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1. 发明申请

US20120188683A1 METHOD FOR MANUFACTURING CERAMIC ELECTRONIC COMPONENT AND CERAMIC ELECTRONIC COMPONENT 有权
标题翻译：陶瓷电子元件和陶瓷电子元件的制造方法
公开(公告)号：US20120188683A1
公开(公告)日：2012-07-26
申请号：US13357671
申请日：2012-01-25
申请人： Syunsuke TAKEUCHI , Teruyo KATAYAMA , Toshiyuki IWANAGA , Akihiro MOTOKI , Makoto OGAWA , Kenichi KAWASAKI
发明人： Syunsuke TAKEUCHI , Teruyo KATAYAMA , Toshiyuki IWANAGA , Akihiro MOTOKI , Makoto OGAWA , Kenichi KAWASAKI
IPC分类号： H01G4/12 , C25D7/00 , H01L41/00 , B05D3/00 , H01F5/00 , H01C7/13 , C25D5/54 , B05D5/00
CPC分类号： H01C1/148 , H01C7/008 , H01C7/18 , H01G4/012 , H01G4/232 , H01G4/30
摘要： A method for manufacturing a ceramic electronic component includes the steps of preparing a ceramic body including a plurality of first internal electrodes and a plurality of second internal electrodes, processing the ceramic body to an internal electrode exposure rate of about 102% to about 153%, and plating the processed ceramic body to form a plated layer thereon.
摘要翻译：陶瓷电子部件的制造方法包括以下步骤：制备包括多个第一内部电极和多个第二内部电极的陶瓷体，将所述陶瓷体加工成约102％〜约153％的内部电极曝光率，并对其进行电镀，在其上形成镀层。

2. 发明申请

US20110234045A1 LAMINATED CERAMIC ELECTRONIC COMPONENT AND MANUFACTURING METHOD THEREFOR 有权
标题翻译：层压陶瓷电子元件及其制造方法
公开(公告)号：US20110234045A1
公开(公告)日：2011-09-29
申请号：US13050977
申请日：2011-03-18
申请人： Akihiro MOTOKI , Syunsuke TAKEUCHI , Makoto OGAWA , Seiichi NISHIHARA , Kenichi KAWASAKI , Shuji MATSUMOTO
发明人： Akihiro MOTOKI , Syunsuke TAKEUCHI , Makoto OGAWA , Seiichi NISHIHARA , Kenichi KAWASAKI , Shuji MATSUMOTO
IPC分类号： H01L41/00 , H01C7/13 , H01F5/00 , H01G4/12 , C04B33/32
CPC分类号： H01G4/248 , B32B18/00 , B32B37/18 , B32B2307/202 , B32B2315/02 , B32B2457/00 , C23C18/40 , H01G4/005 , H01G4/012 , H01G4/12 , H01G4/228 , H01G4/30
摘要： In a method of forming a plating layer for an external terminal electrode by applying, for example, copper plating to an end surface of a component main body with respective ends of internal electrodes exposed, and then applying a heat treatment at a temperature of about 1000° C. or more in order to improve the adhesion strength and moisture resistance of the external terminal electrode, the plating layer may be partially melted to decrease the bonding strength of the plating layer. In the step of applying a heat treatment at a temperature of about 1000° C. or more to a component main body with plating layers formed thereon, the average rate of temperature increase from room temperature to the temperature of about 1000° C. or more is set to about 100° C./minute or more. This average rate of temperature increase maintains a moderate eutectic state in the plating layer and ensures a sufficient bonding strength of the plating layer.
摘要翻译：在形成外部端子电极用镀层的方法中，例如通过对内部电极的两端露出的部件主体的端面进行镀铜，然后在约1000℃的温度下进行热处理 ℃以上，为了提高外部端子电极的粘合强度和耐湿性，可以使镀层部分熔融，降低镀层的接合强度。在其上形成有镀层的组件主体上，在约1000℃以上的温度下进行热处理的步骤中，平均温度从室温升高至约1000℃以上的温度设定为约100℃/分钟以上。该平均升温速率在镀层中保持中等的共晶状态，并确保镀层的充分的接合强度。

