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    • 10. 发明申请
    • HOUSING ASSEMBLY, ANTENNA ASSEMBLY, AND ELECTRONIC DEVICE
    • WO2021000703A1
    • 2021-01-07
    • PCT/CN2020/095160
    • 2020-06-09
    • GUANGDONG OPPO MOBILE TELECOMMUNICATIONS CORP., LTD.
    • JIA, Yuhu
    • H01Q1/24H01Q15/08
    • A housing assembly (100), an antenna assembly (10), and an electronic device (1) are provided according to the present disclosure. The housing assembly (100) includes a dielectric substrate (110) and a radio-wave transparent structure (120). The dielectric substrate (110) has a first transmittance for a radio frequency signal in a preset frequency band. The radio-wave transparent structure (120) includes a first radio-wave transparent layer (121) and a second radio-wave transparent layer (122) coupled with the first radio-wave transparent layer (121). The first radio-wave transparent layer (121) and the second radio-wave transparent layer (122) are indirectly stacked together, and the radio-wave transparent structure (120) at least partially covers the dielectric substrate (110). A region of the housing assembly (100) corresponding to the radio-wave transparent structure (120) has a second transmittance for the radio frequency signal in the preset frequency band, and the second transmittance is larger than the first transmittance. The housing assembly (100) according to the present disclosure is provided with the radio-wave transparent structure (120) disposed on the dielectric substrate (110). An improved transmittance for the radio frequency signal in the preset frequency band is achieved through an interaction between the first radio-wave transparent layer (121) and the second radio-wave transparent layer (122) of the radio-wave transparent structure (120). When the housing assembly (100) is applied to an electronic device (10), the effect of the housing assembly (100) on performance of an antenna module (200) disposed in the housing assembly (100) can be reduced, thereby improving communication performance of the electronic device (10).