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    • 101. 发明专利
    • Manufacturing method of vapor deposition mask
    • 蒸汽沉积掩模的制造方法
    • JP2014177682A
    • 2014-09-25
    • JP2013053207
    • 2013-03-15
    • V Technology Co Ltd株式会社ブイ・テクノロジー
    • SAITO YUJIKUDO SHUJIKOSUGE TAKAYUKIMIZUMURA MICHINOBU
    • C23C14/24
    • B32B38/10B32B15/00B32B2310/0843C23C14/042
    • PROBLEM TO BE SOLVED: To apply equal tension over the entire surface of a mask sheet and fix the sheet to a frame.SOLUTION: There is provided a manufacturing method of a vapor deposition mask having a structure that a metal mask sheet 4 on which a plurality of opening patterns are formed is stretched and fixed to a frame-shaped metal frame 7, in which a first step of adhering a peripheral part of the metal mask sheet 4 to a synthetic fiber mesh 1 to which fixed tension is applied; a second step of cutting off a portion of the mesh 1 corresponding to a vapor deposition effective region having an enough size that includes the plurality of opening patterns of the metal mask sheet 4; a third step of bonding and fixing the frame 7 to the peripheral part of the metal mask sheet 4 from the opposite side of the mesh 1; and a fourth step of removing the mesh 1 from the metal mask sheet 4 are performed.
    • 要解决的问题:在掩模片的整个表面上施加相等的张力并将片材固定到框架上。解决方案:提供一种蒸镀掩模的制造方法,其具有金属掩模片4,其上形成有 形成有多个开口图案被拉伸并固定在框状的金属框架7上,其中将金属掩模片4的周边部分粘附到固定张力的合成纤维网1上的第一步骤; 第二步骤,切除与具有包括金属掩模片4的多个开口图案的足够尺寸的蒸镀有效区域对应的网孔1的一部分; 将框架7从网1的相对侧接合并固定到金属掩模片4的周边部分的第三步骤; 并且执行从金属掩模片4去除网格1的第四步骤。
    • 107. 发明专利
    • Method for manufacturing vapor deposition mask
    • 制造蒸气沉积掩模的方法
    • JP2014098196A
    • 2014-05-29
    • JP2012250974
    • 2012-11-15
    • V Technology Co Ltd株式会社ブイ・テクノロジー
    • MIZUMURA MICHINOBU
    • C23C14/04
    • C23C14/042B23K26/066C23C14/048C23C16/042
    • PROBLEM TO BE SOLVED: To improve the accuracy of positions where a plurality of opening patterns are formed.SOLUTION: A method for manufacturing a composite type vapor deposition mask where a resin film 17 formed with opening patterns 16, having the same geometry as that of thin film patterns, corresponding to the thin film patterns deposited on a substrate and a thin plate-shaped magnetic metal member 15 formed with through holes 14 having a size involving the opening pattern 16 are brought into close contact with each other, comprises steps of: forming a member 7 for a mask having a structure where the magnetic metal member 15 formed with the through holes 14 and the resin film 17 before being formed with the opening patterns 16 are brought into close contact with each other; forming marks 23 having a constant shape and depth by irradiating laser light L to the film 17 in the through holes 14 of the member 7 for a mask; and forming the opening patterns 16 penetrating the film 17 by irradiating the laser light L to predetermined positions on the basis of the marks 23.
