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1. 发明申请

US20110304380A1 SEMICONDUCTOR DEVICE 失效
标题翻译：半导体器件
公开(公告)号：US20110304380A1
公开(公告)日：2011-12-15
申请号：US12962809
申请日：2010-12-08
申请人： Koichi Nakayama , Tetsuyoshi Shiota , Kenichi Kawasaki
发明人： Koichi Nakayama , Tetsuyoshi Shiota , Kenichi Kawasaki
IPC分类号： H03K17/16
CPC分类号： H03K19/0016 , Y10T307/702 , Y10T307/74 , Y10T307/858
摘要： A semiconductor device includes: a first power line to supply a first voltage to a plurality of internal circuits; a second power line to supply the first voltage to the plurality of internal circuits; a first switch provided between said first power line and each of the plurality of internal circuits; a second switch provided between said second power line and each of the plurality of internal circuits; and a control circuit to control the first switch of a second internal circuit included in the plurality of the internal circuits based on the amounts of noise and voltage drop at power-on in a first circuit included in the plurality of internal circuits.
摘要翻译：半导体器件包括：向多个内部电路提供第一电压的第一电力线; 第二电力线，用于向所述多个内部电路提供所述第一电压; 设置在所述第一电力线与所述多个内部电路中的每一个之间的第一开关; 设置在所述第二电力线与所述多个内部电路中的每一个之间的第二开关; 以及控制电路，其基于在所述多个内部电路中包括的第一电路中的通电时的噪声和电压降的量来控制包括在所述多个内部电路中的第二内部电路的第一开关。

2. 发明授权

US08704410B2 Semiconductor device 失效
标题翻译：半导体器件
公开(公告)号：US08704410B2
公开(公告)日：2014-04-22
申请号：US12962809
申请日：2010-12-08
申请人： Koichi Nakayama , Tetsuyoshi Shiota , Kenichi Kawasaki
发明人： Koichi Nakayama , Tetsuyoshi Shiota , Kenichi Kawasaki
IPC分类号： H01H47/00
CPC分类号： H03K19/0016 , Y10T307/702 , Y10T307/74 , Y10T307/858
摘要： A semiconductor device includes: a first power line to supply a first voltage to a plurality of internal circuits; a second power line to supply the first voltage to the plurality of internal circuits; a first switch provided between said first power line and each of the plurality of internal circuits; a second switch provided between said second power line and each of the plurality of internal circuits; and a control circuit to control the first switch of a second internal circuit included in the plurality of the internal circuits based on the amounts of noise and voltage drop at power-on in a first circuit included in the plurality of internal circuits.
摘要翻译：半导体器件包括：向多个内部电路提供第一电压的第一电力线; 第二电力线，用于向所述多个内部电路提供所述第一电压; 设置在所述第一电力线与所述多个内部电路中的每一个之间的第一开关; 设置在所述第二电力线与所述多个内部电路中的每一个之间的第二开关; 以及控制电路，其基于在所述多个内部电路中包括的第一电路中的通电时的噪声和电压降的量来控制包括在所述多个内部电路中的第二内部电路的第一开关。

3. 发明授权

US09136214B2 Method for manufacturing multilayer wiring board 有权
标题翻译：多层布线板的制造方法
公开(公告)号：US09136214B2
公开(公告)日：2015-09-15
申请号：US12691226
申请日：2010-01-21
申请人： Shigeki Chujo , Koichi Nakayama
发明人： Shigeki Chujo , Koichi Nakayama
IPC分类号： H05K3/30 , H01L23/498 , H01L21/48 , H05K3/44 , H05K3/46 , H01L21/683 , H05K1/03 , H05K3/38 , H05K3/42
CPC分类号： H05K3/4076 , C23C16/0245 , C23C16/18 , H01L21/486 , H01L21/6835 , H01L23/49827 , H01L2924/0002 , H05K1/0306 , H05K3/0041 , H05K3/0079 , H05K3/388 , H05K3/423 , H05K3/445 , H05K3/4605 , H05K3/4644 , H05K3/4679 , H05K2201/09563 , H05K2201/096 , H05K2203/095 , Y10T29/49155 , H01L2924/00
摘要： A multilayer wiring board has a high degree of freedom of wiring design and can realize high-density wiring, and a method to simply manufacture the multilayer wiring board. A core substrate with two or more wiring layers provided thereon through an electrical insulating layer. The core substrate has a plurality of throughholes filled with an electroconductive material, and the front side and back side of the core substrate have been electrically conducted to each other by the electroconductive material. The throughholes have an opening diameter in the range of 10 to 100 μm. An insulation layer and an electroconductive material diffusion barrier layer are also provided, and the electroconductive material is filled into the throughholes through the insulation layer. A first wiring layer provided through an electrical insulating layer on the core substrate is connected to the electroconductive material filled into the throughhole through via.
摘要翻译：多层布线板具有高自由度的布线设计并且可以实现高密度布线，以及简单地制造多层布线板的方法。具有通过电绝缘层设置在其上的两个或多个布线层的芯基板。芯基板具有填充有导电材料的多个通孔，并且芯基板的前侧和后侧通过导电材料彼此导电。通孔的开口直径在10〜100μm的范围内。还提供绝缘层和导电材料扩散阻挡层，并且导电材料通过绝缘层填充到通孔中。通过芯基板上的电绝缘层提供的第一布线层通过通孔连接到填充到通孔中的导电材料。

