基本信息:
- 专利标题: 用於垂直電流金屬沈積之基板固持器
- 专利标题(英):Substrate holder for vertical galvanic metal deposition
- 专利标题(中):用于垂直电流金属沉积之基板固持器
- 申请号:TW104142807 申请日:2015-12-18
- 公开(公告)号:TW201635426A 公开(公告)日:2016-10-01
- 发明人: 芬荳 阿諾夫 , FENDEL, ARNULF , 勞恩布許 瑞夫 , RAUENBUSCH, RALPH , 布森尼爾斯 托比亞斯 , BUSSENIUS, TOBIAS
- 申请人: 德國艾托特克公司 , ATOTECH DEUTSCHLAND GMBH
- 专利权人: 德國艾托特克公司,ATOTECH DEUTSCHLAND GMBH
- 当前专利权人: 德國艾托特克公司,ATOTECH DEUTSCHLAND GMBH
- 代理人: 陳長文
- 优先权: 14199449.1 20141219
- 主分类号: H01L21/687
- IPC分类号: H01L21/687
The present invention is related to a substrate holder for vertical galvanic metal, preferably copper, deposition on a substrate to be treated comprising a first substrate holder part and a second substrate holder part, wherein both substrate holder parts comprise an inner metal comprising part and an outer non-metallic part characterized in that the substrate holder further comprises (i) At least one hanging element in each substrate holder part for mechanically connecting the substrate holder to a treatment container, (ii) At least one first sealing element in each substrate holder part arranged between the substrate to be treated and the respective substrate holder part, (iii) At least one second sealing element for the entire substrate holder arranged between the inner metal comprising part of the substrate holder and the outer non-metallic part of the substrate holder, (iv) At least one fastening system for detachably fastening both substrate holder parts to each other for holding the substrate to be treated, (v) At least one first contact element in each substrate holder part for forwarding current from an outer source through the hanging element to the at least second contact element, and (vi) At least one second contact element in each substrate holder part for forwarding current from the at least first contact element to the substrate to be treated.
公开/授权文献:
- TWI679726B 用於垂直電流金屬沈積之基板固持器 公开/授权日:2019-12-11
信息查询:
EspacenetIPC结构图谱:
H | 电学 |
--H01 | 基本电气元件 |
----H01L | 半导体器件;其他类目未包含的电固体器件 |
------H01L21/00 | 专门适用于制造或处理半导体或固体器件或其部件的方法或设备 |
--------H01L21/67 | .专门适用于在制造或处理过程中处理半导体或电固体器件的装置;专门适合于在半导体或电固体器件或部件的制造或处理过程中处理晶片的装置 |
----------H01L21/683 | ..用于支承或夹紧的 |
------------H01L21/687 | ...使用机械装置的,例如卡盘、夹具或夹子 |