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1. 发明专利

JP2009127042A Pressure-sensitive adhesive composition, pressure-sensitive adhesive sheet, and method for manufacturing semiconductor device 有权
标题翻译：压敏粘合剂组合物，压敏粘合片和制造半导体器件的方法
公开(公告)号：JP2009127042A
公开(公告)日：2009-06-11
申请号：JP2007307394
申请日：2007-11-28
申请人： Lintec Corp , リンテック株式会社
发明人： KOYAKATA MASAHIRO , SHINODA TOMONORI , SHIZUHATA HIRONORI
IPC分类号： C09J133/00 , C09J5/00 , C09J7/02 , C09J163/00 , H01L21/301 , H01L21/52 , H01L25/065 , H01L25/07 , H01L25/18
CPC分类号： H01L2924/0002 , H01L2924/00
摘要： PROBLEM TO BE SOLVED: To provide a pressure-sensitive adhesive composition and a pressure-sensitive adhesive sheet, capable of holding adhesiveness onto a chip reverse face even when exposed to a high temperature and high humidity, and exhibiting excellent moisture resistance even when exposed to the high temperature and high humidity under the impression of a voltage.
SOLUTION: This pressure-sensitive adhesive composition contains an acrylic polymer, a compound having a functional group reacting with an epoxy group and an unsaturated hydrocarbon group in one molecule, an epoxy thermosetting resin, and an ion scavenger.
COPYRIGHT: (C)2009,JPO&INPIT
摘要翻译：要解决的问题：提供即使暴露在高温高湿下也能够在贴片反面上保持粘合性的粘合剂组合物和压敏粘合片，并且甚至具有优异的耐湿性当暴露在高温和高湿度的压力下。解决方案：该压敏粘合剂组合物包含丙烯酸类聚合物，具有与一个分子中的环氧基和不饱和烃基反应的官能团的化合物，环氧热固性树脂和离子清除剂。版权所有（C）2009，JPO＆INPIT

2. 发明专利

JP2007122965A Insulation sheet for conductive junction sheet, conductive junction sheet, method of manufacturing conductive junction sheet and method of manufacturing electronic composite component 有权
标题翻译：导电连接片绝缘片，导电连接片，制造导电连接片的方法及制造电子复合组件的方法
公开(公告)号：JP2007122965A
公开(公告)日：2007-05-17
申请号：JP2005311379
申请日：2005-10-26
申请人： Lintec Corp , Senju Metal Ind Co Ltd , リンテック株式会社 , 千住金属工業株式会社
发明人： SHINODA TOMONORI , YAMAZAKI OSAMU , SAEKI NAOYA , KOYAKATA MASAHIRO , KAWAMATA YUJI , TAJIMA TAKESHI , SHIMAMURA MASAHITO , WATANABE MASAKO , AMAMI MASAZUMI
IPC分类号： H01B17/56 , B32B7/02 , H01B5/14 , H01B13/00 , H01L21/60 , H05K3/32
CPC分类号： H05K3/3478 , C09J7/29 , C09J2433/00 , H01L2224/16225 , H01L2224/32225 , H01L2224/73204 , H01L2924/15311 , H05K2201/10424 , H05K2203/041 , H01L2924/00
摘要： PROBLEM TO BE SOLVED: To provide an insulation sheet for a conductive junction sheet capable of solidly holding arranged conductive particles and of preventing loss thereof; to provide a conductive junction sheet and its manufacturing method; and to provide a manufacturing method of an electronic composite component using the conductive junction sheet. SOLUTION: This insulation sheet for the conductive junction sheet is characterized by having at least one adhesive layer capable of holding conductive particles. This conductive junction sheet using it and this method of manufacturing an electronic composite component using the conductive junction sheet are also provided. COPYRIGHT: (C)2007,JPO&INPIT
摘要翻译：要解决的问题：提供一种能够牢固地保持布置的导电颗粒并防止其损失的导电接合片的绝缘片; 提供导电接合片及其制造方法; 并提供使用导电性接合片的电子复合元件的制造方法。解决方案：用于导电接合片的绝缘片的特征在于具有至少一个能够保持导电颗粒的粘合剂层。还提供了使用它的导电接合片和使用导电接合片制造电子复合元件的方法。版权所有（C）2007，JPO＆INPIT

