基本信息:
- 专利标题： INTEGRATED CIRCUIT PACKAGES TO MINIMIZE STRESS ON A SEMICONDUCTOR DIE
- 申请号：PCT/EP2020/086760 申请日：2020-12-17
- 公开(公告)号：WO2021122987A1 公开(公告)日：2021-06-24
- 发明人： LAKSHMANAN, Ramji Sitaraman , STENSON, Bernard , FITZGERALD, Padraig Liam , KIERSE, Oliver , TWOHIG, Michael James , FLYNN, Michael John , O'SULLIVAN, Laurence Brendan
- 申请人： ANALOG DEVICES INTERNATIONAL UNLIMITED COMPANY
- 申请人地址： Bay F1
- 专利权人： ANALOG DEVICES INTERNATIONAL UNLIMITED COMPANY
- 当前专利权人： ANALOG DEVICES INTERNATIONAL UNLIMITED COMPANY
- 当前专利权人地址： Bay F1
- 代理机构： WITHERS & ROGERS LLP
- 优先权： US16/951,720 2020-11-18
- 主分类号： H01L21/52
- IPC分类号： H01L21/52 ; H01L23/04 ; H01L2224/04 ; H01L2224/0401 ; H01L2224/04042 ; H01L2224/056 ; H01L2224/131 ; H01L2224/16225 ; H01L2224/16227 ; H01L2224/2405 ; H01L2224/24227 ; H01L2224/245 ; H01L2224/2919 ; H01L2224/29294 ; H01L2224/32013 ; H01L2224/32014 ; H01L2224/32225 ; H01L2224/32237 ; H01L2224/33183 ; H01L2224/40225 ; H01L2224/48225 ; H01L2224/48227 ; H01L2224/48463 ; H01L2224/73253 ; H01L2224/73265 ; H01L2224/81207 ; H01L2224/82002 ; H01L2224/82106 ; H01L2224/83192 ; H01L2224/83862 ; H01L2224/83868 ; H01L2224/83871 ; H01L2224/83874 ; H01L2224/85002 ; H01L2224/85005 ; H01L2224/85801 ; H01L2224/9205 ; H01L23/041 ; H01L23/06 ; H01L23/13 ; H01L23/20 ; H01L23/49811 ; H01L23/49833 ; H01L23/49838 ; H01L23/562 ; H01L24/05 ; H01L24/13 ; H01L24/16 ; H01L24/24 ; H01L24/29 ; H01L24/32 ; H01L24/33 ; H01L24/40 ; H01L24/45 ; H01L24/48 ; H01L24/73 ; H01L24/81 ; H01L24/82 ; H01L24/83 ; H01L24/85 ; H01L24/92 ; H01L2924/15153 ; H01L2924/15311 ; H01L2924/16152 ; H01L2924/16196 ; H01L2924/163
摘要：
An integrated circuit package can contain a semiconductor die and provide electrical connections between the semiconductor die and additional electronic components. The integrated circuit package can reduce stress placed on the semiconductor die due to movement of the integrated circuit package due to, for example, temperature changes and/or moisture levels. The integrated circuit package can at least partially mechanically isolate the semiconductor die from the integrated circuit package.
IPC结构图谱:
| H | 电学 |
| --H01 | 基本电气元件 |
| ----H01L | 半导体器件；其他类目未包含的电固体器件 |
| ------H01L21/00 | 专门适用于制造或处理半导体或固体器件或其部件的方法或设备 |
| --------H01L21/02 | .半导体器件或其部件的制造或处理 |
| ----------H01L21/027 | ..未在H01L21/18或H01L21/34组中包含的为进一步的光刻工艺在半导体之上制作掩膜 |
| ------------H01L21/50 | ...应用H01L21/06至H01L21/326中的任一小组都不包含的方法或设备组装半导体器件的 |
| --------------H01L21/52 | ....半导体在容器中的安装 |