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121. 发明授权

US08421525B2 Semiconductor circuit device 有权
标题翻译：半导体电路器件
公开(公告)号：US08421525B2
公开(公告)日：2013-04-16
申请号：US13046344
申请日：2011-03-11
申请人： Kenichi Kawasaki
发明人： Kenichi Kawasaki
IPC分类号： G05F1/10
CPC分类号： G05F1/56 , G06F1/3203
摘要： The semiconductor circuit device includes a power line receiving first voltage; each of internal circuits being provided with different operating voltages by the operation mode; a power supply circuit connected with one of internal circuits and the power line to provide second voltage lower than the first voltage to the one of internal circuits; and a control circuit controlling the power supply circuit in accordance with each of the operation modes, wherein when a change of a operation mode is performed, if a operating voltage after the change of a operation mode is higher than a operating voltage before the change of a operation mode, firstly the control circuit controls the power supply circuit to supply a second voltage higher than the operating voltage and secondly the control circuit controls the power supply circuit to supply the operation voltage after the change of a operation mode to the internal circuit.
摘要翻译：半导体电路装置包括：接收第一电压的电力线; 每个内部电路由操作模式提供不同的工作电压; 与所述内部电路和所述电力线之一连接的电源电路，以向所述一个内部电路提供低于所述第一电压的第二电压; 以及根据每种操作模式控制电源电路的控制电路，其中当执行操作模式的改变时，如果操作模式改变之后的操作电压高于在改变之前的操作电压操作模式，首先控制电路控制电源电路提供比工作电压高的第二电压，其次控制电路控制电源电路，以便在将运行模式改变为内部电路之后提供工作电压。

122. 发明授权

US08320101B2 Multilayer electronic component and method for manufacturing the same 有权
标题翻译：多层电子元件及其制造方法
公开(公告)号：US08320101B2
公开(公告)日：2012-11-27
申请号：US12817352
申请日：2010-06-17
申请人： Shunsuke Takeuchi , Kenichi Kawasaki , Akihiro Motoki , Makoto Ogawa
发明人： Shunsuke Takeuchi , Kenichi Kawasaki , Akihiro Motoki , Makoto Ogawa
IPC分类号： H01G4/228
CPC分类号： H01G4/30 , C23C18/165 , C23C18/1692 , C25D5/10 , C25D5/14 , C25D5/50 , H01G4/012 , H01G4/2325 , Y10T29/413 , Y10T29/435
摘要： In a method for manufacturing a multilayer electronic component, after a plating layer for forming an external electrode is formed on an end surface of a laminate, conditions for heat-treating the laminate are set such that interdiffusion layers have ends which face internal electrodes and which are spaced from the end surface of the laminate at a distance of about 0.5 μm to about 1.9 μm.
摘要翻译：在多层电子部件的制造方法中，在层叠体的端面上形成用于形成外部电极的镀覆层之后，设定层叠体的热处理条件，使得相互扩散层具有面向内部电极的端部，与层压体的端面间隔约0.5μm至约1.9μm的距离。

123. 发明授权

US08260194B2 Information communication method, information communication system, information reception apparatus, and information transmission apparatus 失效
标题翻译：信息通信方式，信息通信系统，信息接收装置，信息发送装置
公开(公告)号：US08260194B2
公开(公告)日：2012-09-04
申请号：US12215817
申请日：2008-06-30
申请人： Kenichi Kawasaki
发明人： Kenichi Kawasaki
IPC分类号： H04H40/00
CPC分类号： G01S13/825 , G01H9/00
摘要： An information communication method includes transmitting a millimeter-band radio wave from a reception side, reflecting the transmitted radio wave at a transmission side while vibrating the transmitted radio wave corresponding to first information transmitted by the transmission side, and receiving the reflected radio wave at the reception side and reconstructing the first information based on a phase difference between the transmitted radio wave and the received radio wave.
摘要翻译：一种信息通信方法，包括从接收侧发送毫米波段无线电波，在发送侧反射发送的无线电波，同时对与发送侧发送的第一信息相对应的发送的无线电波振动，并且接收反射的无线电波并且基于所发送的无线电波和所接收的无线电波之间的相位差重建第一信息。