3. 发明专利

JP2013120839A Dicing sheet with protective film forming layer and method for fabricating semiconductor chip 有权
标题翻译：具有保护膜形成层的表和用于制造半导体芯片的方法
公开(公告)号：JP2013120839A
公开(公告)日：2013-06-17
申请号：JP2011267990
申请日：2011-12-07
申请人： Lintec Corp , リンテック株式会社
发明人： SHINODA TOMONORI , KOYAKATA MASAHIRO , TAKANO TAKESHI
IPC分类号： H01L21/301 , C09J7/02
摘要： PROBLEM TO BE SOLVED: To provide a dicing sheet with a protective film forming layer which has high uniformity in thickness, can easily produce a semiconductor chip having a protective film with good print accuracy, and has a heat resistance property.SOLUTION: A dicing sheet comprises a protective film forming layer 4 on an adhesive layer of an adhesive sheet 3 consisting of a base film 1 and the adhesive layer 2, the protective film forming layer is formed on an inner perimeter of the adhesive sheet, and the adhesive layer is exposed to an outer perimeter of the adhesive sheet. The melting point of the base film exceeds 130°C or the base film does not have the melting point, and the thermal shrinkage of the base film heated at 130°C and for 2 hours, is -1 to +1%.
摘要翻译：要解决的问题：为了提供具有高均匀度的保护膜形成层的切割片，可以容易地制造具有良好打印精度的保护膜的半导体芯片，并且具有耐热性。解决方案：切割片在由基膜1和粘合剂层2组成的粘合片3的粘合剂层上包括保护膜形成层4，保护膜形成层形成在粘合剂的内周上并且粘合剂层暴露于粘合片的外周。基膜的熔点超过130℃，或者基膜不具有熔点，在130℃加热2小时的基膜的热收缩率为-1〜+ 1％。版权所有（C）2013，JPO＆INPIT

4. 发明专利

JP2009260047A Sheet for die sort 有权
标题翻译：表格排版
公开(公告)号：JP2009260047A
公开(公告)日：2009-11-05
申请号：JP2008107480
申请日：2008-04-17
申请人： Lintec Corp , リンテック株式会社
发明人： KOYAKATA MASAHIRO , SHINODA TOMONORI
IPC分类号： H01L21/683 , C09J7/02
摘要： PROBLEM TO BE SOLVED: To provide a sheet for die sort capable of stably holding a chip with tack, and easily picking up the chip with the tack. SOLUTION: A sheet 1 for die sort comprises a disc-like base material film 2, and an annular adhesive sheet 3 stacked on the periphery of the base material film 2. The central portion of the surface of the base material film 2 is a chip temporary fitting part 20, and the surface roughness Ra of the chip temporary fitting part 20 is 0.01-0.4 μm. COPYRIGHT: (C)2010,JPO&INPIT
摘要翻译：要解决的问题：提供一种能够稳定地保持具有粘性的芯片的模具分类的片材，并且容易地用该粘性物质拾取芯片。解决方案：用于模具分类的片材1包括盘状基材膜2和层叠在基材膜2的周边上的环状粘合片3.基材膜2的表面的中心部分是芯片临时嵌合部20，芯片临时嵌合部20的表面粗糙度Ra为0.01-0.4μm。版权所有（C）2010，JPO＆INPIT

