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1. 发明申请

WO2004105112A1 SUBSTRATE HOLDING APPARATUS AND POLISHING APPARATUS 审中-公开
标题翻译：基板保持装置和抛光装置
公开(公告)号：WO2004105112A1
公开(公告)日：2004-12-02
申请号：PCT/JP2004/002219
申请日：2004-02-25
申请人： EBARA CORPORATION , TOGAWA, Tetsuji , NABEYA, Osamu
发明人： TOGAWA, Tetsuji , NABEYA, Osamu
IPC分类号： H01L21/304
CPC分类号： H01L21/6838 , B24B37/30 , B24B49/16 , H01L21/67092
摘要： A substrate holding apparatus holds a substrate such as a semiconductor and presses the substrate against a polishing surface. The substrate holding apparatus includes a top ring body (2) for holding the substrate, a plurality of fluid passages (33, 34, 35, 36) for supplying a fluid to a plurality of pressure chambers (22, 23, 24, 25) defined in the top ring body, and a plurality of sensors (S1, S2, S3, S4) disposed in the fluid passages, respectively, for detecting flowing states of the fluid which flows through the fluid passages.
摘要翻译：基板保持装置保持诸如半导体的基板，并将基板压靠在抛光表面上。基板保持装置包括用于保持基板的顶环体（2），用于向多个压力室（22,23,24,25）供给流体的多个流体通道（33,34,35,36）以及分别设置在流体通道中的多个传感器（S1，S2，S3，S4），用于检测流过流体通道的流体的流动状态。

2. 发明申请

WO2006049269A1 POLISHING APPARATUS 审中-公开
标题翻译：抛光装置
公开(公告)号：WO2006049269A1
公开(公告)日：2006-05-11
申请号：PCT/JP2005/020334
申请日：2005-10-31
申请人： EBARA CORPORATION , NABEYA, Osamu , TOGAWA, Tetsuji , FUKUSHIMA, Makoto , YASUDA, Hozumi
发明人： NABEYA, Osamu , TOGAWA, Tetsuji , FUKUSHIMA, Makoto , YASUDA, Hozumi
IPC分类号： H01L21/304 , B24B37/04
CPC分类号： B24B37/20 , B24B37/005 , B24B37/10 , B24B37/105 , B24B37/30 , B24B37/32 , B24B47/22 , B24B49/00 , B24B49/16
摘要： A polishing apparatus (1) has a polishing pad (22), a top ring (20) for holding a semiconductor wafer (W), a vertical movement mechanism (24) operable to move the top ring (20) in a vertical direction, a distance measuring sensor (46) operable to detect a position of the top ring (20) when a lower surface of the top ring (20) is brought into contact with the polishing pad (22), and a controller (47) operable to calculate an optimal position of the top ring (20) to polish the semiconductor wafer (W) based on the position detected by the distance measuring sensor (46). The vertical movement mechanism (24) includes a ball screw mechanism (30, 32, 38, 42) operable to move the top ring (20) to the optimal position.
摘要翻译：抛光装置（1）具有抛光垫（22），用于保持半导体晶片（W）的顶环（20），可垂直移动顶环（20）的垂直移动机构（24）距离测量传感器（46），当所述顶环（20）的下表面与所述抛光垫（22）接触时，可操作以检测所述顶环（20）的位置;以及控制器（47），其可操作以基于由距离测量传感器（46）检测到的位置，计算顶环（20）的最佳位置以对半导体晶片（W）进行抛光。垂直运动机构（24）包括可操作以将顶环（20）移动到最佳位置的滚珠丝杆机构（30,32,38,42）。

3. 发明申请

WO2006062232A1 SUBSTRATE HOLDING DEVICE AND POLISHING APPARATUS 审中-公开
标题翻译：基板保持装置和抛光装置
公开(公告)号：WO2006062232A1
公开(公告)日：2006-06-15
申请号：PCT/JP2005/022735
申请日：2005-12-06
申请人： EBARA CORPORATION , TOGAWA, Tetsuji , YOSHIDA, Hiroshi , NABEYA, Osamu , FUKUSHIMA, Makoto , FUKAYA, Koichi
发明人： TOGAWA, Tetsuji , YOSHIDA, Hiroshi , NABEYA, Osamu , FUKUSHIMA, Makoto , FUKAYA, Koichi
IPC分类号： B24B37/00 , B24B37/04 , H01L21/304
CPC分类号： B24B37/30
摘要： A substrate holding device according to the present invention includes an elastic membrane to be brought into contact with a rear surface of a substrate, an attachment member for securing at least a portion of the elastic membrane, and a retainer ring for holding a peripheral portion of the substrate while in contact with the elastic membrane. The elastic membrane comprises at least one projecting portion, and the attachment member comprises at least one engagement portion engaging side surfaces of the at least one projecting portion of the elastic membrane. The elastic membrane further comprises bellows portions expandable in a pressing direction so as to allow the elastic membrane to press the substrate, and contractible along the pressing direction.
摘要翻译：根据本发明的基板保持装置包括与基板的后表面接触的弹性膜，用于固定弹性膜的至少一部分的安装构件和用于保持弹性膜的周边部分的保持环该基底与弹性膜接触。弹性膜包括至少一个突出部分，并且附接构件包括接合弹性膜的至少一个突出部分的侧表面的至少一个接合部分。弹性膜还包括沿挤压方向可膨胀的波纹管部，以使弹性膜按压基板，并沿着挤压方向收缩。

