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1. 发明申请

US20110013668A1 SEMICONDUCTOR CIRCUIT ARRANGEMENT AND ASSOCIATED METHOD FOR TEMPERATURE DETECTION 审中-公开
标题翻译：半导体电路布置及相关的温度检测方法
公开(公告)号：US20110013668A1
公开(公告)日：2011-01-20
申请号：US12888528
申请日：2010-09-23
申请人： Christian Pacha , Thomas Schulz , Klaus Von Arnim
发明人： Christian Pacha , Thomas Schulz , Klaus Von Arnim
IPC分类号： G01K7/01 , H01L29/74 , H01L27/06
CPC分类号： G01K7/015 , H01L27/0727 , H01L27/1203 , H01L29/78606 , H01L2924/0002 , H01L2924/00
摘要： A semiconductor circuit arrangement and a method for temperature detection is disclosed. One embodiment includes a semiconductor substrate, on which is formed a first insulating layer and thereon a thin active semiconductor region, which is laterally delimited by a second insulating layer. In the active semiconductor region, a first and second doping zone are formed on the surface of the first insulating layer for the definition of a channel zone, wherein there is formed at the surface of the channel zone a gate dielectric and thereon a control electrode for the realization of a field effect transistor. In the active semiconductor region, a diode doping zone is formed on the surface of the first insulating layer, which zone realizes a measuring diode via a diode side area with the first or second doping zone and is delimited by the second insulating layer at its further side areas.
摘要翻译：公开了半导体电路装置和温度检测方法。一个实施例包括半导体衬底，其上形成有由第二绝缘层横向界定的第一绝缘层和其上的薄的有源半导体区域。在有源半导体区域中，在第一绝缘层的表面上形成第一和第二掺杂区，用于定义沟道区，其中在沟道区的表面形成栅极电介质，并且在其上形成控制电极实现场效应晶体管。在有源半导体区域中，在第一绝缘层的表面上形成二极管掺杂区，该区通过具有第一或第二掺杂区的二极管侧区实现测量二极管，并且在其另外的第二绝缘层处限定第二绝缘层边区。

2. 发明申请

US20070284576A1 SEMICONDUCTOR CIRCUIT ARRANGEMENT AND ASSOCIATED METHOD FOR TEMPERATURE DETECTION 审中-公开
标题翻译：半导体电路布置及相关的温度检测方法
公开(公告)号：US20070284576A1
公开(公告)日：2007-12-13
申请号：US11689886
申请日：2007-03-22
申请人： Christian Pacha , Thomas Schulz , Klaus Von Arnim
发明人： Christian Pacha , Thomas Schulz , Klaus Von Arnim
IPC分类号： H01L25/07 , H01L21/66
CPC分类号： G01K7/015 , H01L27/0727 , H01L27/1203 , H01L29/78606 , H01L2924/0002 , H01L2924/00
摘要： A semiconductor circuit arrangement and a method for temperature detection is disclosed. One embodiment includes a semiconductor substrate, on which is formed a first insulating layer and thereon a thin active semiconductor region, which is laterally delimited by a second insulating layer. In the active semiconductor region, a first and second doping zone are formed on the surface of the first insulating layer for the definition of a channel zone, wherein there is formed at the surface of the channel zone a gate dielectric and thereon a control electrode for the realization of a field effect transistor. In the active semiconductor region, a diode doping zone is formed on the surface of the first insulating layer, which zone realizes a measuring diode via a diode side area with the first or second doping zone and is delimited by the second insulating layer at its further side areas.
摘要翻译：公开了半导体电路装置和温度检测方法。一个实施例包括半导体衬底，其上形成有由第二绝缘层横向界定的第一绝缘层和其上的薄的有源半导体区域。在有源半导体区域中，在第一绝缘层的表面上形成第一和第二掺杂区，用于定义沟道区，其中在沟道区的表面形成栅极电介质，并且在其上形成控制电极实现场效应晶体管。在有源半导体区域中，在第一绝缘层的表面上形成二极管掺杂区，该区通过具有第一或第二掺杂区的二极管侧区实现测量二极管，并且在其另外的第二绝缘层处限定第二绝缘层边区。