5. 发明专利

JP2009203337A Pressure-sensitive adhesive composition, pressure-sensitive adhesive sheet, and method for manufacturing semiconductor device 审中-公开
标题翻译：压敏粘合剂组合物，压敏粘合片和制造半导体器件的方法
公开(公告)号：JP2009203337A
公开(公告)日：2009-09-10
申请号：JP2008046591
申请日：2008-02-27
申请人： Lintec Corp , リンテック株式会社
发明人： SHIZUHATA HIRONORI , SHINODA TOMONORI , KOYAKATA MASAHIRO
IPC分类号： C09J133/00 , C09J7/02 , C09J11/04 , C09J11/06 , C09J11/08 , C09J163/00 , H01L21/301 , H01L21/52
摘要： PROBLEM TO BE SOLVED: To achieve high package reliability even if a package, to which a semiconductor chip is mounted, is exposed to high temperature and high humidity or exposed to high temperature and high humidity under voltage application. SOLUTION: The pressure-sensitive adhesive composition comprises an acrylic polymer (A), an epoxy resin (B) having an epoxy equivalent of 180 g/eq or less, a curing agent (C), and an ion scavenger (D). The content of the ion scavenger (D) is 1-20 pts.wt. for 100 pts.wt. of all the resin components. COPYRIGHT: (C)2009,JPO&INPIT
摘要翻译：要解决的问题：即使安装了半导体芯片的封装暴露于高温高湿或暴露于高温高湿的电压施加下，也可实现高封装可靠性。解决方案：压敏粘合剂组合物包含丙烯酸类聚合物（A），环氧当量为180g / eq以下的环氧树脂（B），固化剂（C）和离子清除剂（D ）。离子清除剂（D）的含量为1-20重量份 100磅重的所有树脂组分。版权所有（C）2009，JPO＆INPIT

6. 发明专利

JP2007053240A Sheet shared by dicing and die bonding, and manufacturing method of semiconductor device using the same 有权
标题翻译：通过定位和DIE结合共享的薄片以及使用其的半导体器件的制造方法
公开(公告)号：JP2007053240A
公开(公告)日：2007-03-01
申请号：JP2005237411
申请日：2005-08-18
申请人： Lintec Corp , リンテック株式会社
发明人： YAMAZAKI OSAMU , SHINODA TOMONORI , KOYAKATA MASAHIRO
IPC分类号： H01L21/301 , C09J7/02 , C09J201/00 , H01L21/52 , H01L25/065 , H01L25/07 , H01L25/18
CPC分类号： H01L24/27 , H01L24/73 , H01L2224/32145 , H01L2224/32225 , H01L2224/45144 , H01L2224/48091 , H01L2224/48227 , H01L2224/73265 , H01L2924/01005 , H01L2924/01006 , H01L2924/01013 , H01L2924/01024 , H01L2924/01029 , H01L2924/01033 , H01L2924/01074 , H01L2924/01075 , H01L2924/01079 , H01L2924/01082 , H01L2924/10253 , H01L2924/00014 , H01L2924/00 , H01L2924/00012
摘要： PROBLEM TO BE SOLVED: To provide a sheet shared by dicing and die bonding which is easily pasted to a semiconductor wafer and reducing damage of a bonding wire, as well as reducing variation in height of a semiconductor device which is caused by poor precision in thickness of an adhesive layer for bonding semiconductor chips together, variation in height from a substrate to the surface of a semiconductor chip in the top layer, inclination of the semiconductor chip in the top layer, and the like. SOLUTION: A sheet 10 shared by dicing and die bonding consists of: a base material 11; a wire embedded layer 12 which is stacked on the base material for peeling; and an insulating layer 13 stacked on the wire embedded layer. The wire embedded layer 12 has a storage modulus of 1×10 4 Pa or less at 120°C. The insulating layer 13 has such adhesion as can be pasted to an object 2 at 60°C or less. The elasticity ratio (insulating layer/wire embedded layer) between the insulating layer 13 and the wire embedded layer 12 at 120°C is 10 or higher. A voluminal resistivity of the wire embedded layer 12 and the insulating layer 13 is 1×10 13 Ωcm or higher, respectively. COPYRIGHT: (C)2007,JPO&INPIT
摘要翻译：要解决的问题：为了提供易于粘贴到半导体晶片的切割和芯片接合共享的薄片，并减少接合线的损伤，以及减少由于差的导致的半导体器件的高度变化用于将半导体芯片接合在一起的粘合剂层的厚度精度，顶层中的衬底到半导体芯片的表面的高度变化，顶层中的半导体芯片的倾斜度等。解决方案：通过切割和芯片粘合共享的薄片10由以下部件组成：基材11; 层叠在基材上以进行剥离的导线埋入层12; 以及堆叠在导线嵌入层上的绝缘层13。电线埋入层12在120℃下的储能模量为1×10 4 SP / Pa以下。绝缘层13具有可以在60℃以下粘贴到物体2上的粘合性。在120℃下绝缘层13和导线埋入层12之间的弹性率（绝缘层/导线嵌入层）为10以上。导线埋入层12和绝缘层13的体积电阻率分别为1×10 13Ω/ cm以上。版权所有（C）2007，JPO＆INPIT

