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11. 发明授权

US08240185B2 Method for manufacturing cover of electronic device and cover obtained thereby 失效
标题翻译：制造电子装置盖的方法和由此得到的盖
公开(公告)号：US08240185B2
公开(公告)日：2012-08-14
申请号：US12495685
申请日：2009-06-30
申请人： Feng Jin , Gen-Ping Deng , Chun-Chi Chen
发明人： Feng Jin , Gen-Ping Deng , Chun-Chi Chen
IPC分类号： B21D41/00 , B23D23/00
CPC分类号： B21D19/08 , Y10T29/49828
摘要： A method for manufacturing a cover of an electronic device includes steps of offering a metallic green piece comprising a top plate, a bottom plate and a connecting plate interconnecting a side of the top and bottom plates; offering a profile molding insert and a lower mold, the profile molding insert forming a shaping surface, the lower mold defining a cavity to receive an end of the green piece; putting the profile molding insert in the green piece, the shaping surface of the profiling molding insert being oriented towards the end of the green piece; inserting the end of the green piece in the cavity of the lower mold and punching the lower mold to enable the top and bottom plates at the end of the green piece bent along the shaping surface of the profile molding insert toward each other.
摘要翻译：一种用于制造电子设备的盖的方法，包括提供金属绿色部件的步骤，所述金属生片包括顶板，底板和互连顶板和底板侧的连接板; 提供型材成型插入件和下模具，所述型材成形插入件形成成形表面，所述下模具限定用于接收所述生坯件的端部的空腔; 将型材成型插入件放入绿色件中，成型模制插入件的成形表面朝着绿色件的端部定向; 将生坯件的端部插入下模具的腔体中并冲压下模具，使得在成型件的端部处的顶板和底板沿着型材成型件的成形表面彼此朝向彼此弯曲。

12. 发明申请

US20120145374A1 HEAT SINK 审中-公开
标题翻译：散热器
公开(公告)号：US20120145374A1
公开(公告)日：2012-06-14
申请号：US12979316
申请日：2010-12-27
申请人： CHUN-CHI CHEN , JIAN LIU , JING ZHANG
发明人： CHUN-CHI CHEN , JIAN LIU , JING ZHANG
IPC分类号： F28F7/00
CPC分类号： H01L23/3672 , H01L21/4882 , H01L2924/0002 , H01L2924/00
摘要： An exemplary heat sink includes a base plate and a fin unit including a plurality of fins arranged on the base plate. One of the base plate and fin unit includes a protruding member, and the other one of the base plate and the fin unit defines a groove corresponding to the protruding member. The protruding member is interferingly fitted in the groove thereby connecting the fin unit and the base plate together.
摘要翻译：示例性散热器包括基板和散热片单元，其包括布置在基板上的多个散热片。基板和翅片单元之一包括突出构件，底板和翅片单元中的另一个限定与突出构件相对应的凹槽。突出部件被干涉地装配在槽中，从而将翅片单元和基板连接在一起。

13. 发明授权

US08004843B2 Heat dissipation device 有权
标题翻译：散热装置
公开(公告)号：US08004843B2
公开(公告)日：2011-08-23
申请号：US12565712
申请日：2009-09-23
申请人： Chun-Chi Chen , Shi-Wen Zhou , Guo Chen
发明人： Chun-Chi Chen , Shi-Wen Zhou , Guo Chen
IPC分类号： H05K7/20
CPC分类号： H01L23/3672 , H01L23/467 , H01L2924/0002 , H01L2924/00
摘要： A heat dissipation device is provided for dissipating heat generated by a plurality of electronic components mounted on a printed circuit board and having different heights. The heat dissipation device includes a connecting member and a first base mounted on the connecting member and located at above one of the electronic components. A number of joining members extend through the printed circuit board and engage with the first base to assemble the first base on the one of the electronic components on the printed circuit board. A distance between the first base and the one of the electronic components is adjustable by adjusting the joining members to make the first base intimately contact with the one of the electronic components.
摘要翻译：散热装置用于散发由安装在印刷电路板上并具有不同高度的多个电子部件产生的热量。散热装置包括连接构件和安装在连接构件上并位于上述一个电子部件上的第一基座。多个连接构件延伸穿过印刷电路板并与第一基座接合以在印刷电路板上的电子部件之一上组装第一基座。第一基座和电子部件之间的距离可通过调节连接部件来调节，以使第一基座与电子部件之一紧密接触。

