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    • 93. 发明授权
    • Electrically programmable memory cell configuration and method for fabricating it
    • 电可编程存储单元配置及其制造方法
    • US06639269B1
    • 2003-10-28
    • US09648952
    • 2000-08-25
    • Franz HofmannJosef Willer
    • Franz HofmannJosef Willer
    • H01L218247
    • H01L27/11526H01L27/11546H01L29/42336H01L29/66825H01L29/7883
    • A memory cell contains a planar transistor whose channel region is disposed at a bottom of a depression in a substrate. A floating gate electrode of the transistor adjoins the bottom of the depression, the bottom being provided with a first dielectric disposed on sidewalls of the depression. Since the floating gate electrode has a larger area than the channel region, a capacitance formed by a control gate electrode applied on the floating gate electrode and the floating gate electrode is greater than a capacitance formed by the floating gate electrode and the channel region. Two source/drain regions of the transistor likewise adjoin the sidewalls of the depression. An insulation, which is thicker than the first dielectric, isolates the floating gate electrode from the source/drain regions, so that the source/drain regions do not contribute to the coupling ratio.
    • 存储单元包含平面晶体管,其沟道区设置在衬底中的凹陷的底部。 晶体管的浮置栅电极邻接凹陷的底部,底部设置有设置在凹陷的侧壁上的第一电介质。 由于浮栅电极具有比沟道区更大的面积,所以由施加在浮置栅电极和浮置栅电极上的控制栅电极形成的电容大于由浮栅电极和沟道区形成的电容。 晶体管的两个源极/漏极区同样邻接凹陷的侧壁。 比第一电介质厚的绝缘体将浮置栅极与源极/漏极区隔离,使得源极/漏极区域对耦合比没有贡献。
    • 98. 发明授权
    • Method for fabricating an integrated circuit configuration
    • 制造集成电路结构的方法
    • US06242319B1
    • 2001-06-05
    • US09498530
    • 2000-02-04
    • Franz HofmannJosef Willer
    • Franz HofmannJosef Willer
    • H01L2176
    • H01L27/10858H01L23/544H01L25/50H01L2223/54453H01L2924/0002H01L2924/00
    • A first structure of a circuit configuration and a first alignment structure are produced in the region of a surface of a first substrate. The first alignment structure scatters electron beams differently than its surroundings. A second substrate, which is more transmissive to electron beams than the first alignment structure, is connected to the first substrate in such a way that the second substrate is disposed above the surface of the first substrate. In order to align a mask with respect to the first structure, a position of the first alignment structure is determined with the aid of electron beams. With the aid of the mask, at least one second structure of the circuit configuration is produced in the region of an uncovered upper surface of the second substrate. The first structure may be a metallic line encapsulated by insulating material. A contact may connect the first structure to the second structure. With the aid of electron beam lithography, at least one second alignment structure may be produced in the region of the upper surface of the second substrate, using which the mask is aligned.
    • 在第一基板的表面的区域中制造电路结构和第一对准结构的第一结构。 第一对准结构与其周围环境不同地散射电子束。 与第一对准结构相比,对电子束更透射的第二衬底以这样的方式连接到第一衬底,使得第二衬底设置在第一衬底的表面之上。 为了使掩模相对于第一结构对准,借助于电子束来确定第一对准结构的位置。 借助于掩模,在第二基板的未覆盖的上表面的区域中产生电路构造的至少一个第二结构。 第一结构可以是由绝缘材料包封的金属线。 触点可以将第一结构连接到第二结构。 借助于电子束光刻技术,可以在第二衬底的上表面的区域中产生至少一个第二对准结构,使用掩模进行对准。
    • 100. 发明授权
    • Method for manufacturing a multi-layer capacitor
    • 多层电容器的制造方法
    • US5347696A
    • 1994-09-20
    • US164719
    • 1993-12-10
    • Josef WillerHermann WendtHans Reisinger
    • Josef WillerHermann WendtHans Reisinger
    • C23F4/00H01G4/30H01L21/822H01L27/04H01G4/10
    • H01G4/306Y10T29/435
    • For manufacturing a multi-layer capacitor, a layer structure (2, 3, 4) is applied onto a substrate (1), said layer structure comprising conductive layers (2, 4) and dielectric layers (3) in alternation and successive conductive layers (2, 4) therein being respectively formed of one of two different materials which are selectively etchable relative to one another. Two openings (6, 8) are produced in the layer structure (2, 3, 4), whereby under-etchings (21, 41 ) are formed in the first opening (6) by selective etching of the one material and are formed in the second opening (8) by selective etching of the other material, so that only the conductive layers (2, 4) of the non-etched material respectively adjoin contacts (91, 92) introduced into the openings (6, 8).
    • 为了制造多层电容器,将层结构(2,3,4)施加到衬底(1)上,所述层结构交替包括导电层(2,4)和电介质层(3),并且连续导电层 (2,4)分别由可相对于彼此选择性地蚀刻的两种不同材料之一形成。 在层结构(2,3,4)中产生两个开口(6,8),由此通过选择性蚀刻该一种材料形成在第一开口(6)中的下蚀刻(21,41),并形成在 所述第二开口(8)通过选择性蚀刻所述另一材料,使得仅所述非蚀刻材料的所述导电层(2,4)分别与引入所述开口(6,8)的触点(91,92)相邻。