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    • 1. 发明申请
    • Electroluminescent device
    • 电致发光器件
    • US20050253136A1
    • 2005-11-17
    • US10836669
    • 2004-04-30
    • Yoshi OnoWei GaoJohn ConleyOsamu NishioKeizo Sakiyama
    • Yoshi OnoWei GaoJohn ConleyOsamu NishioKeizo Sakiyama
    • G09F9/30G09F9/00H01L27/32H01L29/08H01L33/18H01L33/28H01L33/34H01L35/24
    • H01L33/28H01L33/18H01L33/34Y10S977/95
    • A method is provided for forming an electroluminescent device. The method comprises: providing a type IV semiconductor material substrate; forming a p+/n+ junction in the substrate, typically a plurality of interleaved p+/n+ junctions are formed; and, forming an electroluminescent layer overlying the p+/n+ junction(s) in the substrate. The type IV semiconductor material substrate can be Si, C, Ge, SiGe, or SiC. For example, the substrate can be Si on insulator (SOI), bulk Si, Si on glass, or Si on plastic. The electroluminescent layer can be a material such as nanocrystalline Si, nanocrystalline Ge, fluorescent polymers, or type II-VI materials such as ZnO, ZnS, ZnSe, CdSe, and CdS. In some aspect, the method further comprises forming an insulator film interposed between the substrate and the electroluminescent layer. In another aspect, the method comprises forming a conductive electrode overlying the electroluminescent layer.
    • 提供了形成电致发光器件的方法。 该方法包括:提供IV型半导体材料基板; 在衬底中形成p + / n +结,通常形成多个交错的p + / n +结; 并且形成覆盖衬底中的p + / n +结的电致发光层。 IV型半导体材料基板可以是Si,C,Ge,SiGe或SiC。 例如,衬底可以是绝缘体上的Si(SOI),玻璃上的体积Si,Si或塑料上的Si。 电致发光层可以是诸如纳米晶体Si,纳米晶体Ge,荧光聚合物或诸如ZnO,ZnS,ZnSe,CdSe和CdS的II-VI族材料的材料。 在一些方面,所述方法还包括形成介于基片和电致发光层之间的绝缘膜。 另一方面,该方法包括形成覆盖电致发光层的导电电极。
    • 2. 发明授权
    • Electroluminescent device
    • 电致发光器件
    • US07208768B2
    • 2007-04-24
    • US10836669
    • 2004-04-30
    • Yoshi OnoWei GaoJohn F. Conley, Jr.Osamu NishioKeizo Sakiyama
    • Yoshi OnoWei GaoJohn F. Conley, Jr.Osamu NishioKeizo Sakiyama
    • H01L27/15
    • H01L33/28H01L33/18H01L33/34Y10S977/95
    • A method is provided for forming an electroluminescent device. The method comprises: providing a type IV semiconductor material substrate; forming a p+/n+ junction in the substrate, typically a plurality of interleaved p+/n+ junctions are formed; and, forming an electroluminescent layer overlying the p+/n+ junction(s) in the substrate. The type IV semiconductor material substrate can be Si, C, Ge, SiGe, or SiC. For example, the substrate can be Si on insulator (SOI), bulk Si, Si on glass, or Si on plastic. The electroluminescent layer can be a material such as nanocrystalline Si, nanocrystalline Ge, fluorescent polymers, or type II–VI materials such as ZnO, ZnS, ZnSe, CdSe, and CdS. In some aspect, the method further comprises forming an insulator film interposed between the substrate and the electroluminescent layer. In another aspect, the method comprises forming a conductive electrode overlying the electroluminescent layer.
