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    • 92. 发明授权
    • Isolation region forming methods
    • 隔离区形成方法
    • US06406977B2
    • 2002-06-18
    • US09521095
    • 2000-03-07
    • David L. DickersonRichard H. LaneCharles H. DennisonKunal R. ParekhMark FischerJohn K. Zahurak
    • David L. DickersonRichard H. LaneCharles H. DennisonKunal R. ParekhMark FischerJohn K. Zahurak
    • H01L2176
    • H01L21/76232H01L21/0332H01L21/76235
    • In one aspect, the invention includes an isolation region forming method comprising: a) forming an oxide layer over a substrate; b) forming a nitride layer over the oxide layer, the nitride layer and oxide layer having a pattern of openings extending therethrough to expose portions of the underlying substrate; c) etching the exposed portions of the underlying substrate to form openings extending into the substrate; d) after etching the exposed portions of the underlying substrate, removing portions of the nitride layer while leaving some of the nitride layer remaining over the substrate; and e) after removing portions of the nitride layer, forming oxide within the openings in the substrate, the oxide within the openings forming at least portions of isolation regions. In another aspect, the invention includes an isolation region forming method comprising: a) forming a silicon nitride layer over a substrate; b) forming a masking layer over the silicon nitride layer; c) forming a pattern of openings extending through the masking layer to the silicon nitride layer; d) extending the openings through the silicon nitride layer to the underlying substrate, the silicon nitride layer having edge regions proximate the openings and having a central region between the edge regions; e) extending the openings into the underlying substrate; f) after extending the openings into the underlying substrate, reducing a thickness of the silicon nitride layer at the edge regions to thin the edge regions relative to the central region; and g) forming oxide within the openings.
    • 一方面,本发明包括一种隔离区形成方法,包括:a)在衬底上形成氧化物层; b)在所述氧化物层上形成氮化物层,所述氮化物层和氧化物层具有延伸穿过其中的开口图案以暴露所述下面的衬底的部分; c)蚀刻下面的衬底的暴露部分以形成延伸到衬底中的开口; d)在蚀刻下面的衬底的暴露部分之后,去除氮化物层的部分,同时留下一些保留在衬底上的氮化物层; 以及e)在去除所述氮化物层的部分之后,在所述衬底的所述开口内形成氧化物,所述开口内的氧化物形成至少部分隔离区域。 另一方面,本发明包括一种隔离区形成方法,包括:a)在衬底上形成氮化硅层; b)在氮化硅层上形成掩模层; c)形成延伸穿过掩模层的开口图案到氮化硅层; d)将开口穿过氮化硅层延伸到下面的衬底,氮化硅层具有靠近开口的边缘区域,并且在边缘区域之间具有中心区域; e)将开口延伸到下面的基底中; f)在将开口延伸到下面的基底之后,减小边缘区域处的氮化硅层的厚度,以使边缘区域相对于中心区域变薄; 和g)在开口内形成氧化物。
    • 93. 发明授权
    • Method of fabricating a semiconductor device utilizing polysilicon grains
    • 制造利用多晶硅晶粒的半导体器件的方法
    • US5960294A
    • 1999-09-28
    • US6126
    • 1998-01-13
    • John K. ZahurakScott J. DeBoerRandhir P.S. ThakurMark Fischer
    • John K. ZahurakScott J. DeBoerRandhir P.S. ThakurMark Fischer
    • H01L21/02H01L21/20
    • H01L28/84H01L28/91
    • A method of fabricating capacitors for a dynamic random access memory device reduces double bit failures or shorts in the device. The method includes providing a semiconductor substrate underlying an insulative layer having a plurality of storage cells formed therein electrically connected to the substrate. A first conductive layer of rugged polysilicon, which functions as a first capacitor plate, is formed over the insulative layer in an oxygen-free atmosphere such that the first conductive layer is without natural oxides on the surface thereof. The surface of the first conductive layer in the oxygen-free atmosphere is then conditioned by a rapid thermal nitridization process which forms a silicon nitride film thereon. Thereafter, portions of the first conductive layer are removed from the insulative layer such that the plurality of storage cells are electrically isolated from one another. A dielectric layer is then formed over the first conductive layer and exposed insulative layer, followed by a second conductive layer, functioning as a second capacitor plate, being formed over the dielectric layer to complete the capacitor structure.