4. 发明授权

US08469754B1 Outboard motor 有权
标题翻译：舷外马达
公开(公告)号：US08469754B1
公开(公告)日：2013-06-25
申请号：US13081532
申请日：2011-04-07
申请人： Shinya Maekawa , Koichi Nakayama , Toshio Suzuki , Katsumi Ochiai
发明人： Shinya Maekawa , Koichi Nakayama , Toshio Suzuki , Katsumi Ochiai
IPC分类号： B63H21/32
CPC分类号： B63H20/24 , B63H20/26 , F01N13/085 , F01N13/12 , F01N2570/22 , F01N2590/021
摘要： An outboard motor includes an exhaust passage, a catalyst member, and a water capture member. The exhaust passage includes a first passage, a second passage, a third passage, and a fourth passage. The first passage is connected to exhaust ports, extends in a vertical direction, and collects exhaust discharged from the exhaust ports. The second passage extends laterally from the first passage. The third passage is connected to the second passage, extends downward from the second passage, and is disposed on a side of cylinders of an engine. The fourth passage is connected to the third passage, is positioned below the engine, and guides the exhaust to below the engine. The fourth passage discharges exhaust to the outside via a propeller boss of a propeller. The catalyst member is disposed in the third passage. The water capture member is disposed downstream of the catalyst member in the third passage.
摘要翻译：舷外马达包括排气通道，催化剂构件和捕水构件。排气通道包括第一通道，第二通道，第三通道和第四通道。第一通道连接到排气口，沿垂直方向延伸，并且收集从排气口排出的废气。第二通道从第一通道横向延伸。第三通道连接到第二通道，从第二通道向下延伸，并且设置在发动机的气缸的一侧。第四通道连接到第三通道，位于发动机下方，并将排气引导到发动机下方。第四通道通过螺旋桨的推进器凸起将排气排放到外部。催化剂构件设置在第三通道中。捕集构件设置在第三通道中的催化剂构件的下游。

5. 发明申请

US20130062771A1 DESIGN METHOD OF WIRING LAYOUT, SEMICONDUCTOR DEVICE, PROGRAM FOR SUPPORTING DESIGN OF WIRING LAYOUT, AND METHOD FOR MANUFACTURING SEMICONDUCTOR DEVICE 审中-公开
公开(公告)号：US20130062771A1
公开(公告)日：2013-03-14
申请号：US13405922
申请日：2012-02-27
申请人： Chikaaki KODAMA , Koichi Nakayama , Toshiya Kotani , Shigeki Nojima
发明人： Chikaaki KODAMA , Koichi Nakayama , Toshiya Kotani , Shigeki Nojima
IPC分类号： H01L23/48 , H01L21/311 , G06F17/50
CPC分类号： H01L21/31144 , G06F17/5077 , H01L21/0337 , H01L21/0338 , H01L21/76816 , H01L23/528 , H01L2924/0002 , H01L2924/00
摘要： According to one embodiment, a design method of layout formed by a sidewall method is provided. The method includes: preparing a base pattern on which a plurality of first patterns extending in a first direction and arranged at a first space in a second direction intersecting the first direction and a plurality of second patterns extending in the first direction and arranged at a center between the first patterns, respectively, are provided; and drawing a connecting portion which extends in the second direction and connects two neighboring first patterns sandwiching one of the second patterns, and separating the one of the second patterns into two patterns not contacting the connecting portion.

