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1. 发明申请

WO1996002952A2 TEMPERATURE-COMPENSATED COMBINER 审中-公开
标题翻译：温度补偿组合
公开(公告)号：WO1996002952A2
公开(公告)日：1996-02-01
申请号：PCT/FI1995000404
申请日：1995-07-17
申请人： NOKIA TELECOMMUNICATIONS OY , PIIRAINEN, Risto
发明人： NOKIA TELECOMMUNICATIONS OY
IPC分类号： H01P01/30
CPC分类号： H01P5/12 , H01P7/04 , H01P7/06
摘要： The present invention relates to a temperature-compensated combiner comprising a control rod disposed (2) in a combiner housing (1) for controlling the middle frequency; a resonator tube (3) secured to the housing and coaxially disposed around the control rod; a regulating cup (4) arranged at that end of the control rod which faces the housing; a motor (6) which controls the middle frequency and which is arranged at one end of the control rod; and a temperature-compensating tube (5) for compensating for longitudinal changes exhibited by the unit consisting of the control rod, the resonator tube and the regulating cup for changes in temperature, said tube being positioned within the resonator tube (3) and secured to that end of the resonator tube which faces the housing and to the frame of the motor (6). The regulating cup (4) is fitted to the control rod (2) with two sleeves (9, 10) which are positioned one within the other and made of different materials, a first sleeve (9) being attached around the control rod to that end of the control rod (2) which faces the regulating cup, and a second sleeve (10) being attached to that end of the first sleeve (9) which faces away from the regulating cup and to the regulating cup around the first sleeve. The sleeves (9, 10) form additional temperature-compensating means, whereby the motor (6) controlling the middle frequency can be positioned entirely within the resonator tube (3).
摘要翻译：温度补偿组合器技术领域本发明涉及一种温度补偿组合器，包括：控制杆，设置在组合器壳体（1）中，用于控制中频; 固定在所述壳体上且同轴地设置在所述控制棒周围的谐振器管（3）调节杯（4），其布置在所述控制杆的面向所述壳体的所述端部处; 控制中频的马达（6），并布置在控制杆的一端; 以及用于补偿由控制杆，谐振器管和用于温度变化的调节杯组成的单元所呈现的纵向变化的温度补偿管（5），所述管定位在谐振管（3）内并固定到谐振器管的面向壳体和电动机（6）的框架的端部。调节杯（4）通过两个套筒（9,10）装配到控制杆（2），两个套筒（9,10）一个位于另一个内并由不同的材料制成，第一套筒（9）围绕控制杆附接到该套筒所述控制杆（2）的面向所述调节杯的端部;以及第二套筒（10），所述第二套筒（10）附接到所述第一套筒（9）的远离所述调节杯的端部以及围绕所述第一套筒的所述调节杯。套筒（9,10）形成附加的温度补偿装置，由此控制中频的电动机（6）可以完全位于谐振管（3）内。

2. 发明申请

WO1995011529A1 TEMPERATURE-COMPENSATED COMBINER 审中-公开
标题翻译：温度补偿组合
公开(公告)号：WO1995011529A1
公开(公告)日：1995-04-27
申请号：PCT/FI1994000470
申请日：1994-10-19
申请人： NOKIA TELECOMMUNICATIONS OY , HIETALA, Arto
发明人： NOKIA TELECOMMUNICATIONS OY
IPC分类号： H01P01/30
CPC分类号： H01P1/30
摘要： The invention relates to a temperature-compensated combiner comprising a control rod (12) disposed in a combiner housing (11) for controlling the center frequency; a conductor tube (13) secured to the housing and coaxially disposed around the control rod; a regulating tube (14) which is attached to the inner end of the control rod and which is coaxial with the control rod and the conductor tube; and temperature-compensation means (15) for compensating for longitudinal changes exhibited by the unit consisting of the control rod, the conductor tube and the regulating tube for changes in temperature. To reduce the length of the combiner, the temperature-compensation means comprise a temperature-compensation tube (15) which moves the control rod (12) in proportion to variations in temperature and which is disposed within the conductor tube (13) and secured to the inner end of the conductor tube (13).
摘要翻译：本发明涉及一种温度补偿组合器，其包括设置在组合器壳体（11）中用于控制中心频率的控制杆（12）导体管（13），其固定到所述壳体并同轴地设置在所述控制棒周围; 调节管（14），其连接到所述控制棒的内端并与所述控制棒和所述导体管同轴; 以及温度补偿装置（15），用于补偿由控制杆，导体管和调节管组成的由温度变化所表现的纵向变化。为了减小组合器的长度，温度补偿装置包括温度补偿管（15），该温度补偿管（15）与控制杆（12）成比例地与温度变化成比例地移动，并且设置在导体管（13）内并固定到导体管（13）的内端。