124. 发明授权

US08240016B2 Method for manufacturing multilayer electronic component 有权
标题翻译：多层电子部件的制造方法
公开(公告)号：US08240016B2
公开(公告)日：2012-08-14
申请号：US12770914
申请日：2010-04-30
申请人： Akihiro Motoki , Makoto Ogawa , Kenichi Kawasaki , Shunsuke Takeuchi
发明人： Akihiro Motoki , Makoto Ogawa , Kenichi Kawasaki , Shunsuke Takeuchi
IPC分类号： H01G7/00
CPC分类号： H01G4/30 , H01G4/232 , H01G4/2325 , H05K1/0306 , H05K1/092 , H05K3/102 , H05K3/246 , H05K3/403 , H05K2201/0347 , H05K2203/025 , Y10T29/417 , Y10T29/43 , Y10T29/435 , Y10T428/25
摘要： A method for manufacturing a multilayer electronic component includes a step of preparing a laminate which includes a plurality of stacked insulator layers and a plurality of internal electrodes extending along the interfaces between the insulator layers, and in which an end of each of the plurality of internal electrodes is exposed at a predetermined surface corresponding to one of the first and second end surfaces; a step of forming external electrodes on the predetermined surfaces; and a step of forming thick-film edge electrodes at edge portions. The step of forming external electrodes includes a step of attaching a plurality of conductive particles having a particle size of about 1 μm or more to the predetermined surfaces of the laminate, and a step of performing plating directly on the predetermined surfaces to which the conductive particles are attached.
摘要翻译：一种制造多层电子部件的方法包括制备层压体的步骤，该层压体包括多个堆叠的绝缘体层和沿着绝缘体层之间的界面延伸的多个内部电极，并且其中多个内部电极在对应于第一和第二端面之一的预定表面处露出; 在所述预定表面上形成外部电极的步骤; 以及在边缘部分形成厚膜边缘电极的步骤。形成外部电极的步骤包括将多个具有约1μm以上的粒径的导电粒子附着在层叠体的规定表面上的步骤，以及在导电粒子的规定表面上直接进行电镀的工序附上。

125. 发明申请

US20120188683A1 METHOD FOR MANUFACTURING CERAMIC ELECTRONIC COMPONENT AND CERAMIC ELECTRONIC COMPONENT 有权
标题翻译：陶瓷电子元件和陶瓷电子元件的制造方法
公开(公告)号：US20120188683A1
公开(公告)日：2012-07-26
申请号：US13357671
申请日：2012-01-25
申请人： Syunsuke TAKEUCHI , Teruyo KATAYAMA , Toshiyuki IWANAGA , Akihiro MOTOKI , Makoto OGAWA , Kenichi KAWASAKI
发明人： Syunsuke TAKEUCHI , Teruyo KATAYAMA , Toshiyuki IWANAGA , Akihiro MOTOKI , Makoto OGAWA , Kenichi KAWASAKI
IPC分类号： H01G4/12 , C25D7/00 , H01L41/00 , B05D3/00 , H01F5/00 , H01C7/13 , C25D5/54 , B05D5/00
CPC分类号： H01C1/148 , H01C7/008 , H01C7/18 , H01G4/012 , H01G4/232 , H01G4/30
摘要： A method for manufacturing a ceramic electronic component includes the steps of preparing a ceramic body including a plurality of first internal electrodes and a plurality of second internal electrodes, processing the ceramic body to an internal electrode exposure rate of about 102% to about 153%, and plating the processed ceramic body to form a plated layer thereon.
摘要翻译：陶瓷电子部件的制造方法包括以下步骤：制备包括多个第一内部电极和多个第二内部电极的陶瓷体，将所述陶瓷体加工成约102％〜约153％的内部电极曝光率，并对其进行电镀，在其上形成镀层。