3. 发明申请

US20110236658A1 LAMINATED ELECTRONIC COMPONENT 有权
标题翻译：层压电子元件
公开(公告)号：US20110236658A1
公开(公告)日：2011-09-29
申请号：US13045585
申请日：2011-03-11
申请人： Akihiro MOTOKI , Syunsuke TAKEUCHI , Makoto OGAWA , Kenichi KAWASAKI
发明人： Akihiro MOTOKI , Syunsuke TAKEUCHI , Makoto OGAWA , Kenichi KAWASAKI
IPC分类号： B32B7/02
CPC分类号： H01G4/30 , H01G4/232 , H01G4/2325
摘要： A laminated electronic component includes a first plating film that defines a base for external terminal electrodes and that includes a plurality of layers including a first layer made of, for example, copper and a second layer provided on the first layer. The total thickness of the first plating film is about 3 μm to about 15 μm, and the thickness of the second layer is about 2 to 10 times as thick as the thickness of the first layer. The first layer is formed by electroless plating, and the second layer is formed by electrolytic plating. This formation results in a grain size of about 0.5 μm or more of a metal grain included in the second layer, and thus makes the film less susceptible to oxidation.
摘要翻译：层叠电子部件包括：第一镀膜，其限定外部端子电极的基部，并且包括多个层，所述多个层包括由例如铜制成的第一层和设置在第一层上的第二层。第一镀膜的总厚度为约3μm至约15μm，第二层的厚度为第一层的厚度的约2至10倍。第一层由无电镀形成，第二层通过电解电镀形成。这种形成导致包含在第二层中的金属颗粒的晶粒尺寸为约0.5μm以上，因此使膜不易氧化。

4. 发明申请

US20110122540A1 LAMINATED ELECTRONIC COMPONENT 有权
标题翻译：层压电子元件
公开(公告)号：US20110122540A1
公开(公告)日：2011-05-26
申请号：US12943072
申请日：2010-11-10
申请人： Makoto OGAWA , Akihiro MOTOKI , Syunsuke TAKEUCHI , Kenichi KAWASAKI
发明人： Makoto OGAWA , Akihiro MOTOKI , Syunsuke TAKEUCHI , Kenichi KAWASAKI
IPC分类号： H01G4/008
CPC分类号： H01G4/2325 , H01G4/30
摘要： A laminated electronic component includes a component body including a plurality of laminated functional layers, a plurality of internal conductors provided inside the component body, and an external terminal electrode that is electrically connected to an internal conductor via an exposed portion of the internal conductor and that is defined by a direct plating film. An average grain diameter of metal grains defining the plating film is about 0.1 μm or less.
摘要翻译：层叠电子部件包括：具有多个层叠功能层的多个内部导体和设置在所述部件主体内侧的多个内部导体的部件体以及经由所述内部导体的露出部与内部导体电连接的外部端子电极，由直接电镀膜定义。限定镀膜的金属颗粒的平均粒径为约0.1μm以下。

5. 发明申请

US20120058257A1 LAMINATED ELECTRONIC COMPONENT AND METHOD FOR MANUFACTURING THE SAME 有权
标题翻译：层压电子元件及其制造方法
公开(公告)号：US20120058257A1
公开(公告)日：2012-03-08
申请号：US13295151
申请日：2011-11-14
申请人： Shunsuke TAKEUCHI , Kenichi KAWASAKI , Akihiro MOTOKI , Makoto OGAWA , Toshiyuki IWANAGA
发明人： Shunsuke TAKEUCHI , Kenichi KAWASAKI , Akihiro MOTOKI , Makoto OGAWA , Toshiyuki IWANAGA
IPC分类号： B05D5/12
CPC分类号： H01G4/008 , H01G4/005 , H01G4/2325 , Y10T29/417 , Y10T29/43 , Y10T29/435
摘要： A laminated electronic component is configured to include substrate plating films disposed on outer surfaces of an electronic component main body through direct plating such that external terminal electrodes are connected to exposed portions of internal conductors (internal electrodes), and the average particle diameter of metal particles defining the substrate plating film is at least about 1.0 μm. The external terminal electrode includes at least one layer of an upper plating film disposed on the substrate plating film. The metal particles defining the substrate plating film are Cu particles.
摘要翻译：层叠电子部件被配置为包括通过直接电镀设置在电子部件主体的外表面上的基板镀膜，使得外部端子电极与内部导体（内部电极）的露出部分连接，金属粒子的平均粒径限定衬底镀膜至少约1.0μm。外部端子电极包括设置在基板镀膜上的至少一层上镀层。限定衬底镀膜的金属颗粒是Cu颗粒。