3. 发明授权

US07879727B2 Method of fabricating a semiconductor device including a pattern of line segments 有权
标题翻译：制造包括线段图案的半导体器件的方法
公开(公告)号：US07879727B2
公开(公告)日：2011-02-01
申请号：US12354480
申请日：2009-01-15
申请人： Sergei Postnikov , Thomas Schulz , Hans-Joachim Barth , Klaus von Arnim
发明人： Sergei Postnikov , Thomas Schulz , Hans-Joachim Barth , Klaus von Arnim
IPC分类号： H01L21/311
CPC分类号： H01L27/11 , G03F7/40 , G03F7/7035 , H01L21/32139
摘要： A method of fabricating a semiconductor device including depositing a hardmask layer on a layer of the semiconductor device, selectively etching a pattern of continuous lines in the hardmask layer, depositing an antireflective coating over remaining portions of the hardmask layer, depositing a photoresist layer on the antireflective coating, patterning the photoresist layer with a plurality of isolation trenches via a lithography process, each of the isolation trenches extending perpendicular to and crossing portions of at least one of the continuous lines of the underlying hardmask layer, and with each isolation trench having an initial width. The method further includes reducing the width of each of the isolation trenches from the initial width to desired width via a shrinking process, etching the antireflective coating underlying the isolation trenches to expose intersecting portions of the underlying continuous lines, and etching the exposed intersecting portions of the underlying continuous lines of the hardmask layer to form a pattern of line segments having line ends separated by the desired width.
摘要翻译：一种制造半导体器件的方法，包括在半导体器件的层上沉积硬掩模层，选择性地蚀刻硬掩模层中的连续线的图案，在硬掩模层的剩余部分上沉积抗反射涂层，将光致抗蚀剂层沉积在抗反射涂层，通过光刻工艺用多个隔离沟槽图案化光致抗蚀剂层，每个隔离沟槽垂直于并交叉下层硬掩模层的至少一条连续线的部分延伸，并且每个隔离沟槽具有初始宽度。该方法还包括通过收缩过程将每个隔离沟槽的宽度从初始宽度减小到期望宽度，蚀刻隔离沟槽下方的抗反射涂层以暴露下面的连续线的相交部分，并蚀刻暴露的相交部分硬掩模层的下面的连续线以形成具有以期望宽度分隔的线端部的线段的图案。

4. 发明申请

US20090209097A1 METHOD OF FORMING INTERCONNECTS 审中-公开
标题翻译：形成互连的方法
公开(公告)号：US20090209097A1
公开(公告)日：2009-08-20
申请号：US12032295
申请日：2008-02-15
申请人： Thomas Schulz , Sergei Postnikov , Hans-Joachim Barth , Klaus von Arnim
发明人： Thomas Schulz , Sergei Postnikov , Hans-Joachim Barth , Klaus von Arnim
IPC分类号： H01L21/4763
CPC分类号： H01L21/76816 , H01L21/0273 , H01L21/0338 , H01L21/31144
摘要： A method of forming interconnects includes etching a first set of openings in a hard mask using a first photo resist layer with a first pattern of openings as a first etch mask, and etching a second set of openings in the hard mask using a second photo resist layer with a second pattern of openings as a second etch mask. The method includes shrinking the openings in at least one of the first pattern and the second pattern prior to etching the openings in the hard mask.
摘要翻译：一种形成互连的方法包括使用具有第一开口图案的第一光致抗蚀剂层作为第一蚀刻掩模蚀刻在硬掩模中的第一组开口，以及使用第二光致抗蚀剂蚀刻硬掩模中的第二组开口层，其具有作为第二蚀刻掩模的第二开口图案。该方法包括在蚀刻硬掩模中的开口之前收缩第一图案和第二图案中的至少一个中的开口。

