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161. 发明申请

US20090105990A1 METHOD FOR ANALYZING DEFECT DATA AND INSPECTION APPARATUS AND REVIEW SYSTEM 有权
标题翻译：用于分析缺陷数据和检查装置和审查系统的方法
公开(公告)号：US20090105990A1
公开(公告)日：2009-04-23
申请号：US12341657
申请日：2008-12-22
申请人： Hisae SHIBUYA , Yuji Takagi
发明人： Hisae SHIBUYA , Yuji Takagi
IPC分类号： G06F15/00
CPC分类号： G01N21/956 , G06T7/0006 , G06T7/001 , G06T2207/30148
摘要： The distribution states of defects are analyzed on the basis of the coordinates of defects detected by an inspection apparatus to classify them into a distribution feature category, or any one of repetitive defect, congestion defect, linear distribution defect, ring/lump distribution defect and random defect. In the manufacturing process for semiconductor substrates, defect distribution states are analyzed on the basis of defect data detected by an inspection apparatus, thereby specifying the cause of defect in apparatus or process.
摘要翻译：基于由检查装置检测到的缺陷坐标来分析缺陷的分布状态，将其分类为分布特征类别，或重复缺陷，拥塞缺陷，线性分布缺陷，环/块分布缺陷和随机缺陷。在半导体基板的制造工序中，基于由检查装置检测出的缺陷数据来分析缺陷分布状态，从而指定装置或处理中的缺陷的原因。

162. 发明申请

US20090039261A1 Pattern Inspection Method and Pattern Inspection System 有权
标题翻译：模式检验方法和模式检验系统
公开(公告)号：US20090039261A1
公开(公告)日：2009-02-12
申请号：US12188096
申请日：2008-08-07
申请人： Yasutaka Toyoda , Yasunari Souda , Yuji Takagi , Koji Arai
发明人： Yasutaka Toyoda , Yasunari Souda , Yuji Takagi , Koji Arai
IPC分类号： G01N23/00
CPC分类号： H01L22/12 , H01L2924/0002 , H01L2924/00
摘要： A pattern data examination method and system capable of accurately and speedily examining a circuit pattern without failing to extract pattern contour data are provided. While pattern comparison is ordinarily made by using a secondary electron image, a contour of a pattern element is extracted by using a backscattered electron image said to be suitable for observation and examination of a three dimensional configuration of a pattern element, and pattern inspection is executed by using the extracted contour of the pattern element. More specifically, pattern inspection is executed by comparing a contour of a pattern element with design data such as CAD data to measure a difference between the contour and the data, and by computing, for example, the size of the circuit pattern element from the contour of a pattern. From two or more backscattered electron images formed by detecting backscattered electrons at two or more different spatial positions, pattern contour data contained in the backscattered electron images may be obtained.
摘要翻译：提供了能够准确且快速地检查电路图案而不会提取图案轮廓数据的图形数据检查方法和系统。虽然通常使用二次电子图像进行图案比较，但是通过使用所述适合于观察和检查图案元素的三维构造的背散射电子图像来提取图案元素的轮廓，并且执行图案检查通过使用所提取的图案元素的轮廓。更具体地，通过将图案元素的轮廓与诸如CAD数据的设计数据进行比较来测量轮廓和数据之间的差异，并且例如通过计算来自轮廓的电路图案元素的尺寸来执行图案检查的模式。通过在两个或更多个不同的空间位置检测反向散射电子形成的两个或更多个背散射电子图像，可以获得包含在背散射电子图像中的图案轮廓数据。

163. 发明授权

US07459712B2 Method and apparatus of measuring pattern dimension and controlling semiconductor device process having an error revising unit 有权
标题翻译：测量图案尺寸的方法和装置，并控制具有误差修正单元的半导体器件工艺
公开(公告)号：US07459712B2
公开(公告)日：2008-12-02
申请号：US11657689
申请日：2007-01-25
申请人： Maki Tanaka , Hidetoshi Morokuma , Chie Shishido , Yuji Takagi
发明人： Maki Tanaka , Hidetoshi Morokuma , Chie Shishido , Yuji Takagi
IPC分类号： G01N21/86
CPC分类号： H01J37/28 , H01J37/304 , H01J2237/2814 , H01J2237/2817 , H01J2237/30455
摘要： A method of measuring pattern dimensions includes evaluating a relationship between cross-sectional shapes of a pattern and measurement errors of a pattern in a specified image processing technique, and conducting an actual measurement in which dimension measurement of an evaluation objective pattern from image signals of a microscope is carried out, and revising errors of the dimension measurement of the evaluation objective pattern based on the relationship between the cross-sectional shapes of a pattern and the measurement errors of a pattern previously evaluated.
摘要翻译：测量图案尺寸的方法包括评估图案的横截面形状与特定图像处理技术中的图案的测量误差之间的关系，并且进行实际测量，其中评估对象图案的尺寸测量从图像信号基于图案的截面形状与先前评估的图案的测量误差之间的关系，进行显微镜的修正，并修正评价对象图案的尺寸测量的误差。

