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1. 发明授权

US08664003B2 Chip provided with film having hole pattern with the use of thermoresponsive polymer and method of producing the same 有权
标题翻译：具有使用热电聚合物的具有孔图案的膜的芯片及其制造方法
公开(公告)号：US08664003B2
公开(公告)日：2014-03-04
申请号：US13569291
申请日：2012-08-08
申请人： Eiichi Tamiya , Yoshiyuki Yokoyama , Satoshi Fujiki , Katsumi Tanino , Atsushi Muraguchi , Hiroyuki Kishi , Yoshiharu Tokimitsu , Shohei Yamamura
发明人： Eiichi Tamiya , Yoshiyuki Yokoyama , Satoshi Fujiki , Katsumi Tanino , Atsushi Muraguchi , Hiroyuki Kishi , Yoshiharu Tokimitsu , Shohei Yamamura
IPC分类号： C12Q1/24
CPC分类号： C12N5/0068 , C12N2533/12 , C12N2535/10 , C12N2537/10 , C12N2539/10 , Y10T428/24273 , Y10T436/25 , Y10T436/25375
摘要： A chip useful for treating cells and the like which has a mechanism and a structure wherein the size of a hole pattern is arbitrarily changed so that cells can easily move in and get out from the hole in scattering or collecting cells but can hardly get out from the hole during washing or antigen-stimulation. The chip comprises a crosslinked product of a temperature-responsive polymer as a constituting member and being provided with a film having a hole pattern on the surface of a baseboard. A method of producing the chip comprises applying a composition containing a crosslinkable temperature-responsive polymer on the surface of a baseboard to thereby form a coating film, crosslinking the coating film to thereby form the crosslinked product as described above and then forming a hole pattern on the coating film of the crosslinked product.
摘要翻译：用于处理细胞等的芯片，其具有机构和结构，其中孔图案的尺寸任意改变，使得细胞可以容易地在散射或收集细胞中从孔中移出并离开，但几乎不能从洗涤期间的孔或抗原刺激。芯片包括作为构成部件的温度敏感性聚合物的交联体，并且在基板的表面上设置有具有孔图案的膜。制造该芯片的方法包括在基板的表面上涂布含有交联性温度敏感性聚合物的组合物，从而形成涂膜，使涂膜交联从而形成如上所述的交联产物，然后在交联产物的涂膜。

2. 发明申请

US20090130384A1 Chip Provided with film Having Hole Pattern with the Use of Thermoresponsive Polymer and Method of Producing the Same 审中-公开
标题翻译：带有膜的芯片具有使用热聚合物的孔图案及其制造方法
公开(公告)号：US20090130384A1
公开(公告)日：2009-05-21
申请号：US11992594
申请日：2006-09-27
申请人： Eiichi Tamiya , Yoshiyuki Yokoyama , Satoshi Fujiki , Katsumi Tanino , Atsushi Muraguchi , Horoyuki Kishi , Yoshiharu Tokimitsu , Shohei Yamamura
发明人： Eiichi Tamiya , Yoshiyuki Yokoyama , Satoshi Fujiki , Katsumi Tanino , Atsushi Muraguchi , Horoyuki Kishi , Yoshiharu Tokimitsu , Shohei Yamamura
IPC分类号： B32B3/10 , C12N11/04 , B05D3/00 , G03F7/20
CPC分类号： C12N5/0068 , C12N2533/12 , C12N2535/10 , C12N2537/10 , C12N2539/10 , Y10T428/24273 , Y10T436/25 , Y10T436/25375
摘要： [Problems] To provide a novel chip useful for treating cells and the like which has a mechanism and a structure wherein the size of a hole pattern is arbitrarily changed so that cells can easily move in and get out from the hole in scattering or collecting cells but can hardly get out from the hole during washing or antigen-stimulation.[Means for Solving Problems] A chip comprising a crosslinked product of a temperature-responsive polymer as a constituting member and being provided with a film having a hole pattern on the surface of a baseboard. A method of producing a chip which comprises a crosslinked product of a temperature-responsive polymer as a constituting member and is provided with a film having a hole pattern on the surface of the baseboard. This method comprises applying a composition containing a crosslinkable temperature-responsive polymer, a composition containing a crosslinkable temperature-responsive polymer and a crosslinking agent or a composition containing a temperature-responsive polymer and a crosslinking agent on the surface of a baseboard to thereby form a coating film, crosslinking the coating film to thereby form the crosslinked product as described above and then forming a hole pattern on the coating film of the crosslinked product.
摘要翻译： [问题]提供一种用于处理细胞等的新颖的芯片，其具有机构和结构，其中孔图案的尺寸任意改变，使得细胞可以容易地在散射或收集细胞中从孔中移出和离开但在洗涤或抗原刺激期间几乎不能从孔中脱出。解决问题的手段一种芯片，其包含作为构成部件的温度敏感性聚合物的交联体，并且在基板的表面设置有具有孔图案的膜。一种制造芯片的方法，其包括作为构成部件的温度敏感性聚合物的交联产物，并且在基板的表面上设置有具有孔图案的膜。该方法包括在基板的表面上涂布含有交联性温度响应性聚合物的组合物，含有交联性温度敏感性聚合物和交联剂的组合物或含有温度敏感性聚合物和交联剂的组合物，从而形成使涂膜交联，由此形成如上所述的交联产物，然后在交联产物的涂膜上形成孔图案。