    • 提供了形成电致发光器件的方法。 该方法包括:提供IV型半导体材料基板; 在衬底中形成p + / n +结,通常形成多个交错的p + / n +结; 并且形成覆盖衬底中的p + / n +结的电致发光层。 IV型半导体材料基板可以是Si,C,Ge,SiGe或SiC。 例如,衬底可以是绝缘体上的硅(SOI),玻璃上的体积Si,Si或塑料上的Si。 电致发光层可以是诸如纳米晶体Si,纳米晶体Ge,荧光聚合物或诸如ZnO,ZnS,ZnSe,CdSe和CdS的II-VI族材料的材料。 在一些方面,所述方法还包括形成介于基片和电致发光层之间的绝缘膜。 另一方面,该方法包括形成覆盖电致发光层的导电电极。
    • 5. 发明申请
    • METHODS OF FORMING A MICROLENS ARRAY OVER A SUBSTRATE EMPLOYING A CMP STOP
    • 在使用CMP停止的基板上形成微阵列的方法
    • US20060073623A1
    • 2006-04-06
    • US10956789
    • 2004-09-30
    • John ConleyYoshi OnoWei GaoDavid Evans
    • John ConleyYoshi OnoWei GaoDavid Evans
    • H01L21/00
    • H01L21/31053H01L21/31133H01L27/14627H01L27/14685
    • A method of forming a microlens structure is provided along with a CCD array structure employing a microlens array. An embodiment of the method comprises providing a substrate having a surface with photo-elements on the surface; depositing a transparent material overlying the surface of the substrate; depositing a CMP stop overlying the transparent material; depositing a lens-shaping layer overlying the CMP stop layer; depositing and patterning a photoresist layer overlying the lens-shaping layer to form openings to expose the lens-shaping layer; introducing a first isotropic etchant into the openings and etching the lens-shaping layer where exposed to form initial lens shapes having a radius; stripping the photoresist; exposing the lens-shaping layer to a second isotropic etchant to increase the radius of the lens shapes; transferring the lens shape through the CMP stop layer into the transparent material using an anisotropic etch; and depositing a lens material overlying the transparent material, whereby the lens shapes are at least partially filled with lens material. Planarizing the lens material using CMP and stopping at the CMP stop layer.
    • 提供一种形成微透镜结构的方法以及采用微透镜阵列的CCD阵列结构。 该方法的一个实施例包括提供具有在表面上具有光元件的表面的基底; 沉积覆盖衬底表面的透明材料; 沉积覆盖透明材料的CMP停止点; 沉积覆盖CMP停止层的透镜成形层; 沉积和图案化覆盖透镜成形层的光致抗蚀剂层以形成露出透镜成形层的开口; 在开口中引入第一各向同性蚀刻剂并蚀刻暴露于其中形成具有半径的初始透镜形状的透镜成形层; 剥离光刻胶; 将透镜成形层暴露于第二各向同性蚀刻剂以增加透镜形状的半径; 使用各向异性蚀刻将透镜形状通过CMP停止层转移到透明材料中; 以及沉积覆盖透明材料的透镜材料,由此透镜形状至少部分地被透镜材料填充。 使用CMP对透镜材料进行平面化,并在CMP停止层处停止。
    • 6. 发明申请
    • Methods of forming a microlens array over a substrate
    • 在衬底上形成微透镜阵列的方法
    • US20050208432A1
    • 2005-09-22
    • US10805115
    • 2004-03-19
    • John ConleyYoshi OnoWei Gao
    • John ConleyYoshi OnoWei Gao
    • G02B3/00H01L27/14H04N1/028
    • H01L27/14685G02B3/0012H01L27/14627
    • A method of forming a microlens structure is provided along with a CCD array structure employing a microlens array. An embodiment of the method comprises providing a substrate having a surface with photo-elements on the surface; depositing a transparent material overlying the surface of the substrate; depositing and patterning a photoresist layer overlying the transparent material to form openings to expose the transparent material; introducing a first isotropic etchant into the openings and etching the transparent material where exposed to form initial lens shapes having a radius; stripping the photoresist; exposing the transparent material to a second isotropic etchant to increase the radius of the lens shapes; and depositing a lens material overlying the transparent material, whereby the lens shapes are at least partially filled with lens material. An embodiment of the CCD array comprises an array of CCD pixels on a substrate; and a lens array in contact with the array of CCD pixels; wherein the lens array comprises a transparent material having concave indentations, and a lens material at least partially filling the concave indentations forming a plano-convex lens in contact with the transparent material.
