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    • 10. 发明授权
    • Silicon-containing polyimide resin and silicon-containing polyamic acid
    • 含硅聚酰亚胺树脂和含硅聚酰胺酸
    • US6001942A
    • 1999-12-14
    • US217075
    • 1998-12-21
    • Masaaki AmakoHaruhiko FurukawaYoshitsugu MoritaHiroshi Ueki
    • Masaaki AmakoHaruhiko FurukawaYoshitsugu MoritaHiroshi Ueki
    • C08G73/10C08G77/455C08G77/04
    • C08G73/1042C08G73/106C08G77/455
    • The invention relates to a silicon-containing polyimide resin comprising (I) 0.1 to 100 mole % of structural units represented by the formula: ##STR1## where Ar.sup.1 is a tetra valent organic group having at least one aromatic ring, R independently represents a monovalent hydrocarbon group free of aliphatic unsaturated bonds, X is selected from an alkyleneoxyalkylene or an alkylene group having 2 or more carbon atoms, Y is an oxygen atom, an alkyleneoxyalkylene group, or an alkylene group having 2 or more carbon atoms, l, m, n are each integers having a value of 1 to 10, p is an integer having a value of 1 to 80, and a is 0 or 1; and (II) 99.9 to 0 mole % of structural units represented by the formula: ##STR2## where Ar.sup.2 is a tetravalent organic group having at least one aromatic ring, and Ar.sup.3 is a divalent organic group having at least one aromatic group.
    • 本发明涉及一种含硅聚酰亚胺树脂,其包含(I)0.1-100摩尔%的由下式表示的结构单元:其中Ar1是具有至少一个芳族环的四价有机基团,R独立地表示一价无烃基团 的脂肪族不饱和键,X选自亚烷氧基亚烷基或碳原子数2以上的亚烷基,Y为氧原子,亚烷基氧化烯基或碳原子数2以上的亚烷基,l,m,n分别为 整数值为1〜10,p为1〜80的整数,a为0或1; 和(II)99.9至0摩尔%的由下式表示的结构单元:其中Ar 2是具有至少一个芳环的四价有机基团,Ar 3是具有至少一个芳族基团的二价有机基团。