5. 发明申请

US20100176479A1 METHOD OF FABRICATING A SEMICONDUCTOR DEVICE 有权
标题翻译：制造半导体器件的方法
公开(公告)号：US20100176479A1
公开(公告)日：2010-07-15
申请号：US12354480
申请日：2009-01-15
申请人： Sergei Postnikov , Thomas Schulz , Hans-Joachim Barth , Klaus von Arnim
发明人： Sergei Postnikov , Thomas Schulz , Hans-Joachim Barth , Klaus von Arnim
IPC分类号： H01L29/68 , H01L21/762
CPC分类号： H01L27/11 , G03F7/40 , G03F7/7035 , H01L21/32139
摘要： A method of fabricating a semiconductor device including depositing a hardmask layer on a layer of the semiconductor device, selectively etching a pattern of continuous lines in the hardmask layer, depositing an antireflective coating over remaining portions of the hardmask layer, depositing a photoresist layer on the antireflective coating, patterning the photoresist layer with a plurality of isolation trenches via a lithography process, each of the isolation trenches extending perpendicular to and crossing portions of at least one of the continuous lines of the underlying hardmask layer, and with each isolation trench having an initial width. The method further includes reducing the width of each of the isolation trenches from the initial width to desired width via a shrinking process, etching the antireflective coating underlying the isolation trenches to expose intersecting portions of the underlying continuous lines, and etching the exposed intersecting portions of the underlying continuous lines of the hardmask layer to form a pattern of line segments having line ends separated by the desired width.
摘要翻译：一种制造半导体器件的方法，包括在半导体器件的层上沉积硬掩模层，选择性地蚀刻硬掩模层中的连续线的图案，在硬掩模层的剩余部分上沉积抗反射涂层，将光致抗蚀剂层沉积在抗反射涂层，通过光刻工艺用多个隔离沟槽图案化光致抗蚀剂层，每个隔离沟槽垂直于并交叉下层硬掩模层的至少一条连续线的部分延伸，并且每个隔离沟槽具有初始宽度。该方法还包括通过收缩过程将每个隔离沟槽的宽度从初始宽度减小到期望宽度，蚀刻隔离沟槽下方的抗反射涂层以暴露下面的连续线的相交部分，并蚀刻暴露的相交部分硬掩模层的下面的连续线以形成具有以期望宽度分隔的线端部的线段的图案。

6. 发明授权

US07820505B2 Integrated circuit arrangement with capacitor and fabrication method 有权
标题翻译：具有电容器的集成电路布置及其制造方法
公开(公告)号：US07820505B2
公开(公告)日：2010-10-26
申请号：US11862640
申请日：2007-09-27
申请人： Ralf Brederlow , Jessica Hartwich , Christian Pacha , Wolfgang Rösner , Thomas Schulz
发明人： Ralf Brederlow , Jessica Hartwich , Christian Pacha , Wolfgang Rösner , Thomas Schulz
IPC分类号： H01L21/8242
CPC分类号： H01L29/785 , H01L21/845 , H01L27/0629 , H01L27/108 , H01L27/10805 , H01L27/10823 , H01L27/10826 , H01L27/1085 , H01L27/10873 , H01L27/10876 , H01L27/10879 , H01L27/1211 , H01L27/13 , H01L28/60 , H01L29/66795
摘要： An integrated circuit arrangement contains an insulating region, which is part of a planar insulating layer, and a capacitor which contains: near and far electrode regions near and remote from the insulating region and a dielectric region. The capacitor and an active component are on the same side of the insulating layer, and the near electrode region and an active region of the component are planar and parallel to the insulating layer. The near electrode region is monocrystalline and contains multiple webs. Alternately, a FET is present in which: a channel region is the active region, the FET contains a web with opposing control electrodes connected by a connecting region that is isolated from the channel region by a thick insulating region. The thick insulating region is thicker than control electrode insulation regions. The control electrodes contain the same material as the far electrode region.
摘要翻译：集成电路装置包括作为平面绝缘层的一部分的绝缘区域和包含：靠近和远离绝缘区域的近远电极区域和电介质区域的电容器。电容器和有源部件位于绝缘层的同一侧，并且组件的近电极区域和有源区域是平面的并且平行于绝缘层。近电极区域是单晶体并且包含多个网状物。或者，存在FET，其中沟道区域是有源区域，FET包含具有相对的控制电极的幅材，该栅极通过由沟道区域与厚绝缘区域隔离的连接区域连接。厚的绝缘区域比控制电极绝缘区域厚。控制电极含有与远电极区域相同的材料。