7. 发明专利

JP2014030029A Dicing sheet with protective film formation layer and manufacturing method of chip 有权
标题翻译：具有保护膜形成层和芯片制造方法的标签
公开(公告)号：JP2014030029A
公开(公告)日：2014-02-13
申请号：JP2013184381
申请日：2013-09-05
申请人： Lintec Corp , リンテック株式会社
发明人： SHINODA TOMONORI , KOYAKATA MASAHIRO , TAKANO TAKESHI
IPC分类号： H01L21/301 , C09J7/02 , C09J201/00
CPC分类号： H01L21/6836 , C09J7/40 , C09J2201/622 , C09J2203/326 , H01L21/304 , H01L21/78 , H01L23/544 , H01L2221/68327 , H01L2221/68377 , H01L2223/54406 , H01L2223/54433 , H01L2223/54486 , H01L2924/0002 , Y10T428/24843 , H01L2924/00
摘要： PROBLEM TO BE SOLVED: To provide a dicing sheet with a protective film formation layer having high uniformity of the thickness, capable of easily manufacturing a semiconductor chip including a protection film having excellent print precision, being expanded, and including a substrate having heat resistance.SOLUTION: A dicing sheet 10 with a protective film formation layer includes a substrate film 1, an adhesive layer 2, and a protective film formation layer 4, and the substrate film has a specific characteristic. In addition, the protective film formation layer is formed so as to be surrounded with the adhesive layer in the planar view, and has a thermosetting property.
摘要翻译：要解决的问题：为了提供具有高均匀度的保护膜形成层的切割片，能够容易地制造包括具有优异的印刷精度的保护膜的半导体芯片，并且包括具有耐热性的基板。解决方案：具有保护膜形成层的切割片10包括基底膜1，粘合剂层2和保护膜形成层4，并且基底膜具有特定的特性。此外，保护膜形成层形成为在平面图中被粘合剂层包围，并且具有热固性。

8. 发明专利

JP2013131593A Dicing sheet with protective film forming layer and chip manufacturing method 有权
标题翻译：具有保护膜形成层和芯片制造方法的标签
公开(公告)号：JP2013131593A
公开(公告)日：2013-07-04
申请号：JP2011279304
申请日：2011-12-21
申请人： Lintec Corp , リンテック株式会社
发明人： SHINODA TOMONORI , KOYAKATA MASAHIRO , TAKANO TAKESHI
IPC分类号： H01L21/301 , B32B27/00 , C09D201/00 , C09J7/02 , C09J201/00 , H01L23/00
摘要： PROBLEM TO BE SOLVED: To provide a dicing sheet with a protective film forming layer, which enables simple manufacturing of a semiconductor chip having a highly uniform thickness and excellent printing precision; and in which the protective film forming layer is cured and adhesion of a pressure-sensitive adhesive sheet is reduced in a heating process thereby to achieve easy pickup of the semiconductor chip having the protective film and a simple manufacturing process of the semiconductor chip.SOLUTION: A dicing sheet with a protective film forming layer comprises: a pressure-sensitive adhesive sheet 3 which includes a base film 1 and an adhesive layer 2; a heat-curable protective film forming layer 4 which is to be a protective film by heating and which is formed on the adhesive layer of the pressure-sensitive adhesive sheet 3. An adhesive strength between the pressure-sensitive sheet 3 and the protective film is reduced by heating. And a heat generation occurrence temperature of the heat-curable protective film forming layer 4 is lower than an adhesive strength reduction temperature.
摘要翻译：要解决的问题：为了提供具有保护膜形成层的切割片，能够简单地制造具有高度均匀的厚度和优异的印刷精度的半导体芯片; 并且其中保护膜形成层被固化并且在加热过程中降低了压敏粘合片的粘合，从而实现了具有保护膜的半导体芯片的容易拾取以及半导体芯片的简单制造工艺。解决方案：具有保护膜形成层的切割片包括：粘合片3，其包括基膜1和粘合剂层2; 通过加热成为保护膜的热固性保护膜形成层4，形成在粘合片3的粘合剂层上。压敏片3与保护膜之间的粘合强度为通过加热减少并且热固化保护膜形成层4的发热发生温度低于粘合强度降低温度。