4. 发明申请

WO2003072306A1 POLISHING APPARATUS AND METHOD FOR DETECTING FOREIGN MATTER ON POLISHING SURFACE 审中-公开
标题翻译：用于检测抛光表面外观的抛光装置和方法
公开(公告)号：WO2003072306A1
公开(公告)日：2003-09-04
申请号：PCT/JP2003/002233
申请日：2003-02-27
申请人： EBARA CORPORATION , NABEYA, Osamu , TOGAWA, Tetsuji
发明人： NABEYA, Osamu , TOGAWA, Tetsuji
IPC分类号： B24B49/12
CPC分类号： B24B37/005 , B24B49/12
摘要： A polishing apparatus 110 which comprises a polishing tool 1 having a polishing surface, and a holder means (top ring 4) for holding a semiconductor wafer (a substrate) W. Polishing apparatus 110 further comprises color CCD camera 10 for taking a color image of a region on the polishing surface; image processor means 40 for determining whether or not any foreign matter exists on the polishing surface based on a condition of a color in the color image data acquired by color CCD camera 10, and apparatus operation control section 45 which in response to the determination of image processing section 40, stops the relative movement between semiconductor wafer W and the polishing surface and separates top ring 4 and the polishing surface from each other.
摘要翻译：抛光装置110，其包括具有抛光表面的抛光工具1和用于保持半导体晶片（基板）W的保持器装置（顶环4）。抛光装置110还包括彩色CCD照相机10，用于拍摄彩色图像抛光表面上的区域; 图像处理装置40，用于基于由彩色CCD照相机10获取的彩色图像数据中的颜色的条件以及响应于图像的确定的装置操作控制部分45确定抛光表面上是否存在任何异物处理部分40停止半导体晶片W与抛光表面之间的相对运动，并将顶环4和抛光表面彼此分开。

5. 发明申请

WO2009102047A1 POLISHING APPARATUS 审中-公开
标题翻译：抛光装置
公开(公告)号：WO2009102047A1
公开(公告)日：2009-08-20
申请号：PCT/JP2009/052456
申请日：2009-02-09
申请人： EBARA CORPORATION , FUKUSHIMA, Makoto , TOGAWA, Tetsuji , YASUDA, Hozumi , SAITO, Koji , NABEYA, Osamu , INOUE, Tomoshi
发明人： FUKUSHIMA, Makoto , TOGAWA, Tetsuji , YASUDA, Hozumi , SAITO, Koji , NABEYA, Osamu , INOUE, Tomoshi
IPC分类号： B24B37/04
CPC分类号： B24B37/30
摘要： A polishing apparatus is used for polishing a substrate such as a semiconductor wafer to a flat mirror finish. The polishing apparatus includes a polishing table (100) having a polishing surface (101a), a top ring body (2) configured to hold and press a substrate against the polishing surface (101a), and a retainer ring (3) provided at an outer peripheral portion of the top ring body (2) and configured to press the polishing surface (101a). A fulcrum for receiving a lateral force applied from the substrate to the retainer ring (3) during polishing of the substrate is located above a central portion of the substrate.
摘要翻译：抛光装置用于将半导体晶片等基板研磨成平面镜面。抛光装置包括具有抛光面（101a）的抛光台（100），被配置为将基板保持并压靠在抛光表面（101a）上的顶环体（2），以及设置在抛光表面所述顶环体（2）的外周部分构造成按压所述抛光表面（101a）。用于在衬底抛光期间接收从衬底施加到保持环（3）的侧向力的支点位于衬底的中心部分的上方。