164. 发明申请

US20080236694A1 Hose with Joint Fitting for Conveying Carbon Dioxide Refrigerant 审中-公开
标题翻译：用于输送二氧化碳制冷剂的管接头软管
公开(公告)号：US20080236694A1
公开(公告)日：2008-10-02
申请号：US12057503
申请日：2008-03-28
申请人： Yuji Takagi
发明人： Yuji Takagi
IPC分类号： F16L11/04 , F16L21/00
CPC分类号： F16L33/2076 , B60H1/00571 , F16L11/082 , F16L11/086 , F16L2011/047
摘要： A hose with a joint fitting for conveying a carbon dioxide refrigerant has a hose body and a joint fitting. The joint fitting is provided with an insert pipe inserted in an end portion of the hose body, and a socket fitting including a sleeve and a radially inwardly directed collar portion on an axial end of the sleeve. An axial blocking layer blocking an axial leakage path of the refrigerant is provided between an outer surface of the insert pipe and an inner surface of the hose body, and a radial blocking layer blocking a radial leakage path of the refrigerant is provided between an inner surface of the collar portion and an end surface of the hose body.
摘要翻译：具有用于输送二氧化碳制冷剂的接头配件的软管具有软管体和接头配件。接头配件设置有插入管体的端部的插入管，以及在套筒的轴向端部上具有套筒和径向向内的套环部的插座配件。在插入管的外表面和软管主体的内表面之间设置有堵塞制冷剂的轴向泄漏路径的轴向阻挡层，并且在内表面之间设置有阻挡制冷剂的径向泄漏路径的径向阻挡层以及软管体的端面。

165. 发明授权

US07356177B2 Defect image classifying method and apparatus and a semiconductor device manufacturing process based on the method and apparatus 有权
标题翻译：基于该方法和装置的缺陷图像分类方法和装置以及半导体器件制造方法
公开(公告)号：US07356177B2
公开(公告)日：2008-04-08
申请号：US11506310
申请日：2006-08-17
申请人： Kenji Obara , Yuji Takagi , Ryo Nakagaki , Yasuhiko Ozawa , Toshiei Kurosaki , Seiji Isogai
发明人： Kenji Obara , Yuji Takagi , Ryo Nakagaki , Yasuhiko Ozawa , Toshiei Kurosaki , Seiji Isogai
IPC分类号： G06K9/00
CPC分类号： G06T7/001 , G06T2207/30148
摘要： According to the present invention, techniques including a method and apparatus for classifying and displaying images are provided. In an embodiment of the present invention a defect image classification method using inspected objects is provided. The method includes defect images obtained from at least one inspected object. Next a set of defect images is classified into a specified category, which has a feature. The defect images are arranged for display according to the feature and then displayed. The arranging of the defect images may also be based on an evaluation value for each defect image. Another embodiment provides a defect image classification method using inspected objects. Defect images are obtained from at least one inspected object. Next the defect images are classified into a plurality of categories and at least two information items for example, a defect distribution diagram showing locations of defects in the inspected object, information associated with a category of the plurality of categories, and a defect size distribution, are displayed.
摘要翻译：根据本发明，提供包括用于分类和显示图像的方法和装置的技术。在本发明的一个实施例中，提供了使用检查对象的缺陷图像分类方法。该方法包括从至少一个检查对象获得的缺陷图像。接下来，一组缺陷图像被分类为具有特征的指定类别。故障图像根据特征进行显示，然后显示。缺陷图像的布置也可以基于每个缺陷图像的评估值。另一实施例提供使用检查对象的缺陷图像分类方法。从至少一个检查对象获得缺陷图像。接下来，将缺陷图像分为多个类别和至少两个信息项，例如，示出被检查对象中的缺陷的位置的缺陷分布图，与多个类别的类别相关联的信息以及缺陷尺寸分布，被显示。