14. 发明申请

US20110155351A1 HEAT DISSIPATION DEVICE WITH HEAT PIPE 失效
标题翻译：热管散热装置
公开(公告)号：US20110155351A1
公开(公告)日：2011-06-30
申请号：US12902170
申请日：2010-10-12
申请人： WEI LI , YI-QIANG WU , CHUN-CHI CHEN
发明人： WEI LI , YI-QIANG WU , CHUN-CHI CHEN
IPC分类号： F28D15/04
CPC分类号： F28D15/0275 , F28F1/32 , F28F2215/00 , F28F2265/00 , F28F2275/06 , H01L23/3672 , H01L23/427 , H01L23/467 , H01L2924/0002 , H01L2924/00
摘要： An exemplary heat dissipation device includes a fin assembly, a heat pipe, and a protective member. The fin assembly includes stacked fins and air passages between fins. Each fin includes a main body, an extending hole defined in the main body, and a flange extending from the main body around the extending hole. The heat pipe is received in the extending holes of the fins and abuts the flanges of the fins. The protective member includes a plurality pairs of elastic arms. Each pair of elastic arms is sandwiched between a free end of the flange of a corresponding fin and the main body of a corresponding adjacent fin to prevent solder associated with the heat pipe from flowing into the corresponding air passage.
摘要翻译：示例性的散热装置包括翅片组件，热管和保护构件。翅片组件包括翅片之间的堆叠翅片和空气通道。每个翅片包括主体，限定在主体中的延伸孔以及从主体围绕延伸孔延伸的凸缘。热管被容纳在散热片的延伸孔中，并与翅片的凸缘相接触。保护构件包括多对弹性臂。每对弹性臂被夹在对应的翅片的凸缘的自由端和相应的相邻的翅片的主体之间，以防止与热管相关联的焊料流入相应的空气通道。

15. 发明授权

US07914152B2 Portable projector using an LED and related heat dissipation system 失效
标题翻译：便携式投影机采用LED和相关散热系统
公开(公告)号：US07914152B2
公开(公告)日：2011-03-29
申请号：US12024955
申请日：2008-02-01
申请人： Xu Li , Gen-Ping Deng , Chun-Chi Chen
发明人： Xu Li , Gen-Ping Deng , Chun-Chi Chen
IPC分类号： G03B21/16
CPC分类号： G03B21/16 , G03B21/20 , G03B21/2033
摘要： A portable projector with a heat dissipation system, includes a housing and two LED light sources located in the housing. Each of the LED light sources includes a circuit aboard, an LED device mounted on the circuit aboard and a heat pipe. The heat pipe has an evaporating section thermally contacting the circuit board, and a condensing section. A fin set thermally contacts with the condensing section of the heat pipe for dissipating heat therefrom. The fin set of one LED light source is located behind the evaporating section of the heat pipe of the other light source and closely adjacent to a wall of the housing.
摘要翻译：具有散热系统的便携式投影仪包括壳体和位于壳体中的两个LED光源。每个LED光源包括一个电路，一个安装在电路上的LED装置和一个热管。热管具有与电路板热接触的蒸发部分和冷凝部分。翅片组与热管的冷凝部分热接触以从其中散热。一个LED光源的翅片组位于另一光源的热管的蒸发部分的后面，并且紧邻壳体的壁。