    • 提供一种形成微透镜结构的方法以及采用微透镜阵列的CCD阵列结构。 该方法的一个实施例包括提供具有在表面上具有光元件的表面的基底; 沉积覆盖衬底表面的透明材料; 沉积和图案化覆盖透明材料的光致抗蚀剂层以形成露出透明材料的开口; 在开口中引入第一各向同性蚀刻剂并蚀刻暴露以形成具有半径的初始透镜形状的透明材料; 剥离光刻胶; 将透明材料暴露于第二各向同性蚀刻剂以增加透镜形状的半径; 以及沉积覆盖透明材料的透镜材料,由此透镜形状至少部分地被透镜材料填充。 CCD阵列的一个实施例包括衬底上的CCD像素阵列; 以及与CCD像素阵列接触的透镜阵列; 其中所述透镜阵列包括具有凹陷痕的透明材料,以及透镜材料,其至少部分地填充形成与所述透明材料接触的平凸透镜的所述凹陷痕。
    • 9. 发明申请
    • Sub-Resolutional Grayscale Reticle
    • 子分辨灰度光栅
    • US20100040958A1
    • 2010-02-18
    • US12193568
    • 2008-08-18
    • Bruce D. UlrichYoshi OnoWei Gao
    • Bruce D. UlrichYoshi OnoWei Gao
    • G03F1/00
    • G03F1/50G03F7/0005
    • A sub-resolutional grayscale reticle and associated fabrication method have been presented. The method provides a transparent substrate, and forms a plurality of coincident partial-light transmissive layers overlying the transparent substrate. A pattern is formed, sub-resolutional at a first wavelength, in at least one of the transmissive layers. If there are n transmissive layers, the reticle transmits at least (n+1) intensities of light. In one aspect, each of the plurality of transmissive layers has the same extinction coefficient and the same thickness. In other aspects, the transmissive layers may have different thickness. Then, even if the extinction coefficients are the same, the attenuation of light through each layer is different. The transmission characteristics of the reticle can be further varied if the transmissive layers have different extinction coefficients. Likewise, the transmission characteristics through the sub-resolutional patterns can be varied.
    • 已经提出了一种亚分辨灰度标线和相关的制造方法。 该方法提供透明基板,并且形成覆盖透明基板的多个重合部分透光层。 在至少一个透射层中形成在第一波长处副溶液的图案。 如果存在n个透射层,则光罩传播至少(n + 1)个光强。 在一个方面,多个透射层中的每一个具有相同的消光系数和相同的厚度。 在其它方面,透射层可以具有不同的厚度。 那么即使消光系数相同,每层的光的衰减也是不同的。 如果透射层具有不同的消光系数,则可以进一步改变掩模版的透射特性。 同样,可以改变通过子解决图案的传输特性。
    • 10. 发明授权
    • Method of fabricating a p-type CaO-doped SrCu2O2 thin film
    • 制造p型CaO掺杂SrCu2O2薄膜的方法
    • US07087526B1
    • 2006-08-08
    • US11261020
    • 2005-10-27
    • Wei-Wei ZhuangWei GaoYoshi Ono
    • Wei-Wei ZhuangWei GaoYoshi Ono
    • H01L23/02
    • C23C26/00
    • A method of CaO-doped SrCu2O2 spin-on precursor synthesis and low temperature p-type thin film deposition, includes preparing a wafer to receive a spin-coating thereon; selecting metalorganic compounds to form a SrCu2O2 precursor, mixing and refluxing the metalorganic compounds to form a precursor mixture; filtering the precursor mixture to produce a spin-coating precursor; applying the spin-coating precursor to the wafer in a two-step spin coating procedure; baking the spin-coated wafer using a hot-plate bake to evaporate substantially all of the solvents; and annealing the spin-coated wafer to form a CaO-doped SrCu2O2 layer thereon.
    • 掺有CaO的SrCu 2 O 2 O 2旋涂前体合成和低温p型薄膜沉积的方法包括制备晶片以在其上接受旋涂法 ; 选择金属有机化合物以形成SrCu 2 O 2 O 2前体,将金属有机化合物混合并回流以形成前体混合物; 过滤前体混合物以产生旋涂前体; 以两步旋涂方法将旋涂前驱体施加到晶片上; 使用热板烘烤烘烤旋涂的晶片以基本上蒸发所有溶剂; 以及对旋涂的晶片退火以在其上形成掺杂CaO的SrCu 2 O 2 O 2层。