126. 发明授权

US08228663B2 Laminated ceramic electronic component 有权
标题翻译：层压陶瓷电子元件
公开(公告)号：US08228663B2
公开(公告)日：2012-07-24
申请号：US12616844
申请日：2009-11-12
申请人： Shunsuke Takeuchi , Kenichi Kawasaki , Akihiro Motoki , Makoto Ogawa , Toshiyuki Iwanaga
发明人： Shunsuke Takeuchi , Kenichi Kawasaki , Akihiro Motoki , Makoto Ogawa , Toshiyuki Iwanaga
IPC分类号： H01G4/228 , H01G4/06
CPC分类号： H01G4/232 , H01G4/2325 , H01G4/30
摘要： In a laminated ceramic electronic component, external terminal electrodes include plating films directly covering exposed portions of internal electrodes on end surfaces of a ceramic element assembly. On the boundaries between the end surfaces and principal surfaces of the ceramic element assembly, substantially rounded corners are provided, and the plating films are arranged such that the ends of the plating films stop at the corners and do not project from the principal surfaces.
摘要翻译：在层叠陶瓷电子部件中，外部端子电极包括直接覆盖陶瓷元件组件的端面上的内部电极的露出部分的电镀膜。在陶瓷元件组件的端面和主面之间的边界上，设置大致圆角，并且镀膜被布置成使得镀膜的端部停止在角部并且不从主表面突出。

127. 发明申请

US20120183682A1 MULTILAYER CERAMIC ELECTRONIC COMPONENT AND MANUFACTURING METHOD THEREOF 有权
标题翻译：多层陶瓷电子元件及其制造方法
公开(公告)号：US20120183682A1
公开(公告)日：2012-07-19
申请号：US13433320
申请日：2012-03-29
申请人： Shunsuke Takeuchi , Kenichi Kawasaki , Akihiro Motoki , Makoto Ogawa , Shuji Matsumoto , Seiichi Nishihara
发明人： Shunsuke Takeuchi , Kenichi Kawasaki , Akihiro Motoki , Makoto Ogawa , Shuji Matsumoto , Seiichi Nishihara
IPC分类号： B05D5/00 , B05D3/02
CPC分类号： H01G4/12 , H01G4/005 , H01G4/232
摘要： A multilayer ceramic electronic component including thin external terminal electrodes each having a superior bonding force to a ceramic base body is provided. In order to form the external terminal electrodes, after Cu plating films are deposited on exposed portions of internal electrodes by direct plating on a ceramic base body, a Cu liquid phase, an O2-containing liquid phase, and a Cu solid phase are generated between the Cu plating film and the ceramic base body by a heat treatment, so that Cu oxides are dispersed in the Cu plating film, at least near an interface with the ceramic base body. Since the Cu oxides function as an adhesive, a bonding force of the Cu plating film to the ceramic base body can be increased, and hence the external terminal electrode having a superior bonding force to the ceramic base body can be obtained.
摘要翻译：提供了一种多层陶瓷电子部件，其包括对陶瓷基体具有优良的结合力的薄的外部端子电极。为了形成外部端子电极，通过在陶瓷基体上直接电镀将Cu电镀膜沉积在内部电极的露出部分上之后，会产生Cu液相，含O2液相和Cu固相， Cu镀膜和陶瓷基体进行热处理，使得Cu氧化物至少在陶瓷基体的界面附近分散在Cu镀膜中。由于Cu氧化物作为粘合剂发挥功能，所以可以提高Cu镀膜对陶瓷基体的结合力，因此能够获得与陶瓷基体的粘接力优异的外部端子电极。

128. 发明申请

US20110304380A1 SEMICONDUCTOR DEVICE 失效
标题翻译：半导体器件
公开(公告)号：US20110304380A1
公开(公告)日：2011-12-15
申请号：US12962809
申请日：2010-12-08
申请人： Koichi Nakayama , Tetsuyoshi Shiota , Kenichi Kawasaki
发明人： Koichi Nakayama , Tetsuyoshi Shiota , Kenichi Kawasaki
IPC分类号： H03K17/16
CPC分类号： H03K19/0016 , Y10T307/702 , Y10T307/74 , Y10T307/858
摘要： A semiconductor device includes: a first power line to supply a first voltage to a plurality of internal circuits; a second power line to supply the first voltage to the plurality of internal circuits; a first switch provided between said first power line and each of the plurality of internal circuits; a second switch provided between said second power line and each of the plurality of internal circuits; and a control circuit to control the first switch of a second internal circuit included in the plurality of the internal circuits based on the amounts of noise and voltage drop at power-on in a first circuit included in the plurality of internal circuits.
摘要翻译：半导体器件包括：向多个内部电路提供第一电压的第一电力线; 第二电力线，用于向所述多个内部电路提供所述第一电压; 设置在所述第一电力线与所述多个内部电路中的每一个之间的第一开关; 设置在所述第二电力线与所述多个内部电路中的每一个之间的第二开关; 以及控制电路，其基于在所述多个内部电路中包括的第一电路中的通电时的噪声和电压降的量来控制包括在所述多个内部电路中的第二内部电路的第一开关。