16. 发明授权

US07898809B2 Heat sink and method of manufacturing the same 有权
标题翻译：散热器及其制造方法
公开(公告)号：US07898809B2
公开(公告)日：2011-03-01
申请号：US12252373
申请日：2008-10-16
申请人： Yi-Jiun Li , Peng Liu , Shi-Wen Zhou , Chun-Chi Chen
发明人： Yi-Jiun Li , Peng Liu , Shi-Wen Zhou , Chun-Chi Chen
IPC分类号： H05K7/20
CPC分类号： H01L23/3677 , H01L21/4882 , H01L2924/0002 , H01L2924/3011 , Y10T29/4935 , H01L2924/00
摘要： A heat sink includes a base plate and a plurality of cylindrical pins extending upwardly from the base plate. The cylindrical pins each include an upper dissipating portion, a lower mounting portion, and an engaging portion between the dissipating portion and the mounting portion. The mounting portion is interferentially fitted in a lower part of a corresponding aperture of the base plate. The engaging portion has a diameter smaller than that of the mounting portion. The engaging portion is cramped by an interior wall of the base plate defining an upper part of the corresponding aperture of the base plate by punching an upper surface of the base plate downwardly at a rim of the corresponding aperture.
摘要翻译：散热器包括基板和从基板向上延伸的多个圆柱形销。圆柱销每个包括上消散部分，下安装部分和消散部分和安装部分之间的接合部分。安装部分周向地装配在基板的相应孔的下部中。接合部的直径小于安装部的直径。接合部分被基板的内壁夹住，通过在对应的孔的边缘处向下冲压基板的上表面来限定基板的相应孔的上部。

17. 发明申请

US20110010132A1 METHOD FOR EVALUATING EFFICACY OF PREVENTION MAINTENANCE FOR A TOOL 有权
标题翻译：评估工具预防性维护效率的方法
公开(公告)号：US20110010132A1
公开(公告)日：2011-01-13
申请号：US12566974
申请日：2009-09-25
申请人： YI-FENG LEE , CHUN-CHI CHEN , SHIH-CHANG KAO , YUN-ZONG TIAN , WEI-JUN CHEN
发明人： YI-FENG LEE , CHUN-CHI CHEN , SHIH-CHANG KAO , YUN-ZONG TIAN , WEI-JUN CHEN
IPC分类号： G06F15/00
CPC分类号： G06Q10/00
摘要： A method for evaluating efficacy of prevention maintenance for a tool includes the steps of: choosing a tool which has been maintained preventively and choosing a productive parameter of the tool; collecting values of the productive parameter generated from the tool during a time range for building a varying curve of the productive parameter versus time, modifying the varying curve with a moving average method; transforming the varying curve into a Cumulative Sum chart; and judging whether the values of the productive parameter generated from the tool after the prevention maintenance are more stable, compared with the values of the productive parameter generated from the tool before the prevention maintenance, according to the Cumulative Sum chart. Thereby, if the varying of the values of the productive parameter after the prevention maintenance isn't stable, then the efficacy of this prevention maintenance for the tool is judged not good.
摘要翻译：一种用于评估工具的预防维护功效的方法包括以下步骤：选择已预先维护的工具并选择工具的生产参数; 在用于构建生产参数对时间的变化曲线的时间范围内收集从工具产生的生产参数的值，以移动平均法修改变化曲线; 将变化曲线转换为累计总和图; 并且根据累计总和图来判断在防止维护之后从工具生成的生产参数的值是否比预防维护之前从工具产生的生产参数的值更稳定。因此，如果防止维护后的生产参数的值的变化不稳定，则对该工具的该防止维护的功效被判断为不好。

18. 发明授权

US07869217B2 Toolless locking device 失效
标题翻译：无工具锁定装置
公开(公告)号：US07869217B2
公开(公告)日：2011-01-11
申请号：US12202391
申请日：2008-09-01
申请人： Chun-Chi Chen , Hong-Cheng Yang , Jin-Biao Liu , He-Ping Liu
发明人： Chun-Chi Chen , Hong-Cheng Yang , Jin-Biao Liu , He-Ping Liu
IPC分类号： H05K7/20 , H01L23/40
CPC分类号： H01L23/4093 , H01L23/3672 , H01L2924/0002 , H01L2924/00
摘要： A locking device is used for securing a heat sink to an electronic device mounted on a first face of a printed circuit board which defines a first hole. The heat sink defines a second hole therein. The locking device has a fastener including a head portion located aside the heat sink, a foot portion located aside a second face of the printed circuit board, and a body portion extending through the holes of the heat sink and the printed circuit board and interconnecting the head portion and the foot portion. The foot portion includes a buckling part abutting against the second face of the printed circuit board, and a positioning part extending towards the head portion to a position above the buckling part. When the buckling part abuts against the printed circuit board, the positioning part has a portion thereof entering into the first hole.
摘要翻译：锁定装置用于将散热器固定到安装在限定第一孔的印刷电路板的第一面上的电子装置上。散热片在其中限定第二个孔。锁定装置具有紧固件，该紧固件包括位于散热器的头部的部分，位于印刷电路板的第二面的脚部以及延伸穿过散热器和印刷电路板的孔的主体部分，头部和脚部。脚部包括抵靠印刷电路板的第二面的压曲部，以及朝向头部延伸到屈曲部上方的位置的定位部。当屈曲部分抵靠印刷电路板时，定位部分的一部分进入第一孔。