6. 发明申请

WO2004070806A1 SUBSTRATE HOLDING APPARATUS AND POLISHING APPARATUS 审中-公开
标题翻译：基板保持装置和抛光装置
公开(公告)号：WO2004070806A1
公开(公告)日：2004-08-19
申请号：PCT/JP2004/001143
申请日：2004-02-04
申请人： EBARA CORPORATION , TOGAWA, Tetsuji , YOSHIDA, Hiroshi , NABEYA, Osamu , FUKUSHIMA, Makoto , FUKAYA, Koichi
发明人： TOGAWA, Tetsuji , YOSHIDA, Hiroshi , NABEYA, Osamu , FUKUSHIMA, Makoto , FUKAYA, Koichi
IPC分类号： H01L21/304
CPC分类号： B24B37/30 , B24B37/32 , B24B49/16
摘要： The present invention relates to a substrate holding apparatus for holding a substrate (W) such as a semiconductor wafer in a polishing apparatus for polishing the substrate to a flat finish. A substrate holding apparatus comprises a vertically movable member (6), and an elastic member (7) for defining a chamber (22). The elastic member (7) comprises a contact portion (8) which is brought into contact with the substrate (W), and a circumferential wall (9) extending upwardly from the contact portion (8) and connected to the vertically movable member (6). The circumferential wall (9) has a stretchable and contractible portion (40) which is stretchable and contractible vertically.
摘要翻译：本发明涉及一种用于将基板（W）例如半导体晶片保持在用于将基板抛光到抛光装置的平面光洁度的基板保持装置。基板保持装置包括可垂直移动的构件（6）和用于限定腔室（22）的弹性构件（7）。弹性构件（7）包括与基板（W）接触的接触部分（8）和从接触部分（8）向上延伸并连接到可垂直移动的部件（6）的周壁（9））。周壁（9）具有可伸缩的部分（40），其可垂直伸缩。

7. 发明申请

WO2003006206A1 SUBSTRATE POLISHING MACHINE 审中-公开
标题翻译：基板抛光机
公开(公告)号：WO2003006206A1
公开(公告)日：2003-01-23
申请号：PCT/JP2002/006979
申请日：2002-07-10
申请人： EBARA CORPORATION , TOGAWA, Tetsuji , NOJI, Ikutaro , NAMIKI, Keisuke , YASUDA, Hozumi , KOJIMA, Shunichiro , SAKURAI, Kunihiko , TAKADA, Nobuyuki , NABEYA, Osamu , FUKUSHIMA, Makoto , TAKAYANAGI, Hideki
发明人： TOGAWA, Tetsuji , NOJI, Ikutaro , NAMIKI, Keisuke , YASUDA, Hozumi , KOJIMA, Shunichiro , SAKURAI, Kunihiko , TAKADA, Nobuyuki , NABEYA, Osamu , FUKUSHIMA, Makoto , TAKAYANAGI, Hideki
IPC分类号： B24B37/04
CPC分类号： B24B37/30 , B24B37/32
摘要： There is provided a substrate polishing machine which comprises a polishing surface and a substrate carrier for holding a substrate and bringing it into contact with the polishing surface. The substrate carrier comprises a carrier body, a substrate holding member for holding a substrate with a surface of the substrate to be polished being directed towards the polishing surface. The substrate holding member is mounted on the carrier body in such a manner that the substrate holding member is movable both towards and away from the polishing surface. The substrate polishing machine further comprises a substrate holding member positioning device provided on a side of the substrate holding member opposite to that used for holding the substrate. The substrate holding member positioning device has a flexible member which defines a chamber, and which, upon introduction of a non-compressible fluid, is expanded in a direction towards the polishing surface.
摘要翻译：提供了一种衬底抛光机，其包括抛光表面和用于保持衬底并使其与抛光表面接触的衬底载体。基板载体包括载体主体，用于将待研磨的基板的表面保持在基板上的基板保持部件朝向研磨面。衬底保持构件以使得衬底保持构件能够朝向和远离抛光表面移动的方式安装在载体主体上。基板研磨机还包括基板保持部件定位装置，该基板保持部件定位装置设置在基板保持部件的与保持基板相同的一侧。衬底保持构件定位装置具有限定腔室的柔性构件，并且在引入不可压缩流体时沿朝向抛光表面的方向膨胀。