3. 发明申请

US20080014631A1 Microwell Array Chip and Its Manufacturing Method 审中-公开
标题翻译：微孔阵列芯片及其制造方法
公开(公告)号：US20080014631A1
公开(公告)日：2008-01-17
申请号：US10573289
申请日：2004-09-22
申请人： Atsushi Muraguchi , Hiroyuki Kishi , Yoshiharu Tokimitsu , Sachiko Kondo , Tsutomu Obata , Satoshi Fujiki , Yoshiyuki Yokoyama , Hirofumi Nabesawa , Sotohiro Takabayashi , Katsumi Tanino
发明人： Atsushi Muraguchi , Hiroyuki Kishi , Yoshiharu Tokimitsu , Sachiko Kondo , Tsutomu Obata , Satoshi Fujiki , Yoshiyuki Yokoyama , Hirofumi Nabesawa , Sotohiro Takabayashi , Katsumi Tanino
IPC分类号： C12M1/34
CPC分类号： G01N33/54366 , A61K35/12 , A61K48/00 , B01J19/0046 , B01J2219/00659 , C12M23/12
摘要： A microwell array chip having multiple microwells on a principal surface of a substrate, said microwells being of a shape and size permitting the storage of only a single organic cell in each microwell, wherein microwell markers are present on the same substrate surface as the openings of the microwells. A microwell array chip having multiple microwells on a principal surface of a substrate, said microwells being of a shape and size permitting the storage of only a single organic cell in each microwell, wherein protrusions are present in the openings of said microwells so as to narrow said openings. A method for manufacturing the microwell array chip. The method comprises the steps of: forming a film on at least one principal surface of a substrate; applying a resist coating on the film that has been formed; exposing the resist surface through a mask having a microwell pattern and removing uncured portions of resist; etching the exposed portions of said film and substrate to fabricate wells in the form of a microwell array; and removing the resist. A microwell array chip made of silicon and having multiple microwells, each microwell being used to store a single specimen organic cell, wherein each microwell is of a size and shape holding just one organic cell.
摘要翻译：一种微孔阵列芯片，其在基底的主表面上具有多个微孔，所述微孔具有允许在每个微孔中仅存储单个有机细胞的形状和尺寸，其中微孔标记物存在于与基底表面的开口相同的基底表面上微孔。一种微孔阵列芯片，其在基底的主表面上具有多个微孔，所述微孔具有允许在每个微孔中仅存储单个有机细胞的形状和尺寸，其中突起存在于所述微孔的开口中以使其变窄说开口一种微孔阵列芯片的制造方法。该方法包括以下步骤：在衬底的至少一个主表面上形成膜; 在已经形成的膜上施加抗蚀剂涂层; 通过具有微孔图案的掩模曝光抗蚀剂表面并除去未固化的抗蚀剂部分; 蚀刻所述膜和基底的暴露部分以制造微孔阵列形式的孔; 并除去抗蚀剂。由硅制成并具有多个微孔的微孔阵列芯片，每个微孔用于存储单个样品有机电池，其中每个微孔具有仅具有一个有机电池的尺寸和形状。

