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    • 12. 发明授权
    • Multi-wavelength laser diode
    • 多波长激光二极管
    • US07317745B2
    • 2008-01-08
    • US10998921
    • 2004-11-30
    • Tae Sung JangHee Seok ChoiSang Deog ChoDong Min Jeon
    • Tae Sung JangHee Seok ChoiSang Deog ChoDong Min Jeon
    • H01S5/00H01S3/08
    • H01S5/10H01S3/08086H01S5/028H01S5/20
    • The present invention relates to a multi-wavelength laser diode, in which an oscillating structure includes a semiconductor substrate, and a lower cladding layer, an active layer and a ridge formed in their order on the semiconductor substrate. A first metal layer is formed on a first face of the oscillating structure including one end of the ridge, and made of a metal having a high reflectivity in a first wavelength range of at least a predetermined wavelength. A second metal layer is formed on the first metal layer, the second metal layer being made of a metal having a high reflectivity in a second wavelength range under the predetermined wavelength. The multi-wavelength laser diode can improve-the reflective layer structure to achieve a high reflectivity in the entire visible light range.
    • 本发明涉及一种多波长激光二极管,其中振荡结构包括半导体衬底,以及在半导体衬底上依次形成的下包层,有源层和脊。 第一金属层形成在包括脊的一端的振荡结构的第一面上,并且由在至少预定波长的第一波长范围内具有高反射率的金属制成。 第二金属层形成在第一金属层上,第二金属层由在预定波长的第二波长范围内具有高反射率的金属制成。 多波长激光二极管可以改善反射层结构,以在整个可见光范围内实现高反射率。
    • 13. 发明授权
    • Nitride semiconductor light emitting device and method of manufacturing the same
    • 氮化物半导体发光器件及其制造方法
    • US07012284B2
    • 2006-03-14
    • US10837780
    • 2004-05-04
    • Seok Beom ChoiBang Won OhHee Seok Choi
    • Seok Beom ChoiBang Won OhHee Seok Choi
    • H01L33/00
    • H01L33/32H01L33/025
    • Disclosed herein is a nitride semiconductor light emitting device. The nitride semiconductor light emitting device comprises an n-type nitride semiconductor layer on a substrate, an active layer formed on the n-type nitride semiconductor layer so that a portion of the n-type nitride semiconductor layer is exposed, a p-type nitride semiconductor layer formed on the active layer, a high-concentration dopant area on the p-type nitride semiconductor layer, a counter doping area on the high-concentration dopant areas, an n-side electrode formed on an exposed portion of the n-type nitride semiconductor layer, and a p-side electrode formed on the counter doping area. A satisfactory ohmic contact for the p-side electrode is provided by an ion implantation process and heat treatment.
    • 这里公开了一种氮化物半导体发光器件。 氮化物半导体发光器件包括在衬底上的n型氮化物半导体层,形成在n型氮化物半导体层上的有源层,以使n型氮化物半导体层的一部分露出,p型氮化物 形成在有源层上的半导体层,p型氮化物半导体层上的高浓度掺杂剂区域,高浓度掺杂剂区域上的相对掺杂区域,形成在n型氮化物半导体层的暴露部分上的n侧电极 氮化物半导体层和形成在反掺杂区域上的p侧电极。 通过离子注入工艺和热处理提供了用于p侧电极的令人满意的欧姆接触。
    • 19. 发明申请
    • Method of manufacturing a vertically-structured GaN-based light emitting diode
    • 制造垂直结构的GaN基发光二极管的方法
    • US20070290225A1
    • 2007-12-20
    • US11892445
    • 2007-08-23
    • Jae Hoon LeeHee Seok ChoiJeong Tak OhSu Yeol Lee
    • Jae Hoon LeeHee Seok ChoiJeong Tak OhSu Yeol Lee
    • H01L33/00
    • H01L33/20H01L33/0079H01L33/22H01L2933/0083
    • The present invention relates to a method of manufacturing a vertically-structured GaN-based light emitting diode. The method of manufacturing a vertically-structured GaN-based light emitting diode includes forming a GaN layer on a substrate; patterning the compound layer in a predetermined shape; forming an n-type GaN layer on the patterned compound layer through the epitaxial lateral over-growth process and sequentially forming an active layer and a p-type GaN layer on the n-type GaN layer; forming a structure supporting layer on the p-type GaN layer; sequentially removing the substrate and the GaN layer formed on the substrate after forming the structure supporting layer; removing the patterned compound layer exposed after removing the GaN layer so as to form an n-type GaN layer patterned in a concave shape; and forming an n-type electrode on the n-type GaN layer patterned in a concave shape.
    • 本发明涉及一种垂直构造的GaN基发光二极管的制造方法。 制造垂直结构的GaN基发光二极管的方法包括在衬底上形成GaN层; 将化合物层图案化成预定的形状; 通过外延横向过度生长工艺在图案化的化合物层上形成n型GaN层,并在n型GaN层上依次形成有源层和p型GaN层; 在p型GaN层上形成结构支撑层; 在形成结构支撑层之后,依次去除衬底和形成在衬底上的GaN层; 去除在去除GaN层之后暴露的图案化合物层,以形成图案化为凹形的n型GaN层; 在形成凹形的n型GaN层上形成n型电极。