基本信息:
- 专利标题： ＭＥＭＳ 소자의 패키지 및 그 제조방법
- 专利标题（英）：Package of mems device and method for manufacturing the same
- 专利标题（中）：MEMS器件的封装及其制造方法
- 申请号：KR1020060053624 申请日：2006-06-14
- 公开(公告)号：KR100846569B1 公开(公告)日：2008-07-15
- 发明人： 표성규 , 김동준
- 申请人： 매그나칩 반도체 유한회사
- 申请人地址： 충북 청주시 흥덕구 향정동 *
- 专利权人： 매그나칩 반도체 유한회사
- 当前专利权人： 매그나칩 반도체 유한회사
- 当前专利权人地址： 충북 청주시 흥덕구 향정동 *
- 代理人： 특허법인신성
- 主分类号： B81B7/02
- IPC分类号： B81B7/02 ; B81B7/00 ; B81C1/00
WLP(Wafer Level Package), MEMS(Micro-Electro Mechanical Systems)
The present invention is a semiconductor manufacturing plant of the batch process in the application can be in wafer-level package (Wafer Level Package; WLP) to apply MEMS (Micro-Electro Mechanical Systems) element of the package, and a manufacturing method for providing to to that, which for the present invention is a cap wafer and a plurality of bonding the bump formed on the cap wafer, with a plurality of alignment bumps formed by the alignment on the lateral side of the plurality of the bonding bumps, a plurality of first external to the region corresponding to the plurality of alignment bumps the pad is formed to provide a package of a MEMS device including the cap wafer and the alignment during bonding of the bumps and the first external pad, the wafer bonded MEMS device. WLP (Wafer Level Package), MEMS (Micro-Electro Mechanical Systems)
公开/授权文献:
- KR1020070119247A ＭＥＭＳ 소자의 패키지 및 그 제조방법 公开/授权日：2007-12-20
信息查询:
EspacenetIPC结构图谱:
| B | 作业；运输 |
| --B81 | 微观结构技术 |
| ----B81B | 微观结构的装置或系统，例如微观机械装置 |
| ------B81B7/00 | 微观结构系统 |
| --------B81B7/02 | .包括功能上有特定关系的不同的电或光学装置，例如微—电子—机械系统（MEMS） |