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    • 113. 发明申请
    • Creation and Translation of Low-Relieff Texture for a Photovoltaic Cell
    • 光伏电池Low-Relieff纹理的创建和翻译
    • US20100184248A1
    • 2010-07-22
    • US12750635
    • 2010-03-30
    • Mohamed M. HilaliS. Brad Herner
    • Mohamed M. HilaliS. Brad Herner
    • H01L31/0236H01L31/18
    • H01L31/0236Y02E10/50
    • Low-relief texture can be created by applying and firing frit paste on a silicon surface. Where frit contacts the surface at high temperature, it etches silicon, dissolving silicon in the softened glass frit. The result is a series of small, randomly located pits, which produce a near-Lambertian surface, suitable for use in a photovoltaic cell. This texturing method consumes little silicon, and is advantageously used in a photovoltaic cell in which a thin silicon lamina comprises the base region of the cell. When the lamina is formed by implanting ions in a donor wafer to form a cleave plane and cleaving the lamina from the donor wafer at the cleave plane, the ion implantation step will serve to translate texture formed at a first surface to the cleave plane, and thus to the second, opposing surface following cleaving. Low-relief texture formed by other methods can be translated from the first surface to the second surface in this way as well.
    • 可以通过在硅表面上施加和焙烧玻璃料膏来产生低浮雕纹理。 当玻璃料在高温下接触表面时,会腐蚀硅,将硅溶解在软化玻璃料中。 结果是一系列小的,随机位置的凹坑,其产生近Lambertian表面,适用于光伏电池。 这种纹理化方法消耗很少的硅,并且有利地用于其中薄硅层包括电池的基极区域的光伏电池中。 当通过在施主晶片中注入离子以形成解理平面并在分裂面处从施主晶片切割层而形成层板时,离子注入步骤将用于将形成在第一表面处的纹理平移至解理面,以及 从而在切割之后到达第二相对表面。 通过其他方法形成的低浮雕纹理也可以以这种方式从第一表面转换到第二表面。
    • 115. 发明申请
    • METHOD FOR MAKING A P-I-N DIODE CRYSTALLIZED ADJACENT TO A SILICIDE IN SERIES WITH A DIELECTRIC ANTIFUSE
    • 在具有电介质抗体的系列中制备P-I-N二极管结晶到硅氧烷的方法
    • US20100136751A1
    • 2010-06-03
    • US12698253
    • 2010-02-02
    • S. Brad Herner
    • S. Brad Herner
    • H01L21/77H01L21/768
    • H01L23/5252G11C13/0069G11C17/16G11C2013/009G11C2213/33H01L27/1021H01L2924/0002H01L2924/3011H01L2924/00
    • A method is described for monolithically forming a first memory level above a substrate, the method including: (a) forming a plurality of first substantially parallel, substantially coplanar conductors above the substrate, the first conductors extending in a first direction; (b) forming a plurality of vertically oriented contiguous p-i-n diodes above the first conductors, the contiguous p-in diode comprising semiconductor material crystallized in contact with a silicide, silicide-germanide, or germanide layer; (c) forming a plurality of second substantially parallel, substantially coplanar conductors, the second conductors above the contiguous p-i-n diodes, the second conductors extending in a second direction different from the first direction, each contiguous p-i-n diode vertically disposed between one of the first conductors and one of the second conductors; (d) and forming a plurality of dielectric rupture antifuses, each dielectric rupture antifuse disposed between one of the contiguous p-i-n diodes and one of the first conductors or between one of the contiguous p-i-n diodes and one of the second conductors, wherein the dielectric rupture antifuses comprise dielectric material, the dielectric material having a dielectric constant greater than about 8. Other aspects are provided.
    • 描述了一种用于在衬底上单层形成第一存储器电平的方法,所述方法包括:(a)在衬底上方形成多个第一基本平行的基本上共面的导体,所述第一导体沿第一方向延伸; (b)在所述第一导体上方形成多个垂直取向的连续p-i-n二极管,所述连续p-in二极管包括与硅化物,硅化物 - 锗化物或锗化锗层接触结晶的半导体材料; (c)形成多个第二基本上平行的基本上共面的导体,所述第二导体位于所述相邻引脚二极管之上,所述第二导体沿与第一方向不同的第二方向延伸,每个相邻的引脚二极管垂直地设置在所述第一导体 和第二导体之一; (d)并且形成多个介电破裂反熔丝,每个介质断裂反熔丝设置在一个连续的pin二极管和一个第一导体之间,或者在一个连续的pin二极管和一个第二导体之间,其中介质断裂反熔丝 包括电介质材料,介电材料的介电常数大于约8.其它方面。
    • 120. 发明申请
    • HIGH-DENSITY NONVOLATILE MEMORY AND METHODS OF MAKING THE SAME
    • 高密度非易失性存储器及其制造方法
    • US20090261343A1
    • 2009-10-22
    • US12477216
    • 2009-06-03
    • S. Brad HernerMaitreyee Mahajani
    • S. Brad HernerMaitreyee Mahajani
    • H01L29/04H01L21/20
    • G11C5/02H01L21/8238H01L23/48H01L27/1021H01L27/148H01L29/94H01L2924/0002H01L2924/00
    • Nonvolatile memory cells and methods of forming the same are provided, the methods including forming a first conductor at a first height above a substrate; forming a first pillar-shaped semiconductor element above the first conductor, wherein the first pillar-shaped semiconductor element comprises a first heavily doped layer of a first conductivity type, a second lightly doped layer above and in contact with the first heavily doped layer, and a third heavily doped layer of a second conductivity type above and in contact with the second lightly doped layer, the second conductivity type opposite the first conductivity type; forming a first dielectric antifuse above the third heavily doped layer of the first pillar-shaped semiconductor element; and forming a second conductor above the first dielectric antifuse.
    • 提供了非易失存储器单元及其形成方法,所述方法包括在衬底上方的第一高度处形成第一导体; 在所述第一导体上形成第一柱状半导体元件,其中所述第一柱状半导体元件包括第一导电类型的第一重掺杂层,在所述第一重掺杂层上方并与其接触的第二轻掺杂层,以及 第二导电类型的第三重掺杂层在第二轻掺杂层上方并与第二轻掺杂层接触,第二导电类型与第一导电类型相反; 在所述第一柱状半导体元件的所述第三重掺杂层的上方形成第一介电反熔丝; 以及在所述第一介电反熔丝之上形成第二导体。