8. 发明申请

WO2010021297A1 METHOD AND APPARATUS FOR POLISHING A SUBSTRATE 审中-公开
标题翻译：抛光衬底的方法和装置
公开(公告)号：WO2010021297A1
公开(公告)日：2010-02-25
申请号：PCT/JP2009/064319
申请日：2009-08-07
申请人： EBARA CORPORATION , FUKUSHIMA, Makoto , TOGAWA, Tetsuji , SAITO, Shingo , INOUE, Tomoshi
发明人： FUKUSHIMA, Makoto , TOGAWA, Tetsuji , SAITO, Shingo , INOUE, Tomoshi
IPC分类号： B24B37/04 , H01L21/304
CPC分类号： B24B37/20 , B24B37/005 , B24B37/042 , B24B37/32 , B24B49/10 , B24B49/12
摘要： A polishing method is used for polishing a substrate such as a semiconductor wafer to a flat mirror finish. A method of polishing a substrate by a polishing apparatus includes a polishing table (100) having a polishing surface, a top ring (1) for holding a substrate and pressing the substrate against the polishing surface, and a vertically movable mechanism (24) for moving the top ring (1) in a vertical direction. The top ring (1) is moved to a first height before the substrate is pressed against the polishing surface, and then the top ring (1) is moved to a second height after the substrate is pressed against the polishing surface.
摘要翻译：抛光方法用于将半导体晶片等基板研磨成平面镜面。通过研磨装置研磨基板的方法包括具有研磨面的研磨台（100），用于保持基板并将基板压靠在研磨面上的顶环（1），以及可升降机构沿垂直方向移动顶环（1）。在将衬底压靠在抛光表面之前，将顶环（1）移动到第一高度，然后在衬底被压靠在抛光表面上之后将顶环（1）移动到第二高度。

9. 发明申请

WO2004113020A1 SUBSTRATE POLISHING APPARATUS AND SUBSTRATE POLISHING METHOD 审中-公开
标题翻译：基板抛光装置和底板抛光方法
公开(公告)号：WO2004113020A1
公开(公告)日：2004-12-29
申请号：PCT/JP2004/008855
申请日：2004-06-17
申请人： EBARA CORPORATION , TOGAWA, Tetsuji , FUKAYA, Koichi , TADA, Mitsuo , TAKAHASHI, Taro , SUTO, Yasunari
发明人： TOGAWA, Tetsuji , FUKAYA, Koichi , TADA, Mitsuo , TAKAHASHI, Taro , SUTO, Yasunari
IPC分类号： B24B37/00
CPC分类号： B24B37/013 , B24B49/105 , B24B49/12 , B24B49/16
摘要： The present invention relates to a substrate polishing apparatus and a substrate polishing method for polishing a substrate such as a semiconductor wafer to a flat finish. The substrate polishing apparatus includes a polishing table (100) having a polishing surface (101), a substrate holder (1) for holding and pressing a substrate (W) against the polishing surface (101) of the polishing table (100), and a film thickness measuring device (200) for measuring a thickness of a film on the substrate (W). The substrate holder (1) has a plurality of pressure adjustable chambers (22 to 25), and pressures in the respective chambers (22 to 25) are adjusted based on the film thickness measured by the film thickness measuring device (200).
摘要翻译：本发明涉及一种用于将诸如半导体晶片的基板抛光到平整的基板抛光装置和基板抛光方法。基板研磨装置具备：具有抛光面（101）的研磨台（100），将基板（W）保持并压靠在研磨台（100）的研磨面（101）上的基板保持架（1），以及用于测量衬底（W）上的膜的厚度的膜厚测量装置（200）。衬底保持器（1）具有多个压力可调节室（22〜25），并且基于由膜厚测量装置（200）测量的膜厚调节各个室（22至25）中的压力。

10. 发明申请

WO2003077296A1 DEHYDRATION DRYING METHOD AND APPARATUS, AND SUBSTRATE PROCESSING APPARATUS 审中-公开
标题翻译：脱水干燥方法和装置，以及基板加工装置
公开(公告)号：WO2003077296A1
公开(公告)日：2003-09-18
申请号：PCT/JP2003/002553
申请日：2003-03-05
申请人： EBARA CORPORATION , ATO, Koji , TOGAWA, Tetsuji
发明人： ATO, Koji , TOGAWA, Tetsuji
IPC分类号： H01L21/304
CPC分类号： H01L21/67034 , F26B5/04 , F26B25/063 , H01L21/02052 , H01L21/3105 , H01L21/31695
摘要： A dehydration drying method dehydrates and dries a substrate. The substrate (15) is dehydrated and dried without being rotated while the substrate (15) is accommodated in a carrier (10) operable to carry the substrate (15) between apparatuses for carrying out certain processes.
摘要翻译：脱水干燥方法使基材脱水并干燥。基板（15）被脱水和干燥而不旋转，同时基板（15）容纳在可操作以将基板（15）承载在用于执行某些处理的装置之间的载体（10）中。

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