3. 发明申请

WO1981003087A1 TEMPERATURE-STABLE MICROWAVE INTEGRATED CIRCUIT DELAY LINE 审中-公开
标题翻译：温度稳定的微波集成电路延迟线
公开(公告)号：WO1981003087A1
公开(公告)日：1981-10-29
申请号：PCT/US1981000543
申请日：1981-04-27
申请人： COMMUNICATIONS SATELLITE CORP
发明人： COMMUNICATIONS SATELLITE CORP , LEE Y
IPC分类号： H01P01/30
CPC分类号： H01P1/30 , H01P9/006
摘要： A temperature-stable microwave integrated circuit (MIC) delay line (10) employs at least two cascade connected dielectric substrates (12, 14), for example, a high dielectric barium tetratitanate (Ba- Ti u0 u) ceramic microstrip (22), and a short sapphire single crystal Al u0 u microstrip section (26). Temperature changes in the transmission phase are compensated for by selecting the substrate materials such that the positive transmission phase temperature coefficient of one substrate is effectively cancelled out by the negative transmission phase temperature coefficient of the other sub-strate. In this manner, the transmission delay temperature coefficient of the composite delay line may be reduced to a value of 0.6(+/- 0.3) x 10- 6 parts per degree C. at 14 GHz over the temperature range of 20 degrees C. +/- 30 degrees C.
摘要翻译：温度稳定的微波集成电路（MIC）延迟线（10）使用至少两个级联的电介质基板（12,14），例如高介电四钛酸钡（Ba-Ti u u u）陶瓷微带线（22）和短蓝宝石单晶Aluu U微带部分（26）。通过选择基板材料来补偿透射相位的温度变化，使得一个基板的正透射相位温度系数被其他子图的负透射相位温度系数有效抵消。以这种方式，复合延迟线的传输延迟温度系数可以在20摄氏度的温度范围内降低到14GHz的0.6（+/- 0.3）×10 -6度/℃的值。+ / - 30摄氏度

4. 发明申请

WO1995030251A1 COMPUTERIZED SYSTEM OF PRESSURISATION TO PROTECT WAVEGUIDES AND CABLES 审中-公开
标题翻译：计算机系统的压力保护波形和电缆
公开(公告)号：WO1995030251A1
公开(公告)日：1995-11-09
申请号：PCT/IT1994000148
申请日：1994-09-13
申请人： CRIOTHERM S.R.L. , CANEPA, Raffaele
发明人： CRIOTHERM S.R.L.
IPC分类号： H01P01/30
CPC分类号： H01P1/30
摘要： System of pressurisation for the protection of waveguides and cables with electronic control of processes by means of a personal computer (PC) card and an interface card comprising hardware with an analog section for all the circuits that concern interfacing towards the quantities and the electromechanical components of the pressurization system and a digital section for all the circuits that concern interfacing towards the PC and the analog section, and software with a section that deals with the configuration of the system and a section that operates its actual function in compliance with configuration indications.
摘要翻译：用于通过个人计算机（PC）卡和具有电子控制处理的波导和电缆的加压系统，该接口卡包括具有用于所有电路的模拟部分的硬件，所述电路涉及与数量和机电部件加压系统和用于与PC和模拟部分接口的所有电路的数字部分，以及具有处理系统的配置的部分的软件以及根据配置指示来操作其实际功能的部分。

5. 发明申请

WO1987003745A1 TEMPERATURE COMPENSATED MICROWAVE RESONATOR 审中-公开
标题翻译：温度补偿微波谐振器
公开(公告)号：WO1987003745A1
公开(公告)日：1987-06-18
申请号：PCT/US1986002316
申请日：1986-10-31
申请人： HUGHES AIRCRAFT COMPANY
发明人： HUGHES AIRCRAFT COMPANY , KICH, Rolf
IPC分类号： H01P01/30
CPC分类号： H01P7/06 , H01P1/2082 , H01P1/30
摘要： A microwave resonator which includes a temperature-compensating structure (26) within the resonator cavity (12a) configured to undergo temperature-induced dimensional changes which substantially minimize the resonant frequency change otherwise caused by temperature-induced dimensional changes in the waveguide body cavity. The temperature-compensating structure includes both bowed and cantilevered structures on the cavity endwall (13), as well as structures on the cavity sidewall (11) such as a tuning screw of temperature-responsive varying diameter.

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