166. 发明授权

US07263216B2 Pattern inspecting method and apparatus thereof, and pattern inspecting method on basis of electron beam images and apparatus thereof 有权
标题翻译：图案检查方法和装置，以及基于电子束图像的图案检查方法及其装置
公开(公告)号：US07263216B2
公开(公告)日：2007-08-28
申请号：US10637488
申请日：2003-08-11
申请人： Chie Shishido , Yuji Takagi , Shuji Maeda , Takanori Ninomiya , Takashi Hiroi , Masahiro Watanabe , Hideaki Doi
发明人： Chie Shishido , Yuji Takagi , Shuji Maeda , Takanori Ninomiya , Takashi Hiroi , Masahiro Watanabe , Hideaki Doi
IPC分类号： G06K9/00
CPC分类号： G06T7/001 , G06T5/006 , G06T2207/10061 , G06T2207/30148 , H01J37/226 , H01J37/28 , H01J2237/2448 , H01J2237/24592 , H01J2237/2482 , H01J2237/2806 , H01J2237/2817
摘要： A pattern inspecting method and apparatus for inspecting a defect or defective candidate of patterns on a sample includes picking up an image of a sample by shifting a sampling position on the sample, measuring geometric distortion in an image of a standard sample, beforehand, and defining a size for which the measured geometric distortion is neglectable, obtaining a first image of the sample and a second image to be compared with the first image, dividing the first image and the second stage into images of a division unit having a size not greater than the defined size, comparing a divided image of the first image with a divided image of the second image, and for calculating a difference in gradation values between both of the divided images. The defect or the defect candidate of the sample is extracted in accordance with the difference in the gradation values.
摘要翻译：用于检查样本上的图案的缺陷或缺陷候选的图案检查方法和装置包括：通过移动样本上的采样位置，预先测量标准样本的图像中的几何失真，并定义测量的几何失真可忽略的尺寸，获得样本的第一图像和要与第一图像比较的第二图像，将第一图像和第二阶段划分为尺寸不大于的尺寸的分割单元的图像定义的尺寸，将第一图像的分割图像与第二图像的分割图像进行比较，并且用于计算两个分割图像之间的灰度值差。根据灰度值的差异提取样本的缺陷或缺陷候选。

167. 发明申请

US20060274933A1 Defect image classifying method and apparatus and a semiconductor device manufacturing process based on the method and apparatus 有权
标题翻译：基于该方法和装置的缺陷图像分类方法和装置以及半导体器件制造方法
公开(公告)号：US20060274933A1
公开(公告)日：2006-12-07
申请号：US11506310
申请日：2006-08-17
申请人： Kenji Obara , Yuji Takagi , Ryo Nakagaki , Yasuhiro Ozawa , Toshiei Kurosaki , Seiji Isogai
发明人： Kenji Obara , Yuji Takagi , Ryo Nakagaki , Yasuhiro Ozawa , Toshiei Kurosaki , Seiji Isogai
IPC分类号： G06K9/00 , G06K9/62
CPC分类号： G06T7/001 , G06T2207/30148
摘要： According to the present invention, techniques including a method and apparatus for classifying and displaying images are provided. In an embodiment of the present invention a defect image classification method using inspected objects is provided. The method includes defect images obtained from at least one inspected object. Next a set of defect images is classified into a specified category, which has a feature. The defect images are arranged for display according to the feature and then displayed. The arranging of the defect images may also be based on an evaluation value for each defect image. Another embodiment provides a defect image classification method using inspected objects. Defect images are obtained from at least one inspected object. Next the defect images are classified into a plurality of categories and at least two information items for example, a defect distribution diagram showing locations of defects in the inspected object, information associated with a category of the plurality of categories, and a defect size distribution, are displayed.
摘要翻译：根据本发明，提供了包括用于分类和显示图像的方法和装置的技术。在本发明的一个实施例中，提供了使用检查对象的缺陷图像分类方法。该方法包括从至少一个检查对象获得的缺陷图像。接下来，一组缺陷图像被分类为具有特征的指定类别。故障图像根据特征进行显示，然后显示。缺陷图像的布置也可以基于每个缺陷图像的评估值。另一实施例提供使用检查对象的缺陷图像分类方法。从至少一个检查对象获得缺陷图像。接下来，将缺陷图像分为多个类别和至少两个信息项，例如，示出被检查对象中的缺陷的位置的缺陷分布图，与多个类别的类别相关联的信息以及缺陷尺寸分布，被显示。