4. 发明申请

US20110195496A1 MICROWELL ARRAY CHIP AND METHOD OF MANUFACTURING SAME 有权
标题翻译： MICROWELL阵列芯片及其制造方法
公开(公告)号：US20110195496A1
公开(公告)日：2011-08-11
申请号：US13088582
申请日：2011-04-18
申请人： Atsushi MURAGUCHI , Hiroyuki Kishi , Yoshiharu Tokimitsu , Sachiko Kondo , Tsutomu Obata , Satoshi Fujiki , Yoshiyuki Yokoyama , Hirofumi Nabesawa , Sotohiro Takabayashi , Katsumi Tanino
发明人： Atsushi MURAGUCHI , Hiroyuki Kishi , Yoshiharu Tokimitsu , Sachiko Kondo , Tsutomu Obata , Satoshi Fujiki , Yoshiyuki Yokoyama , Hirofumi Nabesawa , Sotohiro Takabayashi , Katsumi Tanino
IPC分类号： C12N5/078
CPC分类号： G01N33/54366 , A61K35/12 , A61K48/00 , B01J19/0046 , B01J2219/00659 , C12M23/12 , G06F19/00
摘要： The present invention is directed to a microwell array chip made of silicon and having multiple microwells. Each microwell is used to store a single specimen organic cell. Each microwell is of a size and shape holding just one organic cell, and the interior surface of the microwells are coated with a fluorocarbon film.
摘要翻译：本发明涉及由硅制成并具有多个微孔的微孔阵列芯片。每个微孔用于存储单个样品有机细胞。每个微孔具有只容纳一个有机电池的尺寸和形状，并且微孔的内表面涂覆有氟碳膜。

5. 发明授权

US09310362B2 Microwell array chip and method of manufacturing same 有权
标题翻译：微孔阵列芯片及其制造方法相同
公开(公告)号：US09310362B2
公开(公告)日：2016-04-12
申请号：US13088582
申请日：2011-04-18
申请人： Atsushi Muraguchi , Hiroyuki Kishi , Yoshiharu Tokimitsu , Sachiko Kondo , Tsutomu Obata , Satoshi Fujiki , Yoshiyuki Yokoyama , Hirofumi Nabesawa , Sotohiro Takabayashi , Katsumi Tanino
发明人： Atsushi Muraguchi , Hiroyuki Kishi , Yoshiharu Tokimitsu , Sachiko Kondo , Tsutomu Obata , Satoshi Fujiki , Yoshiyuki Yokoyama , Hirofumi Nabesawa , Sotohiro Takabayashi , Katsumi Tanino
IPC分类号： C12N5/16 , C12N5/00 , G01N33/543 , B01J19/00 , A61K35/12 , A61K48/00
CPC分类号： G01N33/54366 , A61K35/12 , A61K48/00 , B01J19/0046 , B01J2219/00659 , C12M23/12 , G06F19/00
摘要： A microwell array chip made of silicon and having multiple microwells where each microwell is used to store a single specimen organic cell. The microwell of the array chip is of a size and shape to hold just one organic cell and the interior surface of the microwells are coated with a fluorocarbon film.
摘要翻译：由硅制成并具有多个微孔的微孔阵列芯片，其中每个微孔用于存储单个样品有机电池。阵列芯片的微孔具有仅容纳一个有机电池的尺寸和形状，并且微孔的内表面涂覆有氟碳膜。