7. 发明申请

US20080038888A1 INTEGRATED CIRCUIT ARRANGEMENT WITH CAPACITOR AND FABRICATION METHOD 有权
标题翻译：集成电路与电容器和制造方法的布置
公开(公告)号：US20080038888A1
公开(公告)日：2008-02-14
申请号：US11862640
申请日：2007-09-27
申请人： Ralf Brederlow , Jessica Hartwich , Christian Pacha , Wolfgang Rosner , Thomas Schulz
发明人： Ralf Brederlow , Jessica Hartwich , Christian Pacha , Wolfgang Rosner , Thomas Schulz
IPC分类号： H01L21/8242
CPC分类号： H01L29/785 , H01L21/845 , H01L27/0629 , H01L27/108 , H01L27/10805 , H01L27/10823 , H01L27/10826 , H01L27/1085 , H01L27/10873 , H01L27/10876 , H01L27/10879 , H01L27/1211 , H01L27/13 , H01L28/60 , H01L29/66795
摘要： An integrated circuit arrangement contains an insulating region, which is part of a planar insulating layer, and a capacitor which contains: near and far electrode regions near and remote from the insulating region and a dielectric region. The capacitor and an active component are on the same side of the insulating layer, and the near electrode region and an active region of the component are planar and parallel to the insulating layer. The near electrode region is monocrystalline and contains multiple webs. Alternately, a FET is present in which: a channel region is the active region, the FET contains a web with opposing control electrodes connected by a connecting region that is isolated from the channel region by a thick insulating region. The thick insulating region is thicker than control electrode insulation regions. The control electrodes contain the same material as the far electrode region.
摘要翻译：集成电路装置包括作为平面绝缘层的一部分的绝缘区域和包含：靠近和远离绝缘区域的近远电极区域和电介质区域的电容器。电容器和有源部件位于绝缘层的同一侧，并且组件的近电极区域和有源区域是平面的并且平行于绝缘层。近电极区域是单晶体并且包含多个网状物。或者，存在FET，其中沟道区域是有源区域，FET包含具有相对的控制电极的幅材，该栅极通过由沟道区域与厚绝缘区域隔离的连接区域连接。厚的绝缘区域比控制电极绝缘区域厚。控制电极含有与远电极区域相同的材料。

8. 发明授权

US07173302B2 Integrated circuit arrangement having capacitors and having planar transistors and fabrication method 有权
标题翻译：具有电容器并具有平面晶体管和制造方法的集成电路装置
公开(公告)号：US07173302B2
公开(公告)日：2007-02-06
申请号：US10531493
申请日：2003-10-10
申请人： Ralf Brederlow , Jessica Hartwich , Christian Pacha , Wolfgang Rösner , Thomas Schulz
发明人： Ralf Brederlow , Jessica Hartwich , Christian Pacha , Wolfgang Rösner , Thomas Schulz
IPC分类号： H01L27/108 , H01L21/8242
CPC分类号： H01L27/1085 , H01L21/84 , H01L27/10805 , H01L27/1203
摘要： An integrated circuit arrangement and method of fabricating the integrated circuit arrangement is described. The integrated circuit arrangement contains an insulating region and a sequence of regions which forms a capacitor. The sequence contains a near electrode region near the insulating region, a dielectric region, and a remote electrode region remote from the insulating region. The insulating region is part of an insulating layer arranged in a plane. The capacitor and an active component are arranged on the same side of the insulating layer and form a memory cell. The near electrode region and an active region of the component are arranged in a plane which lies parallel to the plane in which the insulating layer is arranged. A processor is also contained in the integrated circuit arrangement.
摘要翻译：描述了一种集成电路装置及其制造方法。集成电路装置包含形成电容器的绝缘区域和一系列区域。该序列包含靠近绝缘区域的近电极区域，电介质区域和远离绝缘区域的远程电极区域。绝缘区域是布置在平面中的绝缘层的一部分。电容器和有源部件布置在绝缘层的同一侧上并形成存储单元。组件的近电极区域和有源区域被布置在与布置绝缘层的平面平行的平面中。处理器也包含在集成电路装置中。

