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1. 发明专利

IL294916A Arylamide derivative having antitumor activity 未知
公开(公告)号：IL294916A
公开(公告)日：2022-09-01
申请号：IL29491622
申请日：2022-07-20
申请人： CHUGAI PHARMACEUTICAL CO LTD , YOSHIAKI ISSHIKI , WATANABE FUMIO , MASAKI TOMIZAWA , KIHITO HADA , KAZUO HATTORI , KENICHI KAWASAKI , IKUMI HYODO , TOSHIHIRO AOKI
发明人： YOSHIAKI ISSHIKI , FUMIO WATANABE , MASAKI TOMIZAWA , KIHITO HADA , KAZUO HATTORI , KENICHI KAWASAKI , IKUMI HYODO , TOSHIHIRO AOKI
IPC分类号： A61K31/166 , A61K31/18 , A61K31/44 , A61K31/4436 , A61K31/444 , A61P35/00 , A61P43/00 , C07C31/125
摘要： The present disclosure provides, for example, a compound represented by general formula (6) below or a pharmaceutically acceptable salt thereof, or a pharmaceutically acceptable solvate of the compound or salt:wherein X 1 , X 2 , X 3 and X 4 are each independently -CR 2 = or -N=, R 2 is, for example, a halogen atom, R 1 is, for example, -S(=O) 2 -NH-R 8 , R 8 is, for example, a C1-6 alkyl group, R 3 is, for example, a hydrogen atom, R 5 is, for example, a halogen atom, R 6 is, for example, a hydrogen atom, and R 4 is, for example, a cyclopropyl group. The compounds, salts or solvates provided by the present disclosure exhibit high RAF/MEK complex-stabilizing activity and can be used for the treatment or prevention of cell proliferative disorders, particularly cancers.

2. 发明授权

US08943333B2 Large scale integrated circuit for dynamically changing resonant point 有权
标题翻译：用于动态改变谐振点的大规模集成电路
公开(公告)号：US08943333B2
公开(公告)日：2015-01-27
申请号：US12244242
申请日：2008-10-02
申请人： Kenichi Kawasaki
发明人： Kenichi Kawasaki
IPC分类号： G06F1/00 , H03J3/20
CPC分类号： H03J3/20
摘要： The semiconductor intergrated circuit comprises: a circuit that executes a predetermined process and a switching circuit that selects a power impedance, The switching circuit selects the power impedance, in accordance with a variation in voltage supplied to the circuit, so that a resonant frequency of the semiconductor integrated circuit is different from a operation frequency of the circuit.
摘要翻译：半导体集成电路包括：执行预定处理的电路和选择功率阻抗的开关电路。开关电路根据提供给电路的电压变化来选择功率阻抗，使得谐振频率半导体集成电路与电路的工作频率不同。

3. 发明授权

US08824529B2 Signal transmission system, transmitting device, receiving device, electronic device, and signal transmission method 有权
标题翻译：信号传输系统，发射设备，接收设备，电子设备和信号传输方法
公开(公告)号：US08824529B2
公开(公告)日：2014-09-02
申请号：US12929358
申请日：2011-01-19
申请人： Satoshi Fukuda , Kenichi Kawasaki , Satoru Shinke
发明人： Satoshi Fukuda , Kenichi Kawasaki , Satoru Shinke
IPC分类号： H04B1/38 , H04L27/12 , H04B1/40 , H01P1/20
CPC分类号： H04B1/40 , Y10S505/825 , Y10S505/866
摘要： A signal transmission system includes: a transmitting section including a first carrier signal generating section configured to generate a carrier signal for modulation and a first frequency converting section configured to generate a transmission signal by frequency-converting a transmission object signal by the carrier signal for modulation, the carrier signal for modulation being generated by the first carrier signal generating section; and a receiving section including a second carrier signal generating section configured to generate a carrier signal for demodulation and a second frequency converting section configured to frequency-convert the transmission signal received by the carrier signal for demodulation, the carrier signal for demodulation being generated by the second carrier signal generating section.
摘要翻译：信号传输系统包括：发送部分，包括被配置为产生用于调制的载波信号的第一载波信号产生部分和被配置为通过用于调制的载波信号对发送对象信号进行频率转换来生成发送信号的第一频率转换部分用于调制的载波信号由第一载波信号产生部分产生; 以及接收部，包括：第二载波信号生成部，被配置为生成用于解调的载波信号;以及第二频率转换部，被配置为对由所述载波信号进行解调的发送信号进行频率转换，所述解调用载波信号由第二载波信号生成部。