6. 发明授权

US4499010A Conductive paint 失效
标题翻译：导电漆
公开(公告)号：US4499010A
公开(公告)日：1985-02-12
申请号：US471924
申请日：1983-03-02
申请人： Katsumi Tanino , Satoshi Fujiki , Shinzi Okamoto
发明人： Katsumi Tanino , Satoshi Fujiki , Shinzi Okamoto
IPC分类号： C09D5/24 , H05K1/09 , H01B1/02
CPC分类号： C09D5/24 , H05K1/095
摘要： Conductive paint comprises an organic solvent having dissolved and dispersed therein a binder containing a thermosetting resin and a hydroquinone derivative which is a product resulting from reaction between a hydroquinone (polyhydric phenol) and a fatty acid having 10 to 20 carbon atoms, added to the thermosetting resin, metal powder as a conductive material, and preferably a fatty acid derived from natural oils and fats and having 10 to 20 carbon atoms. This conductive paint exhibits characteristics not inferior to those of the conventional Ag conductive paint, such as low specific resistance, high moisture resistance and high heat resistance, and is much less expensive than the conventional Ag conductive paint.
摘要翻译：导电涂料包括溶解并分散有含有热固性树脂和氢醌衍生物的粘合剂的有机溶剂，氢醌衍生物是由氢醌（多元酚）和具有10至20个碳原子的脂肪酸之间的反应产生的产物，加入到热固性树脂，金属粉末作为导电材料，优选衍生自天然油脂的脂肪酸，并具有10〜20个碳原子。该导电涂料具有不劣于常规Ag导电涂料的特性，例如低电阻率，高耐湿性和高耐热性，并且比常规Ag导电涂料便宜得多。

7. 发明申请

US20130216911A1 ACTIVE MATERIAL, ELECTRODE, SECONDARY BATTERY, BATTERY PACK, ELECTRIC VEHICLE, ELECTRIC ENERGY STORAGE SYSTEM, ELECTRIC POWER TOOL, AND ELECTRONIC UNIT 审中-公开
标题翻译：活性材料，电极，二次电池，电池组，电动车，电力储存系统，电动工具和电子单元
公开(公告)号：US20130216911A1
公开(公告)日：2013-08-22
申请号：US13590989
申请日：2012-08-21
申请人： Yosuke Hosoya , Guohua Li , Satoshi Fujiki
发明人： Yosuke Hosoya , Guohua Li , Satoshi Fujiki
IPC分类号： H01M4/485 , H01M4/58
CPC分类号： H01M4/485 , H01M4/1397 , H01M4/362 , H01M4/366 , H01M4/5825 , H01M10/0525 , Y02E60/122 , Y02T10/7011
摘要： A secondary battery includes: a cathode; an anode; and an electrolytic solution. The cathode includes two or more kinds of lithium transition metal complex phosphate particles including lithium and one or two or more transition metals as constituent elements, and the composition of the one or two or more transition metals differs between the two or more kinds of lithium transition metal complex phosphate particles.
摘要翻译：二次电池包括：阴极; 阳极; 和电解液。阴极包括两种以上的锂过渡金属络合磷酸盐粒子，其包含锂和一种或两种以上的过渡金属作为构成元素，一种或两种以上的过渡金属的组成在两种以上的锂转变金属络合磷酸盐颗粒。

8. 发明申请

US20110059367A1 POSITIVE ELECTRODE ACTIVE MATERIAL, POSITIVE ELECTRODE, NONAQUEOUS ELECTROLYTE CELL, AND METHOD OF PREPARING POSITIVE ELECTRODE ACTIVE MATERIAL 有权
标题翻译：正极电极活性材料，阳极电极，非电解电解质电池及其制备电极活性材料的方法
公开(公告)号：US20110059367A1
公开(公告)日：2011-03-10
申请号：US12878497
申请日：2010-09-09
申请人： Koji Morita , Yosuke Hosoya , Satoshi Fujiki , Kazunari Motohashi , Guohua Li , Kazuaki Endoh
发明人： Koji Morita , Yosuke Hosoya , Satoshi Fujiki , Kazunari Motohashi , Guohua Li , Kazuaki Endoh
IPC分类号： H01M4/505 , H01M4/48
CPC分类号： H01M4/483 , C01G51/006 , C01G51/42 , C01P2002/50 , C01P2002/52 , C01P2004/20 , C01P2004/54 , C01P2004/61 , C01P2004/80 , C01P2006/40 , H01M4/0402 , H01M4/131 , H01M4/1315 , H01M4/1391 , H01M4/366 , H01M4/485 , H01M4/505 , H01M4/525 , H01M10/052 , H01M2004/021
摘要： Disclosed herein is a positive electrode active material prepared by mixing a lithium-containing compound, a compound containing a transition metal to be put into a solid solution, and a compound containing a metallic element M2 different from the transition metal, and firing the mixture to form composite oxide particles, depositing a compound containing at least one element selected from among sulfur (S), phosphorus (P) and fluorine (F) on surfaces of the particles, and firing the particles, whereby each of the particles is provided with a concentration gradient such that the concentration of the metallic element M2 increases from the center toward the surface of the particle, and at least one element selected from among (S), (P) and (F) is made present in the form of being aggregated at the surfaces of the composite oxide particles.
摘要翻译：本文公开了通过将含锂化合物，含有过渡金属的化合物与固溶体混合而制备的正极活性物质和含有不同于过渡金属的金属元素M2的化合物，并将该混合物烧成形成复合氧化物颗粒，在颗粒的表面上沉积含有选自硫（S），磷（P）和氟（F）中的至少一种元素的化合物，并且对颗粒进行烧制，由此每个颗粒设置有浓度梯度使得金属元素M2的浓度从颗粒的中心向表面增加，并且选自（S），（P）和（F）中的至少一种元素以聚集的形式存在在复合氧化物颗粒的表面。