9. 发明专利

JP2009127043A Tacky adhesive composition, tacky-adhesive sheet and method for manufacturing semiconductor device 有权
标题翻译：胶粘剂组合物，粘合剂粘合片和制造半导体器件的方法
公开(公告)号：JP2009127043A
公开(公告)日：2009-06-11
申请号：JP2007307395
申请日：2007-11-28
申请人： Lintec Corp , リンテック株式会社
发明人： SHINODA TOMONORI , KOYAKATA MASAHIRO , SHIZUHATA HIRONORI
IPC分类号： C09J133/00 , C09J5/06 , C09J7/02 , C09J11/00 , C09J163/10 , H01L21/301 , H01L21/52
摘要： PROBLEM TO BE SOLVED: To achieve high reliability of a semiconductor-mounted package even when the semiconductor-mounted package is exposed to a high-temperature and high-humidity atmosphere and even when the semiconductor-mounted package of a voltage-impressed state is exposed to the high-temperature and high-humidity atmosphere.
SOLUTION: The tacky adhesive composition comprises an acrylic polymer, a thermosetting epoxy resin having an unsaturated hydrocarbon group, a thermosetting agent and an ion capturing agent and has 1-15 parts weight ion capturing agent content on the basis of 100 parts weight all of resin components.
COPYRIGHT: (C)2009,JPO&INPIT

10. 发明专利

JP2013165289A Dicing sheet with identification symbol and method for manufacturing the same 有权
标题翻译：具有识别符号的标签及其制造方法
公开(公告)号：JP2013165289A
公开(公告)日：2013-08-22
申请号：JP2013089607
申请日：2013-04-22
申请人： Lintec Corp , リンテック株式会社
发明人： YAMAZAKI OSAMU , KOYAKATA MASAHIRO , HAMAZAKI AKIE
IPC分类号： H01L21/301
摘要： PROBLEM TO BE SOLVED: To provide a dicing sheet with an identification symbol which can be identified even after being stuck to a wafer, and to which the identification symbol such as a name of an article is affixed without damaging the dicing sheet, and also to provide a method for manufacturing the dicing sheet.SOLUTION: The dicing sheet 1 comprises a substantially circular base 2 and an adhesive layer 3; and an annular base 4 and an adhesive layer 5 for sticking a ring frame laminated on in the periphery on the adhesive layer 3. The identification symbol 8 of the dicing sheet 1 is printed in a space between a ring frame sticking portion 6 and a wafer sticking portion 7.
摘要翻译：要解决的问题：为了提供一种具有识别符号的切割片，即使在粘贴到晶片之后也可以识别，并且诸如物品名称等识别符号不损坏切割片，并且还可以提供了制造切割片的方法。解决方案：切割片1包括基本圆形的基底2和粘合剂层3; 以及用于粘贴层叠在粘合剂层3周围的环形框架的环状基底4和粘合剂层5.切割片1的识别符号8印刷在环形框架粘着部分6和晶片之间的空间中粘贴部分7。

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