19. 发明申请

US20100259897A1 HEAT DISSIPATION DEVICE 失效
标题翻译：散热装置
公开(公告)号：US20100259897A1
公开(公告)日：2010-10-14
申请号：US12503021
申请日：2009-07-14
申请人： XU-XIN MIN , MENG FU , CHUN-CHI CHEN
发明人： XU-XIN MIN , MENG FU , CHUN-CHI CHEN
IPC分类号： H05K7/20
CPC分类号： H01L23/427 , F28D15/0275 , H01L2924/0002 , H01L2924/00
摘要： A heat dissipation device dissipates heat generated by a heat-generating electronic element mounted on a top surface printed circuit board. The printed circuit board defines a plurality of first through holes. The heat dissipation device comprises a heat spreader located at a top side of the printed circuit board. The heat spreader defines a plurality of second through holes corresponding to the first through holes, respectively. A first heat sink is located over the heat spreader, and a plurality of second heat sinks is located at a bottom side of the printed circuit board. A plurality of heat pipes extending through the second through holes of the heat spreader and the first through holes of the printed circuit board to thermally connect the first and second heat sinks to the heat spreader.
摘要翻译：散热装置散发由安装在顶面印刷电路板上的发热电子元件产生的热量。印刷电路板限定多个第一通孔。散热装置包括位于印刷电路板顶侧的散热器。散热器分别限定与第一通孔相对应的多个第二通孔。第一散热器位于散热器上方，并且多个第二散热器位于印刷电路板的底侧。多个热管延伸穿过散热器的第二通孔和印刷电路板的第一通孔，以将第一和第二散热器热连接到散热器。

20. 发明申请

US20100256792A1 METHOD OF ADJUSTING WAFER PROCESSING SEQUENCE 有权
标题翻译：调整加工顺序的方法
公开(公告)号：US20100256792A1
公开(公告)日：2010-10-07
申请号：US12476559
申请日：2009-06-02
申请人： YUN-ZONG TIAN , CHUN CHI CHEN , YI FENG LEE , WEI JUN CHEN , SHIH CHANG KAO , YIJ CHIEH CHU , CHENG-HAO CHEN
发明人： YUN-ZONG TIAN , CHUN CHI CHEN , YI FENG LEE , WEI JUN CHEN , SHIH CHANG KAO , YIJ CHIEH CHU , CHENG-HAO CHEN
IPC分类号： G06F17/00
CPC分类号： G05B19/41865 , G05B2219/32015 , G05B2219/32016 , G05B2219/32019 , G05B2219/45031 , Y02P90/20
摘要： A method of adjusting wafer process sequence includes steps of collecting production parameters for a plurality of lots; selecting a plurality of key parameters from the production parameters, wherein the key parameters at least includes a processing sequence; defining a formula to obtain an epsilon value; categorizing the lots into groups according to the epsilon value and the minimum point number by using density-based spatial clustering of application with noise (DBSCAN); and adjusting the processing sequences of the lots in the groups. Thereby, the lots with the same process recipe can be continuously or simultaneously sent into a machine, thereby reducing replacement of process recipes or shortening machine idle time.
摘要翻译：调整晶片工艺顺序的方法包括收集多个批次的生产参数的步骤; 从所述生产参数中选择多个关键参数，其中所述关键参数至少包括处理序列; 定义公式以获得ε值; 通过使用基于密度的噪声空间聚类（DBSCAN），根据ε值和最小点数将批次分组成组。并调整组中批次的处理顺序。因此，具有相同处理配方的批次可以连续或同时发送到机器中，从而减少过程配方的更换或缩短机器空闲时间。

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