6. 发明申请

US20100118467A1 LAMINATED CERAMIC ELECTRONIC COMPONENT 有权
标题翻译：层压陶瓷电子元件
公开(公告)号：US20100118467A1
公开(公告)日：2010-05-13
申请号：US12616844
申请日：2009-11-12
申请人： Shunsuke TAKEUCHI , Kenichi KAWASAKI , Akihiro MOTOKI , Makoto OGAWA , Toshiyuki IWANAGA
发明人： Shunsuke TAKEUCHI , Kenichi KAWASAKI , Akihiro MOTOKI , Makoto OGAWA , Toshiyuki IWANAGA
IPC分类号： H01G4/228
CPC分类号： H01G4/232 , H01G4/2325 , H01G4/30
摘要： In a laminated ceramic electronic component, external terminal electrodes include plating films directly covering exposed portions of internal electrodes on end surfaces of a ceramic element assembly. On the boundaries between the end surfaces and principal surfaces of the ceramic element assembly, substantially rounded corners are provided, and the plating films are arranged such that the ends of the plating films stop at the corners and do not project from the principal surfaces.
摘要翻译：在层叠陶瓷电子部件中，外部端子电极包括直接覆盖陶瓷元件组件的端面上的内部电极的露出部分的电镀膜。在陶瓷元件组件的端面和主面之间的边界上，设置大致圆角，并且镀膜被布置成使得镀膜的端部停止在角部并且不从主表面突出。

7. 发明申请

US20090323253A1 MULTILAYER CERAMIC ELECTRONIC COMPONENT AND METHOD FOR MAKING THE SAME 有权
标题翻译：多层陶瓷电子元件及其制造方法
公开(公告)号：US20090323253A1
公开(公告)日：2009-12-31
申请号：US12490471
申请日：2009-06-24
申请人： Tatsunori KOBAYASHI , Akihiro MOTOKI , Makoto OGAWA , Toshiyuki IWANAGA , Shunsuke TAKEUCHI , Kenichi KAWASAKI
发明人： Tatsunori KOBAYASHI , Akihiro MOTOKI , Makoto OGAWA , Toshiyuki IWANAGA , Shunsuke TAKEUCHI , Kenichi KAWASAKI
IPC分类号： H01G4/30 , B05D5/12
CPC分类号： H01G4/005 , H01G4/232 , H01G4/30 , Y10T29/435
摘要： A multilayer ceramic electronic component includes external terminal electrodes that are formed by depositing metal plating films on exposed portions of internal conductors embedded in a ceramic body, depositing a copper plating films that cover the metal plating films and make contact with the ceramic body around the metal plating films, and heat-treating the ceramic body to generate a copper liquid phase, an oxygen liquid phase, and a copper solid phase between the copper plating films and the ceramic body. The mixed phase including these phases forms a region at which a copper oxide is present in a discontinuous manner inside the copper plating film at least at the interfaces between the ceramic body and the copper plating films. The copper oxide securely attaches the copper plating films to the ceramic body and enhances the bonding force of the external terminal electrodes.
摘要翻译：多层陶瓷电子部件包括外部端子电极，其通过在嵌入陶瓷体的内部导体的露出部分上沉积金属电镀膜而形成，沉积覆盖金属电镀膜的铜电镀膜并与金属周围的陶瓷体接触并对该陶瓷体进行热处理，以在铜镀膜和陶瓷体之间产生铜液相，氧液相，铜固相。包括这些相的混合相至少在陶瓷体和镀铜膜之间的界面处形成铜镀层内不连续地存在氧化铜的区域。铜氧化物将铜电镀膜牢固地附着在陶瓷体上，提高外部端子电极的结合力。

8. 发明申请

US20100302704A1 LAMINATED ELECTRONIC COMPONENT AND MANUFACTURING METHOD THEREFOR 有权
标题翻译：层压电子元件及其制造方法
公开(公告)号：US20100302704A1
公开(公告)日：2010-12-02
申请号：US12788340
申请日：2010-05-27
申请人： Makoto OGAWA , Akihiro MOTOKI , Masahito SARUBAN , Toshiyuki IWANAGA , Shunsuke TAKEUCHI , Kenichi KAWASAKI
发明人： Makoto OGAWA , Akihiro MOTOKI , Masahito SARUBAN , Toshiyuki IWANAGA , Shunsuke TAKEUCHI , Kenichi KAWASAKI
IPC分类号： H01G4/228 , B05D5/12
CPC分类号： H01G4/30 , H01G4/2325
摘要： A method for manufacturing a laminated electronic component includes the steps of preparing a component main body having a laminated structure, the component main body including a plurality of internal electrodes formed therein, and each of the internal electrodes being partially exposed on an external surface of the component main body, and forming an external terminal electrode on the external surface of the component main body such that the external terminal electrode is electrically connected to the internal electrodes. The step of forming the external terminal electrode includes the steps of forming a metal layer on exposed surfaces of the internal electrodes of the component main body, applying a water repellant on at least a surface of the metal layer and on a section of the external surface of the component main body at which an end edge of the metal layer is located, and then forming a conductive resin layer on the metal layer having the water repellant applied thereon.
摘要翻译：层叠电子部件的制造方法包括以下步骤：制备具有层叠结构的部件主体，所述部件主体包括形成在其中的多个内部电极，所述内部电极部分地露出在所述内部电极的外表面上并且在所述部件主体的外表面上形成外部端子电极，使得所述外部端子电极与所述内部电极电连接。形成外部端子电极的步骤包括以下步骤：在组件主体的内部电极的暴露表面上形成金属层，在金属层的至少一个表面上以及外部表面的一部分上施加斥水剂在金属层的端缘所在的部件主体上形成导电性树脂层，并且在其上涂敷斥水剂的金属层上形成导电性树脂层。