4. 发明授权

US08730646B2 Laminated electronic component and method for manufacturing the same 有权
标题翻译：层压电子部件及其制造方法
公开(公告)号：US08730646B2
公开(公告)日：2014-05-20
申请号：US12466435
申请日：2009-05-15
申请人： Kenichi Kawasaki , Shunsuke Takeuchi , Akihiro Motoki , Makoto Ogawa , Toshiyuki Iwanaga
发明人： Kenichi Kawasaki , Shunsuke Takeuchi , Akihiro Motoki , Makoto Ogawa , Toshiyuki Iwanaga
IPC分类号： H01G4/008 , H01G2/20 , H01G4/228
CPC分类号： H01G4/005 , H01G4/008 , H01G4/232
摘要： A laminated electronic component includes outer terminal electrodes including lower plating films including metal particles having an average size of 0.5 μm or less, the lower plating films being formed by directly plating an outer surface of an electronic component body such that the lower plating films are electrically connected to exposed portions of inner conductors. The outer terminal electrodes may further include upper plating films formed on the lower plating films, the upper plating films being defined by one or more layers. Metal particles defining the upper plating films may have an average size of 0.5 μm or less. The metal particles defining the lower plating films may be Cu particles.
摘要翻译：层叠电子部件包括外部端子电极，其包括具有平均尺寸为0.5μm以下的金属粒子的下部电镀膜，下部电镀膜通过直接电镀电子部件主体的外表面而形成，使得下部电镀膜为电气连接到内部导体的暴露部分。外部端子电极还可以包括形成在下部镀膜上的上部镀膜，上部镀膜由一层或多层限定。限定上镀膜的金属粒子的平均粒径可以为0.5μm以下。限定下镀层的金属颗粒可以是Cu颗粒。

5. 发明授权

US08716906B2 Electronic circuit device including a noise blocker 有权
标题翻译：包括噪声抑制器的电子电路装置
公开(公告)号：US08716906B2
公开(公告)日：2014-05-06
申请号：US12271735
申请日：2008-11-14
申请人： Kenichi Kawasaki
发明人： Kenichi Kawasaki
IPC分类号： H02J1/06
CPC分类号： H02J9/005 , Y10T307/398 , Y10T307/944
摘要： An electric circuit device operable under a first power supply includes: a first circuit; a switch connecting the first circuit with the first power supply; a second circuit for producing a signal output; a control signal output unit for outputting a control signal in accordance with the signal output of the second circuit, wherein while the first circuit is supplied with a first power supply voltage via the switch by supplying of a driving voltage to the switch, the supply of the driving voltage is temporality cut off in response to the control signal.
摘要翻译：可在第一电源下操作的电路装置包括：第一电路; 将第一电路与第一电源连接的开关; 用于产生信号输出的第二电路; 控制信号输出单元，用于根据第二电路的信号输出输出控制信号，其中当通过向开关提供驱动电压而经由开关向第一电路提供第一电源电压时，响应于控制信号，驱动电压被暂时切断。