    • 要解决的问题:提高形成多个开口图案的位置的精度。解决方案:一种复合型蒸镀掩模的制造方法,其中形成有开口图案16的树脂膜17具有与 对应于沉积在基板上的薄膜图案的薄膜图案和形成有具有涉及开口图案16的尺寸的通孔14的薄板状磁性金属构件15彼此紧密接触,包括以下步骤: 在形成具有开口图案16的形成有通孔14的磁性金属构件15和树脂膜17之间形成具有结构的掩模构件7彼此紧密接触; 通过在掩模用构件7的通孔14中的膜17上照射激光L来形成具有恒定形状和深度的标记23; 并且通过基于标记23将激光L照射到预定位置来形成穿透膜17的开口图案16。
    • 108. 发明专利
    • Thin film pattern formation method, alignment device, and vapor deposition device
    • 薄膜图案形成方法,对准装置和蒸发沉积装置
    • JP2014098195A
    • 2014-05-29
    • JP2012250973
    • 2012-11-15
    • V Technology Co Ltd株式会社ブイ・テクノロジー
    • MIZUMURA MICHINOBU
    • C23C14/04H01L51/50H05B33/10
    • PROBLEM TO BE SOLVED: To improve thin film pattern forming position accuracy.SOLUTION: Both ends of a vapor deposition mask are supported, and the vapor deposition mask is arranged above and opposite to a substrate. One supported end of the vapor deposition mask is lowered, and made near one end side of the substrate. Thereafter, the other end of the vapor deposition mask is gradually lowered, so that the vapor deposition mask is sequentially brought into close contact with one end side to the other end side of the substrate. The vapor deposition mask is moved in a plane parallel to a surface of the substrate to align the vapor deposition mask with the substrate. By applying a static magnetic field to a magnetic metal member of the vapor deposition mask from a rear face side of the substrate, the vapor deposition mask is closely fixed to the surface of the substrate by a magnetic force, and vapor deposition is performed from the vapor deposition mask side to form a thin film pattern with the same shape dimension as that of an opening pattern.
    • 要解决的问题:提高薄膜图案形成位置精度。解决方案:支持蒸镀掩模的两端,并且气相沉积掩模布置在基板的上方和相对之上。 气相沉积掩模的一个支撑端降低,并在基底的一端侧附近制成。 此后,蒸镀掩模的另一端逐渐降低,使得蒸镀掩模顺序地与基板的另一端侧的一端侧紧密接触。 气相沉积掩模在平行于衬底的表面的平面中移动,以将气相沉积掩模与衬底对准。 通过从基板的背面向静电磁性金属构件施加静磁场,通过磁力将气相沉积掩模紧密地固定在基板的表面上,并从 蒸镀掩模侧,形成与开口图案相同的形状尺寸的薄膜图案。
    • 110. 发明专利
    • Optical inter-connection device
    • 光学互连装置
    • JP2014096684A
    • 2014-05-22
    • JP2012246685
    • 2012-11-08
    • V Technology Co Ltd株式会社ブイ・テクノロジー
    • KAJIYAMA KOICHINASUKAWA TOSHIMICHIISHIKAWA SUSUMUKANAO MASAYASU
    • H04B10/80H04B10/114H04J14/00H04J14/02
    • H04B10/803H01L25/167H01L31/167H01L2924/0002H01L2924/00
    • PROBLEM TO BE SOLVED: To enhance the alignment accuracy of light-emitting elements or light-receiving elements on a substrate by a relatively simplified manufacturing process and to prevent crosstalk of signal transmission between substrates (chips).SOLUTION: An optical inter-connection device 1 performs transmission and reception of a light signal between a plurality of semiconductor substrates 10 that are stacked. A plurality of light-emitting elements 2 or a plurality of light-receiving elements 3 that are disposed on one semiconductor substrate 10 have pn junction portions 10pn using the semiconductor substrate 10 as a common semiconductor layer 10p. A pair of the light-emitting element 2(2-1) and the light-receiving element 3(3-1) performing transmission and reception of a light signal between the different semiconductor substrates 10 perform light emission and light reception at a common wavelength λ1, respectively.
    • 要解决的问题:通过相对简化的制造工艺来提高基板上的发光元件或光接收元件的对准精度,并防止基板(芯片)之间的信号传输串扰。解决方案:光学互连装置 1在堆叠的多个半导体衬底10之间执行光信号的发送和接收。 设置在一个半导体衬底10上的多个发光元件2或多个光接收元件3具有使用半导体衬底10作为公共半导体层10p的pn结部分10pn。 在不同的半导体基板10之间进行光信号的发送接收的一对发光元件2(2-1)和受光元件3(3-1)进行发光和共用波长的光的接收 λ1。