装置用于散热
公开(公告)号：US20070263363A1
公开(公告)日：2007-11-15
申请号：US11561324
申请日：2006-11-17
申请人： JIN-BIAO LIU , SHIH-HSUN WUNG , GUANG YU , CHUN-CHI CHEN
发明人： JIN-BIAO LIU , SHIH-HSUN WUNG , GUANG YU , CHUN-CHI CHEN
IPC分类号： H05K7/20
CPC分类号： H01L23/4093 , H01L2924/0002 , H01L2924/00
摘要： A fixing apparatus adapted for attaching a heat sink to a circuit board on which an electronic component is mounted includes a fastener and a back plate. The fastener comprises an elongated pressing part holding the heat sink in contact with the electronic component and two latching legs extending downward from two opposite ends of the pressing part. The latching legs each have at least one hook extending inward from a distal end thereof. The back plate comprises a main body and a plurality of connecting members at two opposite ends of the main body for extending upwardly through the circuit board to engage with the hooks of the fastener.
摘要翻译：适于将散热器附接到其上安装电子部件的电路板的定影装置包括紧固件和背板。紧固件包括将散热器保持与电子部件接触的细长按压部分和从按压部分的两个相对端向下延伸的两个闩锁腿。所述闩锁腿各自具有从其远端向内延伸的至少一个钩。背板包括主体和在主体的两个相对端处的多个连接构件，用于向上延伸穿过电路板以与紧固件的钩接合。

20. 发明申请

US20070215335A1 HEAT SINK 审中-公开
标题翻译：散热器
公开(公告)号：US20070215335A1
公开(公告)日：2007-09-20
申请号：US11308239
申请日：2006-03-14
申请人： Chun-Chi Chen , Shih-Hsun Wung , Guang Yu , Da-Yuan Zhou , Jin-Biao Liu
发明人： Chun-Chi Chen , Shih-Hsun Wung , Guang Yu , Da-Yuan Zhou , Jin-Biao Liu
IPC分类号： H05K7/20
CPC分类号： H01L23/4093 , H01L23/3677 , H01L2924/0002 , H01L2924/00
摘要： A heat sink includes a base and a plurality of column-shaped fins. The base defines an array of blind holes therein. The fins threadedly engage in the base at the blind holes by self-tapping so that the fins are interferentially and intimately engaged with the base. The fins each include a head for facilitating to turn the fins, a terminated cone received in the blind holes and a spiral thread between the head and the terminated cone.
摘要翻译：散热器包括基部和多个柱状翅片。基座中限定了盲孔阵列。翅片通过自攻螺纹地接合在盲孔处的底座中，使得翼片与底座相互紧密地接合。翅片各自包括用于便于转动翅片的头部，容纳在盲孔中的端接锥体和头部与终止锥体之间的螺旋线。

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