9. 发明申请

US20090101975A1 Integrated Circuit Arrangement Comprising a Field Effect Transistor, Especially a Tunnel Field Effect Transistor 有权
标题翻译：包括场效应晶体管，特别是隧道场效应晶体管的集成电路布置
公开(公告)号：US20090101975A1
公开(公告)日：2009-04-23
申请号：US11816822
申请日：2005-12-09
申请人： Juergen Holz , Ronald Kakoschke , Thomas Nirschl , Christian Pacha , Klaus Schruefer , Thomas Schulz , Doris Schmitt-Landsiedel
发明人： Juergen Holz , Ronald Kakoschke , Thomas Nirschl , Christian Pacha , Klaus Schruefer , Thomas Schulz , Doris Schmitt-Landsiedel
IPC分类号： H01L29/02
CPC分类号： H01L27/0886 , H01L21/823418 , H01L21/823462 , H01L27/1052 , H01L27/1203 , H01L29/66795 , H01L29/7391 , H01L29/7392 , H01L29/78 , H01L29/785 , H01L29/7854 , H01L29/7856
摘要： An explanation is given of, inter alia, tunnel field effect transistors having a thicker gate dielectric (GD1) in comparison with other transistors (T2) on the same integrated circuit arrangement (10). As an alternative or in addition, said tunnel field effect transistors have gate regions at mutually remote sides of a channel forming region or an interface between the connection regions (D1, S1) of the tunnel field effect transistor.
摘要翻译：具体地说，具有与同一集成电路装置（10）上的其它晶体管（T2）相比具有较厚栅极电介质（GD1）的隧道场效应晶体管的解释。作为替代或另外，所述隧道场效应晶体管具有在沟道形成区域的相对远侧的栅极区域或隧道场效应晶体管的连接区域（D1，S1）之间的界面。

10. 发明申请

US20060003526A1 Integrated circuit arrangement comprising a capacitor, and production method 有权
标题翻译：包括电容器的集成电路装置和制造方法
公开(公告)号：US20060003526A1
公开(公告)日：2006-01-05
申请号：US10529990
申请日：2003-10-10
申请人： Ralf Brederlow , Jessica Hartwich , Christian Pacha , Wolfgang Rosner , Thomas Schulz
发明人： Ralf Brederlow , Jessica Hartwich , Christian Pacha , Wolfgang Rosner , Thomas Schulz
IPC分类号： H01L21/8242
CPC分类号： H01L29/785 , H01L21/845 , H01L27/0629 , H01L27/108 , H01L27/10805 , H01L27/10823 , H01L27/10826 , H01L27/1085 , H01L27/10873 , H01L27/10876 , H01L27/10879 , H01L27/1211 , H01L27/13 , H01L28/60 , H01L29/66795
摘要： An integrated circuit arrangement contains an insulating region, which is part of a planar insulating layer, and a capacitor which contains: near and far electrode regions near and remote from the insulating region and a dielectric region. The capacitor and an active component are on the same side of the insulating layer, and the near electrode region and an active region of the component are planar and parallel to the insulating layer. The near electrode region is monocrystalline and contains multiple webs. Alternately, a FET is present in which: a channel region is the active region, the FET contains a web with opposing control electrodes connected by a connecting region that is isolated from the channel region by a thick insulating region. The thick insulating region is thicker than control electrode insulation regions. The control electrodes contain the same material as the far electrode region.
摘要翻译：集成电路装置包括作为平面绝缘层的一部分的绝缘区域和包含：靠近和远离绝缘区域的近远电极区域和电介质区域的电容器。电容器和有源部件位于绝缘层的同一侧，并且组件的近电极区域和有源区域是平面的并且平行于绝缘层。近电极区域是单晶体并且包含多个网状物。或者，存在FET，其中沟道区域是有源区域，FET包含具有相对的控制电极的幅材，该栅极通过由沟道区域与厚绝缘区域隔离的连接区域连接。厚的绝缘区域比控制电极绝缘区域厚。控制电极含有与远电极区域相同的材料。

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