168. 发明申请

US20060274932A1 Inspecting method, inspecting system, and method for manufacturing electronic devices 有权
公开(公告)号：US20060274932A1
公开(公告)日：2006-12-07
申请号：US11431709
申请日：2006-05-11
申请人： Yoko Ikeda , Junko Konishi , Hisafumi Iwata , Yuji Takagi , Kenji Obara , Ryo Nakagaki , Seiji Isogai , Yasuhiko Ozawa
发明人： Yoko Ikeda , Junko Konishi , Hisafumi Iwata , Yuji Takagi , Kenji Obara , Ryo Nakagaki , Seiji Isogai , Yasuhiko Ozawa
IPC分类号： G06K9/00 , G06K9/62 , G06K9/46
CPC分类号： G06F3/0486 , G06F2203/04803 , G06T7/0004 , G06T2200/24 , G06T2207/30148
摘要： A method for classifying defects, including: calculating feature quantifies of defect image which is obtained by imaging a defect on a sample; classifying the defect image into a classified category by using information on the calculated feature quantities; displaying the classified defect image in a region on a display screen which is defined to the classified category; adding information on the classified category to the displayed defect image; transferring the displayed defect image which is added the information on the classified category to one of the other categories and displaying the transferred defect image in a region on the display screen which is defined to the one of the other categories; and changing information on the category.

169. 发明授权

US07122796B2 Electron beam inspection method and apparatus and semiconductor manufacturing method and its manufacturing line utilizing the same 有权
标题翻译：电子束检查方法及装置及半导体制造方法及其制造线
公开(公告)号：US07122796B2
公开(公告)日：2006-10-17
申请号：US11003506
申请日：2004-12-06
申请人： Takashi Hiroi , Maki Tanaka , Masahiro Watanabe , Asahiro Kuni , Yukio Matsuyama , Yuji Takagi , Hiroyuki Shinada , Mari Nozoe , Aritoshi Sugimoto
发明人： Takashi Hiroi , Maki Tanaka , Masahiro Watanabe , Asahiro Kuni , Yukio Matsuyama , Yuji Takagi , Hiroyuki Shinada , Mari Nozoe , Aritoshi Sugimoto
IPC分类号： G01N23/00
CPC分类号： H01J37/28 , H01J2237/2817
摘要： An inspection method and apparatus includes control of an acceleration voltage of an electron beam, irradiation of the electron beam to an object to be inspected mounted on a stage which is continuously moving at least in one direction, and detection of at least one of secondary electrons and reflected electrons emanated from the object in response to the irradiation. An image of the object is obtained from the detected electron by using positional information of the stage and inspection or measurement of the object is conducted using and obtained image. In the detection, an electric field in the vicinity of the object mounted on the stage is controlled so that at least one secondary electrons and the reflected electrons emanated from the object in response to the irradiation of the electron beam are decelerated.
摘要翻译：检查方法和装置包括控制电子束的加速电压，将电子束照射到安装在至少在一个方向上连续移动的台上的被检查物体，以及二次电子中的至少一个的检测以及响应于照射从物体发射的反射电子。通过使用舞台的位置信息从被检测的电子获得对象的图像，并使用获得的图像进行对象的检查或测量。在检测中，控制安装在平台上的物体附近的电场，使得响应于电子束的照射而从物体发出的至少一个二次电子和反射电子减速。

170. 发明申请

US20060215902A1 Method and apparatus for detecting pattern defects 有权
标题翻译：检测图案缺陷的方法和装置
公开(公告)号：US20060215902A1
公开(公告)日：2006-09-28
申请号：US11319271
申请日：2005-12-29
申请人： Hisae Shibuya , Akira Hamamatsu , Yuji Takagi
发明人： Hisae Shibuya , Akira Hamamatsu , Yuji Takagi
IPC分类号： G06K9/00
CPC分类号： G06K9/6221 , G01N21/9501 , G01N21/95607 , G01N2021/8854 , G01N2021/95676
摘要： With the objective of achieving defect kind training in a short period of time to teach classification conditions of defects detected as a result of inspecting a thin film device, according to one aspect of the present invention, there is provided a visual inspection method, and an apparatus therefor, comprising the steps of: detecting defects based on inspection images acquired by optical or electronic defect detection means, and at the same time calculating features of the defects; and classifying the defects according to classification conditions set beforehand, wherein said classification condition setting step further includes the steps of: collecting defect features over a large number of defects acquired beforehand from the defect detection step; sampling defects based on the distribution of the collected defect features over the large number of defects; and setting defect classification conditions based on the result of reviewing the sampled defects.
摘要翻译：为了在短时间内实现缺陷种类训练，目的在于教导检查薄膜装置的检测缺陷的分类条件，根据本发明的一个方面，提供一种目视检查方法，其装置包括以下步骤：基于由光学或电子缺陷检测装置获取的检查图像检测缺陷，同时计算缺陷的特征; 并根据预先设定的分类条件对缺陷进行分类，其中所述分类条件设置步骤还包括以下步骤：从缺陷检测步骤预先获取的大量缺陷中收集缺陷特征; 基于收集的缺陷特征分布在大量缺陷上的采样缺陷; 并根据检查采样缺陷的结果设置缺陷分类条件。

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