6. 发明申请

US20110200559A1 METHOD FOR PRODUCTION OF THREE-DIMENSIONAL STRUCTURE OF CELLS 有权
标题翻译：生产细胞三维结构的方法
公开(公告)号：US20110200559A1
公开(公告)日：2011-08-18
申请号：US12450542
申请日：2008-03-13
申请人： Toshinobu Koga , Soichi Nagasato , Yukihide Iwamoto , Koichi Nakayama
发明人： Toshinobu Koga , Soichi Nagasato , Yukihide Iwamoto , Koichi Nakayama
IPC分类号： A61K35/00 , A61P19/02 , C12N5/071
CPC分类号： C12N5/0062 , A61L27/3843 , C12M23/08 , C12M25/00 , C12N11/00
摘要： The present invention provides a method for arranging various cells as cell clusters in an arbitrary three-dimensional space and producing a three dimensional structure of a desired shape constituted exclusively by cells. Furthermore, the present invention provides a support provided with a substrate and a thread or needle-shaped material that penetrates the substrate and cell clusters for positioning cell clusters in arbitrary space. The support is provided with a sheet that can be removed as necessary for covering the substrate. Further, a method for using the support structure to position cell clusters in an arbitrary space and a method for the production of three-dimensional cell structures are provided.
摘要翻译：本发明提供一种用于将各种单元格作为单元格簇排列在任意的三维空间中并产生由单元构成的期望形状的三维结构的方法。此外，本发明提供了一种支撑体，其具有基板和穿过基板的螺纹或针状材料和用于将细胞簇定位在任意空间中的细胞簇。该支撑体设置有可根据需要移除以覆盖衬底的片材。此外，提供了一种使用支撑结构来将单元格簇定位在任意空间中的方法和用于制造三维单元结构的方法。

7. 发明申请

US20110120796A1 MOTORCYCLE 有权
标题翻译：摩托车
公开(公告)号：US20110120796A1
公开(公告)日：2011-05-26
申请号：US12999877
申请日：2009-06-10
申请人： Daisuke Kuramochi , Hikaru Yokomura , Yuji Tsujimoto , Koichi Nakayama
发明人： Daisuke Kuramochi , Hikaru Yokomura , Yuji Tsujimoto , Koichi Nakayama
IPC分类号： B62K11/02 , B62K11/12
CPC分类号： F02M25/0854 , B62J37/00 , F02M25/089
摘要： Disclosed is a motorcycle fitted with a canister. A canister (55) is disposed along the body frame (20) at a position outside the body frame and closer to the body frame than the tip end of a tandem step (54R).
摘要翻译：公开了一种配有罐的摩托车。罐体（55）沿着主体框架（20）设置在主体框架外部的位置，并且比串联台阶（54R）的末端更靠近主体框架。

8. 发明申请

US20110106005A1 DEVICE FOR CELL TRANSPLANTATION 失效
标题翻译：细胞移植装置
公开(公告)号：US20110106005A1
公开(公告)日：2011-05-05
申请号：US12809104
申请日：2007-12-21
申请人： Yukihide Iwamoto , Koichi Nakayama , Hiromasa Miura , Kazuhiro Tanaka , Shuichi Matsuda
发明人： Yukihide Iwamoto , Koichi Nakayama , Hiromasa Miura , Kazuhiro Tanaka , Shuichi Matsuda
IPC分类号： A61M5/31
CPC分类号： A61F2/4601 , A61B2017/00969 , A61F2/4618
摘要： The present invention provides a cell transplantation device which is capable of inserting cells for transplantation into a cell-deficient site without application of direct external force to the cells. The present invention discloses a cell transplantation device provided with a plate-type carrier with at least one pass-through hole formed on its side surface, a linear member to be threaded through the pass-through hole, and a pusher member which engages with the linear member that comes out from each exit of the pass-through holes.
摘要翻译：本发明提供一种细胞移植装置，其能够将移植细胞插入细胞缺陷部位，而不对细胞施加直接的外力。本发明公开了一种细胞移植装置，其具有板状载体，其侧表面上形成有至少一个贯通孔，穿过该贯通孔的直线构件以及与该贯穿孔相接合的推动构件从通孔的每个出口出来的线性构件。