6. 发明申请

US20130205049A1 SIGNAL PROCESSING DEVICE 有权
标题翻译：信号处理装置
公开(公告)号：US20130205049A1
公开(公告)日：2013-08-08
申请号：US13368838
申请日：2012-02-08
申请人： Kenichi Kawasaki , Yusuke Tanaka , Hiroyuki Yamagishi , Ali Hajimiri
发明人： Kenichi Kawasaki , Yusuke Tanaka , Hiroyuki Yamagishi , Ali Hajimiri
IPC分类号： G06F3/00
CPC分类号： H01L23/48 , G06F3/00 , H01L23/66 , H01L25/0655 , H01L25/105 , H01L2223/6627 , H01L2223/6677 , H01L2224/16145 , H01L2224/16225 , H01L2224/16227 , H01L2225/1011 , H01L2924/00014 , H01L2924/13091 , H05K1/0274 , H05K1/181 , H05K2201/10121 , H01L2924/00 , H01L2224/0401
摘要： A signal processing device includes: signal processing circuits. The signal processing circuit includes an input/output circuit configured by an input circuit serving as an input interface of a signal of a predetermined frequency band and/or an output circuit serving as an output interface of a signal of the frequency band and performs transmission of a signal of the frequency band between the signal processing circuit and another signal processing circuit. The output circuits of one and another signal processing circuits include circuits having the same configuration. The input circuits of the one and another signal processing circuits include other circuits having the same configurations. The input/output circuits of the one and another signal processing circuits can perform transmission of a signal of the predetermined frequency band even when any one of transmission media having mutually different characteristics is mediated.
摘要翻译：信号处理装置包括：信号处理电路。信号处理电路包括由用作预定频带的信号的输入接口的输入电路和/或用作频带的信号的输出接口的输出电路构成的输入/输出电路，并且执行信号处理电路和另一个信号处理电路之间的频带的信号。一个和另一个信号处理电路的输出电路包括具有相同配置的电路。一个和另一个信号处理电路的输入电路包括具有相同配置的其他电路。一个和另一个信号处理电路的输入/输出电路即使当介质具有相互不同的特性的传输介质中的任何一个时，也可以执行预定频带的信号的传输。

7. 发明授权

US08204455B2 Techniques for pre-distorting transmitted signals for a transmitter device 有权
标题翻译：用于对发射机设备的发射信号进行预失真的技术
公开(公告)号：US08204455B2
公开(公告)日：2012-06-19
申请号：US12340518
申请日：2008-12-19
申请人： Robert Hardacker , Kenichi Kawasaki
发明人： Robert Hardacker , Kenichi Kawasaki
IPC分类号： H04B1/04
CPC分类号： H04B1/0475 , H03F1/3241 , H04B2001/0425
摘要： Techniques for sending and receiving signals include pre-distorting signals before transmission across a communication path. The signals are pre-distorted as a function of a distortion on the communication path. In one embodiments, transmitter a broadcasts to receiver b and there is also a transmitter b broadcasting to receiver a. This return channel enables both transmitters a and b to have a priori information regarding the transmission medium and path the signal takes. In this way, the nature of the distortion or interference is known to the transmitter, therefore, it pre-distorts the transmitted signal to compensate for the receiver exceeding its capabilities in recovering signal.
摘要翻译：用于发送和接收信号的技术包括在通过通信路径传输之前的预失真信号。信号作为通信路径上的失真的函数被预失真。在一个实施例中，发射机a广播到接收机b，还有一个发射机b广播到接收机a。这个返回信道使得发射机a和b能够具有关于传输介质和信号所采用的路径的先验信息。以这种方式，发射机已知失真或干扰的性质，因此，它预先歪曲传输的信号，以补偿接收机超过恢复信号的能力。