9. 发明授权

US5275878A Composite dielectric and printed-circuit use substrate utilizing the same 失效
标题翻译：复合电介质和印刷电路用基板
公开(公告)号：US5275878A
公开(公告)日：1994-01-04
申请号：US648872
申请日：1991-01-31
申请人： Seishiro Yamakawa , Michimasa Tsuzaki , Kiyotaka Komori , Satoshi Fujiki , Akiyoshi Nozue , Kazunobu Abe , Masashi Aoki
发明人： Seishiro Yamakawa , Michimasa Tsuzaki , Kiyotaka Komori , Satoshi Fujiki , Akiyoshi Nozue , Kazunobu Abe , Masashi Aoki
IPC分类号： C08K7/22 , C08L71/12 , H05K1/03 , H05K1/16 , C08F23/00
CPC分类号： H05K1/0373 , C08K7/22 , C08L71/123 , H05K1/162 , H05K2201/0116 , H05K2201/0209 , Y10T428/249953 , Y10T428/249955 , Y10T428/249975 , Y10T428/249987 , Y10T428/249991 , Y10T428/27
摘要： A composite dielectric is formed with a matrix synthetic resin and particulate porous, inorganic dielectric dispersed in the matrix synthetic resin. The dielectric constant of this composite dielectric can be thereby elevated effectively without enlarging the dissipation factor (tan .delta.) of the composite dielectric.
摘要翻译：复合电介质由矩阵合成树脂和分散在基体合成树脂中的颗粒状多孔无机电介质形成。因此，可以有效地提高复合电介质的介电常数，而不会增大复合电介质的耗散因数（tan（delta））。

10. 发明申请

US20060127282A1 Microproduct, medical microproduct, microwell array chip, microwell position detection plate, and micro resin pipette tip using the microproduct 审中-公开
标题翻译：微产品，医用微型产品，微孔阵列芯片，微孔位置检测板和微型树脂移液管尖端使用微型产品
公开(公告)号：US20060127282A1
公开(公告)日：2006-06-15
申请号：US11272525
申请日：2005-11-10
申请人： Kazuyuki Yamashita , Takashi Onaga , Satoshi Fujiki , Hideki Morimoto , Tutomu Obata , Masayasu Suzuki
发明人： Kazuyuki Yamashita , Takashi Onaga , Satoshi Fujiki , Hideki Morimoto , Tutomu Obata , Masayasu Suzuki
IPC分类号： B01L3/02
CPC分类号： C08L23/12 , B29C45/0001 , B29C2045/0094 , C08L23/10 , C08L23/14 , C08L53/025 , C08L2666/24 , C08L2666/06
摘要： A microproduct includes a resin composition including a polypropylene-based resin and a hydrogenated derivative of a block copolymer shown by the general formula “X-Y”. The microproduct has micromachined features of a stamper precisely transferred by injection molding and a molded surface has a plurality of recesses and/or protrusions. In this case, X represents a polymer block immiscible with the polypropylene-based resin, and Y represents an elastomeric polymer block of a conjugated diene.
摘要翻译：微产品包括包含聚丙烯基树脂和由通式“X-Y”表示的嵌段共聚物的氢化衍生物的树脂组合物。该微型产品具有通过注射成型精确转移的压模的微加工特征，并且模制表面具有多个凹部和/或突起。在这种情况下，X表示与聚丙烯类树脂不混溶的聚合物嵌段，Y表示共轭二烯的弹性体聚合物嵌段。

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