    • 一种制造用于动态随机存取存储器件的电容器的方法减少了器件中的双位故障或短路。 该方法包括在其上形成有电连接到基板的多个存储单元的绝缘层下方提供半导体基板。 在无氧气氛中的绝缘层上形成用作第一电容器板的凹凸多晶硅的第一导电层,使得第一导电层在其表面上不具有天然氧化物。 然后在无氧气氛中的第一导电层的表面通过在其上形成氮化硅膜的快速热氮化工艺进行调理。 此后,将第一导电层的部分从绝缘层移除,使得多个存储单元彼此电隔离。 然后在第一导电层和暴露的绝缘层上形成电介质层,然后在电介质层上形成用作第二电容器板的第二导电层,以完成电容器结构。
    • 96. 发明授权
    • Efficient pitch multiplication process
    • 高效的音调乘法过程
    • US08012674B2
    • 2011-09-06
    • US12687005
    • 2010-01-13
    • Mark FischerStephen RussellH. Montgomery Manning
    • Mark FischerStephen RussellH. Montgomery Manning
    • G03F7/26
    • H01L29/06H01L21/0338H01L21/3088
    • Pitch multiplied and non-pitch multiplied features of an integrated circuit, e.g., features in the array, interface and periphery areas of the integrated circuit, are formed by processing a substrate through a mask. The mask is formed by patterning a photoresist layer which simultaneously defines mask elements corresponding to features in the array, interface and periphery areas of the integrated circuit. The pattern is transferred to an amorphous carbon layer. Sidewall spacers are formed on the sidewalls of the patterned amorphous carbon layer. A layer of protective material is deposited and then patterned to expose mask elements in the array region and in selected parts of the interface or periphery areas. Amorphous carbon in the array region or other exposed parts is removed, thereby leaving a pattern including free-standing, pitch multiplied spacers in the array region. The protective material is removed, leaving a pattern of pitch multiplied spacers in the array region and non-pitch multiplied mask elements in the interface and periphery areas. The pattern is transferred to a hard mask layer, through which an underlying substrate is etched.
    • 通过通过掩模处理衬底来形成集成电路的间距倍增和非间距倍数特征,例如集成电路的阵列,接口和外围区域中的特征。 通过图案化光刻胶层来形成掩模,该光致抗蚀剂层同时限定对应于集成电路的阵列,界面和外围区域中的特征的掩模元件。 将图案转移到无定形碳层。 侧壁间隔物形成在图案化无定形碳层的侧壁上。 沉积一层保护材料,然后将其图案化以暴露阵列区域中的掩模元件和界面或外围区域的选定部分。 除去阵列区域或其它暴露部分中的无定形碳,从而在阵列区域中留下包括独立的,间距倍增的间隔物的图案。 去除保护材料,在阵列区域中留下间距倍数间隔物的图案,并在界面和外围区域留下非间距倍增的掩模元件。 将图案转移到硬掩模层,通过该硬掩模层蚀刻下面的基底。
    • 100. 发明授权
    • Efficient pitch multiplication process
    • 高效的音调乘法过程
    • US07666578B2
    • 2010-02-23
    • US11521851
    • 2006-09-14
    • Mark FischerStephen RussellH. Montgomery Manning
    • Mark FischerStephen RussellH. Montgomery Manning
    • G03F7/26G03F7/00
    • H01L29/06H01L21/0338H01L21/3088
    • Pitch multiplied and non-pitch multiplied features of an integrated circuit, e.g., features in the array, interface and periphery areas of the integrated circuit, are formed by processing a substrate through a mask. The mask is formed by patterning a photoresist layer which simultaneously defines mask elements corresponding to features in the array, interface and periphery areas of the integrated circuit. The pattern is transferred to an amorphous carbon layer. Sidewall spacers are formed on the sidewalls of the patterned amorphous carbon layer. A layer of protective material is deposited and then patterned to expose mask elements in the array region and in selected parts of the interface or periphery areas. Amorphous carbon in the array region or other exposed parts is removed, thereby leaving a pattern including free-standing, pitch multiplied spacers in the array region. The protective material is removed, leaving a pattern of pitch multiplied spacers in the array region and non-pitch multiplied mask elements in the interface and periphery areas. The pattern is transferred to a hard mask layer, through which an underlying substrate is etched.
    • 通过通过掩模处理衬底来形成集成电路的间距倍增和非间距倍数特征,例如集成电路的阵列,接口和外围区域中的特征。 通过图案化光刻胶层来形成掩模,该光致抗蚀剂层同时限定对应于集成电路的阵列,界面和外围区域中的特征的掩模元件。 将图案转移到无定形碳层。 侧壁间隔物形成在图案化无定形碳层的侧壁上。 沉积一层保护材料,然后将其图案化以暴露阵列区域中的掩模元件和界面或外围区域的选定部分。 除去阵列区域或其它暴露部分中的无定形碳,从而在阵列区域中留下包括独立的,间距倍增的间隔物的图案。 去除保护材料,在阵列区域中留下间距倍数间隔物的图案,并在界面和外围区域留下非间距倍增的掩模元件。 将图案转移到硬掩模层,通过该硬掩模层蚀刻下面的基底。