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    • 92. 发明申请
    • Curved Spring Structure With Downturned Tip
    • 弯曲的弹簧结构与低调的尖端
    • US20100285700A1
    • 2010-11-11
    • US12845690
    • 2010-07-28
    • Eugene M. ChowDirk DeBruyker
    • Eugene M. ChowDirk DeBruyker
    • H01R4/48
    • G01R3/00G01R1/06727G01R1/06744G01R1/06761
    • A curved spring structure includes a base (anchor) section extending parallel to a planar substrate surface, a cantilever section extending away from the substrate surface, and an optional elongated section extending from the base section along the substrate surface under the cantilevered section. The cantilever section includes a body portion integrally attached at a lower end to the anchor section and extending at an acute angle relative to the planar surface, and a curved portion integrally attached to an upper end of the body portion and including a downturned tip. A middle section of the curved portion is disposed a first distance away from the planar surface of the substrate, and the downturned tip is disposed a second distance away from the planar surface of the substrate, the first distance being greater than the second distance.
    • 弯曲的弹簧结构包括平行于平面衬底表面延伸的基部(锚)部分,远离衬底表面延伸的悬臂部分,以及从底部部分沿悬臂部分下方的衬底表面延伸的可选的细长部分。 悬臂部分包括主体部分,其整体地附接到锚固部分的下端并相对于平坦表面以锐角延伸;以及弯曲部分,其整体地附接到主体部分的上端并且包括下降的尖端。 弯曲部分的中间部分设置成离开基板的平面表面的第一距离,并且下端尖端设置成离开基板的平面表面第二距离,第一距离大于第二距离。
    • 98. 发明申请
    • Self-Releasing Spring Structures And Methods
    • 自我释放弹簧结构与方法
    • US20090077807A1
    • 2009-03-26
    • US12256060
    • 2008-10-22
    • Thomas HantschelSven KosgalwiesDavid K. ForkEugene M. Chow
    • Thomas HantschelSven KosgalwiesDavid K. ForkEugene M. Chow
    • B23P13/00
    • G01R1/06716G01R3/00Y10T29/49609
    • According to various exemplary embodiments, a spring device that includes a substrate, a self-releasing layer provided over the substrate and a stressed-metal layer provided over the self-releasing layer is disclosed, wherein an amount of stress inside the stressed-metal layer results in a peeling force that is higher than an adhesion force between the self-releasing layer and the stressed-metal layer. Moreover, a method of manufacturing a spring device, according to various exemplary embodiments, includes providing a substrate, providing a self-releasing layer over the substrate and providing a stressed-metal layer over the self-releasing layer wherein an amount of stress inside the stressed-metal layer results in a peeling force that is higher than an adhesion force between the self-releasing layer and the stressed-metal layer is also disclosed in this invention.
    • 根据各种示例性实施例,公开了一种弹簧装置,其包括基板,设置在基板上的自放电层和设置在自放电层上的应力金属层,其中应力金属层内部的应力量 导致剥离力高于自释放层和应力金属层之间的粘附力。 此外,根据各种示例性实施例的制造弹簧装置的方法包括提供衬底,在衬底上提供自释放层,并在自释放层上方提供应力金属层,其中, 在本发明中也公开了应力金属层导致比自发层和应力金属层之间的粘附力高的剥离力。
    • 99. 发明授权
    • Patterned-print thin-film transistors with top gate geometry
    • 具有顶栅几何形状的图案印刷薄膜晶体管
    • US07344928B2
    • 2008-03-18
    • US11193847
    • 2005-07-28
    • William S. WongRene A. LujanEugene M. Chow
    • William S. WongRene A. LujanEugene M. Chow
    • H01L21/84
    • H01L29/41733H01L27/124H01L27/1285H01L27/1288H01L27/1292H01L29/42384H01L29/4908H01L29/66757
    • A self-aligned, thin-film, top-gate transistor and method of manufacturing same are disclosed. A first print-patterned mask is formed over a metal layer by digital lithography, for example by printing with a phase change material using a droplet ejector. The metal layer is then etched using the first print-patterned mask to form source and drain electrodes. A semiconductive layer and an insulative layer are formed thereover. A layer of photosensitive material is then deposited and exposed through the substrate, with the source and drain electrodes acting as masks for the exposure. Following development of the photosensitive material, a gate metal layer is deposited. A second print-patterned mask is then formed over the device, again by digital lithography. Etching and removal of the photosensitive material leaves the self-aligned top-gate electrode.
    • 公开了一种自对准薄膜顶栅晶体管及其制造方法。 通过数字光刻在金属层上形成第一印刷图案掩模,例如通过使用液滴喷射器用相变材料进行印刷。 然后使用第一印刷图案化掩模蚀刻金属层以形成源极和漏极。 在其上形成半导体层和绝缘层。 然后将一层感光材料沉积并暴露通过基底,源极和漏极用作曝光的掩模。 在感光材料的显影之后,沉积栅极金属层。 然后再次通过数字光刻法在器件上形成第二印刷图案掩模。 蚀刻和去除感光材料离开自对准顶栅电极。