129. 发明授权

US08077445B2 Monolithic ceramic electronic component and method for manufacturing the same 有权
标题翻译：单片陶瓷电子元件及其制造方法
公开(公告)号：US08077445B2
公开(公告)日：2011-12-13
申请号：US12405370
申请日：2009-03-17
申请人： Toshiyuki Iwanaga , Akihiro Motoki , Makoto Ogawa , Kenichi Kawasaki , Shunsuke Takeuchi , Seiichi Nishihara , Shuji Matsumoto
发明人： Toshiyuki Iwanaga , Akihiro Motoki , Makoto Ogawa , Kenichi Kawasaki , Shunsuke Takeuchi , Seiichi Nishihara , Shuji Matsumoto
IPC分类号： H01G4/00
CPC分类号： H01G4/30 , B32B18/00 , C04B2237/346 , C04B2237/66 , C04B2237/68 , C04B2237/704 , H01C1/142 , H01C7/008 , H01G4/232 , Y10T428/265 , Y10T428/31678
摘要： A method for manufacturing a monolithic ceramic electronic component includes a plating substep of depositing precipitates primarily composed of a specific metal on an end of each of internal electrodes exposed at a predetermined surface of a laminate and growing the precipitates to coalesce into a continuous plated layer, wherein the specific metal is different from that of the internal electrodes, and the same or substantially the same metal that defines the internal electrodes is distributed throughout the plated layer.
摘要翻译：一种用于制造单块陶瓷电子部件的方法包括：在层叠体的预定表面露出的每个内部电极的端部上沉积主要由特定金属构成的析出物的电镀子步骤，并使析出物凝聚成连续镀层，其中特定金属与内部电极不同，并且限定内部电极的相同或基本相同的金属分布在整个镀层中。

130. 发明授权

US08030496B2 Intermediate compound for synthesis of viridiofungin a derivative 失效
标题翻译：用于合成维生素E衍生物的中间体化合物
公开(公告)号：US08030496B2
公开(公告)日：2011-10-04
申请号：US12656579
申请日：2010-02-04
申请人： Tatsuya Kato , Nobuaki Kimura , Akemi Mizutani , Toshihiko Makino , Kenichi Kawasaki , Hiroshi Fukuda , Susumu Komiyama , Takuo Tsukuda
发明人： Tatsuya Kato , Nobuaki Kimura , Akemi Mizutani , Toshihiko Makino , Kenichi Kawasaki , Hiroshi Fukuda , Susumu Komiyama , Takuo Tsukuda
IPC分类号： C07D413/00
CPC分类号： C07D413/06 , C07C231/12 , C07F7/1804 , C07C235/76
摘要： A method whereby a compound having HCV replication inhibitory activity and desired optical activity can be synthesized selectively and at high yield in a small number of steps by using a compound having a specific chiral auxiliary as a starting compound is provided.A compound represented by the formula (1-8): wherein Y represents a group represented by the following formula: Q represents a protected carbonyl group; D represents —(CH2)m—R′, etc.; and n represents an integer of 0 to 10.
摘要翻译：提供了通过使用具有特异性手性助剂作为起始化合物的化合物，可以选择性地且以少量步骤以高产率合成具有HCV复制抑制活性和所需光学活性的化合物的方法。由式（1-8）表示的化合物：其中Y表示由下式表示的基团：Q表示被保护的羰基; D表示 - （CH 2）m -R'等; n表示0〜10的整数。

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