8. 发明申请

US20120093041A1 Signal transmission apparatus, electronic instrument and signal transmission method 有权
标题翻译：信号传输装置，电子仪器和信号传输方法
公开(公告)号：US20120093041A1
公开(公告)日：2012-04-19
申请号：US13200919
申请日：2011-10-05
申请人： Takahiro Takeda , Kenichi Kawasaki
发明人： Takahiro Takeda , Kenichi Kawasaki
IPC分类号： H04W88/02 , H04L5/14
CPC分类号： H04B1/034 , H01P1/06
摘要： A signal transmission apparatus includes: a transmission section adapted to transmit a transmission object signal as a radio wave; a reception section adapted to receive the radio wave transmitted from the transmission section and output an electric signal corresponding to the received radio wave; and a connection section adapted to connect a first housing and a second housing of an electronic instrument pivotably around a center axis; the connection section having a radio signal transmission line formed therein by which wireless transmission can be carried out between the transmission section and the reception section.
摘要翻译：一种信号传输装置，包括：发送部，其适于发送作为无线电波的发送对象信号; 接收部，其适于接收从所述发送部发送的所述无线电波，并输出与所接收的无线电波相对应的电信号; 以及连接部分，其适于将电子仪器的第一壳体和第二壳体绕中心轴线可枢转地连接; 所述连接部分具有形成在其中的无线电信号传输线，通过所述无线电信号传输线可以在所述发送部分和所述接收部分之间进行无线

9. 发明授权

US08154848B2 Multilayer ceramic electronic component including external electrodes that include a plating layer having a low film stress 有权
标题翻译：包括具有低膜应力的镀层的外部电极的多层陶瓷电子部件
公开(公告)号：US08154848B2
公开(公告)日：2012-04-10
申请号：US12354026
申请日：2009-01-15
申请人： Akihiro Motoki , Makoto Ogawa , Shunsuke Takeuchi , Kenichi Kawasaki
发明人： Akihiro Motoki , Makoto Ogawa , Shunsuke Takeuchi , Kenichi Kawasaki
IPC分类号： H01G4/228 , H01G4/06
CPC分类号： H01G4/005 , H01G4/008 , H01G4/12 , H01G4/30
摘要： A multilayer ceramic electronic component includes a laminate including a stack of a plurality of ceramic layers and a plurality of internal electrodes extending along interfaces between the ceramic layers, and a plurality of external electrodes electrically connecting the internal electrodes exposed at surfaces of the laminate. Each external electrode includes a plating layer at least at the portion directly connected to the internal electrodes. The plating layer has a compressive film stress of about 100 MPa or less or a tensile film stress of about 100 MPa or less.
摘要翻译：多层陶瓷电子部件包括层叠体，其包括多个陶瓷层的叠层和沿着陶瓷层之间的界面延伸的多个内部电极，以及电连接在层叠体的表面露出的内部电极的多个外部电极。每个外部电极至少包括直接连接到内部电极的部分的镀层。镀层的压缩应力为约100MPa以下或拉伸膜应力为约100MPa以下。

10. 发明申请

US20120058257A1 LAMINATED ELECTRONIC COMPONENT AND METHOD FOR MANUFACTURING THE SAME 有权
标题翻译：层压电子元件及其制造方法
公开(公告)号：US20120058257A1
公开(公告)日：2012-03-08
申请号：US13295151
申请日：2011-11-14
申请人： Shunsuke TAKEUCHI , Kenichi KAWASAKI , Akihiro MOTOKI , Makoto OGAWA , Toshiyuki IWANAGA
发明人： Shunsuke TAKEUCHI , Kenichi KAWASAKI , Akihiro MOTOKI , Makoto OGAWA , Toshiyuki IWANAGA
IPC分类号： B05D5/12
CPC分类号： H01G4/008 , H01G4/005 , H01G4/2325 , Y10T29/417 , Y10T29/43 , Y10T29/435
摘要： A laminated electronic component is configured to include substrate plating films disposed on outer surfaces of an electronic component main body through direct plating such that external terminal electrodes are connected to exposed portions of internal conductors (internal electrodes), and the average particle diameter of metal particles defining the substrate plating film is at least about 1.0 μm. The external terminal electrode includes at least one layer of an upper plating film disposed on the substrate plating film. The metal particles defining the substrate plating film are Cu particles.
摘要翻译：层叠电子部件被配置为包括通过直接电镀设置在电子部件主体的外表面上的基板镀膜，使得外部端子电极与内部导体（内部电极）的露出部分连接，金属粒子的平均粒径限定衬底镀膜至少约1.0μm。外部端子电极包括设置在基板镀膜上的至少一层上镀层。限定衬底镀膜的金属颗粒是Cu颗粒。

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