会员体验
专利管家(专利管理)
工作空间(专利管理)
风险监控(情报监控)
数据分析(专利分析)
侵权分析(诉讼无效)
联系我们
交流群
官方交流:
QQ群: 891211   
微信请扫码    >>>
现在联系顾问~
热词
    • 9. 发明申请
    • PROCESS FOR CLEANING SEMICONDUCTOR ELEMENT
    • 清洁半导体元件的工艺
    • US20110146726A1
    • 2011-06-23
    • US12995303
    • 2009-05-20
    • Keiichi TanakaRyuji Sotoaka
    • Keiichi TanakaRyuji Sotoaka
    • B08B3/00
    • H01L21/02071G03F7/423
    • In a wiring formation process for a semiconductor device, the resist residue forming in dry etching with a reactive gas and aching with a plasma gas is removed, not corroding the members of the semiconductor device such as the interlayer insulating material and the wiring material thereof, and the device is protected from after-corrosion to occur after left for a given period of time after the treatment.According to a method comprising (1) washing step with an aqueous solution containing hydrofluoric acid, (2) a washing step with a mixed solution of ammonia and hydrogen peroxide, and (3) a washing step with hydrogen peroxide water, the resist residue on the side wall of a metal wiring that comprises aluminium (Al) as the main ingredient thereof is removed, and occurrence of after-corrosion is prevented.
    • 在半导体装置的布线形成工序中,去除了用反应气体的干蚀刻形成的抗蚀剂残留物和等离子体气体的起伏,而不会腐蚀诸如层间绝缘材料及其布线材料的半导体器件的部件, 并且在处理之后,在保持一段给定的时间后,保护装置免于腐蚀。 根据包括(1)用含有氢氟酸的水溶液进行洗涤步骤的方法,(2)用氨和过氧化氢的混合溶液进行洗涤步骤,和(3)用过氧化氢水洗涤步骤,将抗蚀剂残留物 除去以铝(Al)为主要成分的金属配线的侧壁,防止发生腐蚀。