9. 发明申请

US20090268372A1 CERAMIC ELECTRONIC COMPONENT AND METHOD FOR MANUFACTURING THE SAME 有权
标题翻译：陶瓷电子元件及其制造方法
公开(公告)号：US20090268372A1
公开(公告)日：2009-10-29
申请号：US12356561
申请日：2009-01-21
申请人： Makoto OGAWA , Akihiro MOTOKI , Ichiro NAKAMURA , Norihiro YOSHIKAWA , Toshiyuki IWANAGA , Kenichi KAWASAKI , Shunsuke TAKEUCHI
发明人： Makoto OGAWA , Akihiro MOTOKI , Ichiro NAKAMURA , Norihiro YOSHIKAWA , Toshiyuki IWANAGA , Kenichi KAWASAKI , Shunsuke TAKEUCHI
IPC分类号： H01G4/228 , B32B38/00 , C25D7/00
CPC分类号： H01G4/2325 , C25D5/50 , C25D7/00 , C25D15/00 , H01G4/30
摘要： When external electrodes of a multilayer ceramic capacitor are formed by performing direct plating on surfaces at which internal electrodes are exposed without forming paste electrode layers, bonding forces of plating layers are relatively weak, and in addition, when glass particles are included in the plating layers, blisters are often generated. To overcome these problems, a multilayer ceramic capacitor is formed by performing electrolytic plating using a plating bath including glass particles, electrolytic plating layers including glass particles dispersed therein are formed as the external electrodes.
摘要翻译：当多层陶瓷电容器的外部电极通过在内部电极暴露的表面上进行直接电镀形成而不形成糊状电极层而形成时，镀层的结合力相对较弱，此外，当镀层中包含玻璃粒子时通常会产生水疱。为了克服这些问题，通过使用包括玻璃颗粒的电镀液进行电解电镀形成多层陶瓷电容器，形成包括分散在其中的玻璃粒子的电解电镀层作为外部电极。

10. 发明申请

US20120140374A1 LAMINATED ELECTRONIC COMPONENT AND METHOD FOR MANUFACTURING THE SAME 有权
标题翻译：层压电子元件及其制造方法
公开(公告)号：US20120140374A1
公开(公告)日：2012-06-07
申请号：US13365280
申请日：2012-02-03
申请人： Kenichi KAWASAKI , Shunsuke TAKEUCHI , Akihiro MOTOKI , Makoto OGAWA , Toshiyuki IWANAGA
发明人： Kenichi KAWASAKI , Shunsuke TAKEUCHI , Akihiro MOTOKI , Makoto OGAWA , Toshiyuki IWANAGA
IPC分类号： H01G4/12 , H01F5/02 , H01C7/13 , H01L41/047
CPC分类号： H01G4/005 , H01G4/008 , H01G4/232
摘要： A laminated electronic component includes outer terminal electrodes including lower plating films including metal particles having an average size of 0.5 μm or less, the lower plating films being formed by directly plating an outer surface of an electronic component body such that the lower plating films are electrically connected to exposed portions of inner conductors. The outer terminal electrodes may further include upper plating films formed on the lower plating films, the upper plating films being defined by one or more layers. Metal particles defining the upper plating films may have an average size of 0.5 μm or less. The metal particles defining the lower plating films may be Cu particles.
摘要翻译：层叠电子部件包括外部端子电极，其包括具有平均尺寸为0.5μm以下的金属粒子的下部电镀膜，下部电镀膜通过直接电镀电子部件主体的外表面而形成，使得下部电镀膜为电气连接到内部导体的暴露部分。外部端子电极还可以包括形成在下部镀膜上的上部镀膜，上部镀膜由一层或多层限定。限定上镀膜的金属粒子的平均粒径可以为0.5μm以下。限定下镀层的金属颗粒可以是Cu颗粒。

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