9. 发明授权

US07687566B2 Propylene resin composition and molding thereof 有权
标题翻译：丙烯树脂组合物及其成型
公开(公告)号：US07687566B2
公开(公告)日：2010-03-30
申请号：US10592797
申请日：2005-02-04
申请人： Akihiro Matsuki , Shinichi Kanamaru , Yutaka Fukuyama , Nobutake Mise , Eihachi Takamura , Koichi Nakayama
发明人： Akihiro Matsuki , Shinichi Kanamaru , Yutaka Fukuyama , Nobutake Mise , Eihachi Takamura , Koichi Nakayama
IPC分类号： B60C1/00 , C08K3/04 , C01D3/00 , C01B31/02 , C09C1/48
CPC分类号： C08L23/0815 , C01P2006/19 , C08F297/08 , C08F297/083 , C08K3/04 , C08L23/10 , C08L53/00 , C09C1/48 , C09C1/50 , C08L2666/02 , C08L2666/24 , C08L2666/04
摘要： To provide a propylene resin composition excellent in both the electroconductivity and moldability and excellent in their balance, and a molded product thereof.A propylene resin composition comprising from 50 to 98 wt % of a propylene resin having a MFR of from 5 to 300 g/10 min, and from 2 to 50 wt % of carbon black having a 24M4DBP absorption of at least 130 cm3/100 g, a dehydrogenation amount of at most 1.2 mg/g at 1,500° C. for 30 minutes and a crystallite size (Lc) of from 10 to 17 Å. A propylene resin molded product which is a propylene resin molded product obtained by molding such a propylene resin composition and which has a volume resistivity of from 102 to 109 Ω·cm and a MFR of from 1 to 80 g/10 min.
摘要翻译：为了提供导电性和成型性都优异且平衡性优异的丙烯树脂组合物及其成型体。一种丙烯树脂组合物，其包含50至98重量％的MFR为5至300g / 10min的丙烯树脂和2至50重量％的具有至少130cm 3 / 100g的24M4DBP吸收的炭黑，在1,500℃下脱氢量为至多1.2mg / g，持续30分钟，微晶尺寸（Lc）为10至17。丙烯树脂成型体，其是通过模塑这种丙烯树脂组合物而得到的丙烯树脂成型体，其体积电阻率为102〜109Ω·cm·cm，MFR为1〜80g / 10min。

10. 发明申请

US20060185141A1 Multilayer wiring board and manufacture method thereof 有权
公开(公告)号：US20060185141A1
公开(公告)日：2006-08-24
申请号：US11410984
申请日：2006-04-26
申请人： Toshiaki Mori , Kazunori Nakamura , Satoru Kuramochi , Miyuki Akazawa , Koichi Nakayama
发明人： Toshiaki Mori , Kazunori Nakamura , Satoru Kuramochi , Miyuki Akazawa , Koichi Nakayama
IPC分类号： H01G7/00 , H01K3/10
CPC分类号： H01L23/49827 , H01L23/49822 , H01L2924/0002 , H01L2924/09701 , H01L2924/3011 , H05K1/0306 , H05K1/0366 , H05K1/162 , H05K3/0041 , H05K3/0044 , H05K3/388 , H05K3/4061 , H05K3/4069 , H05K3/4076 , H05K3/426 , H05K3/4605 , H05K2201/0195 , H05K2201/068 , H05K2201/09563 , H05K2201/09581 , H05K2201/09763 , H05K2201/09827 , H05K2203/025 , H05K2203/1338 , H05K2203/1581 , Y10T29/43 , Y10T29/49117 , Y10T29/49124 , Y10T29/49126 , Y10T29/49153 , Y10T29/49155 , Y10T29/49165 , H01L2924/00
摘要： In a multilayer wiring board comprising a core board, and a wiring layer and an electrically insulating layer that are stacked on one surface of said core board, a thermal expansion coefficient of said core board in XY directions falls within a range of 2 to 20 ppm, a core member for said core board is a core member selected from silicon, ceramics, glass, a glass-epoxy composite, and metal, said core board is provided with a plurality of through holes that are made conductive between the front and the back by a conductive material, and a capacitor is provided on one surface of said core board, wherein said capacitor comprises an upper electrode being the conductive material in said through hole, and a lower electrode disposed so as to confront said upper electrode via a dielectric layer.

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